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118 条记录 (耗时 0.023 秒)

    Sputtering apparatus with a rotating target
    11.
    发明授权
    Sputtering apparatus with a rotating target 失效
    具有旋转目标的喷射装置

    公开(公告)号：US5213672A

    公开(公告)日：1993-05-25

    申请号：US744511

    申请日：1991-08-13

    申请人： Klaus Hartig ,  Joachim Szczyrbowski

    发明人： Klaus Hartig ,  Joachim Szczyrbowski

    IPC分类号： C23C14/34 ,  H01J37/34

    CPC分类号： H01J37/3441 ,  C23C14/3407 ,  H01J37/3405 ,  H01J37/342 ,  H01J37/3455

    摘要： An apparatus is presented, with a rotating target (18, 15), which is tubularly configured, with a stationary magnet unit (2) disposed within the tube, of a magnetron cathode, which produces a stationary plasma hose provided essentially with two long straight lines in front of the surface of the rotating target, which exercises an erosive action on the surface of the rotating target (18, 15), whereby the formation occurs of a narrowing of the diameter of the tubular rotating target (18, 15) in the middle portion of the tubular rotating target and the formation of margins at the two ends (14, 15) of the tubular rotating target be provided each with a dark-space shield (16, 17) which cover the margins of the tubular rotating target.

    摘要翻译： 本发明提供了一种具有旋转靶（18,15）的旋转靶（18,15），该转动靶（18,15）由设置在管内的固定磁体单元（2）管状地构成，该磁控管阴极产生基本上具有两条长直线 在旋转靶的表面前面的线，其对旋转靶（18,15）的表面进行侵蚀作用，由此形成管状旋转靶（18,15）的直径变窄的形成 管状旋转靶的中间部分和在管状旋转靶的两端（14,15）处形成边缘，每个都设有覆盖管状旋转靶的边缘的暗空间护罩（16,17） 。

    Sputtering apparatus with rotating target and target cooling
    13.
    发明授权
    Sputtering apparatus with rotating target and target cooling 失效
    具有旋转目标和目标冷却的溅射装置

    公开(公告)号：US5262032A

    公开(公告)日：1993-11-16

    申请号：US918142

    申请日：1992-07-23

    申请人： Klaus Hartig ,  Anton Dietrich ,  Joachim Szczyrbowski

    发明人： Klaus Hartig ,  Anton Dietrich ,  Joachim Szczyrbowski

    IPC分类号： C23C14/34 ,  H01J37/34

    CPC分类号： H01J37/3497 ,  C23C14/3407 ,  H01J37/3405

    摘要： A sputtering apparatus is presented, especially one with a magnetron cathode and rotating target (1), and target cooling performed by a liquid coolant, preferably water, in which provision is made for the cooling to be concentrated on the area or areas of the rotating target (1) which are exposed to the heat produced by the plasma (12), and the magnets (28, 29, 30, 31) of the magnet assembly (23) form at least one cooling passage (34, 35).

    摘要翻译： 提出了一种溅射装置，特别是具有磁控管阴极和旋转靶（1）的溅射装置，并且由液体冷却剂（优选水）进行目标冷却，其中提供用于使冷却集中在旋转的区域或区域上 暴露于由等离子体（12）产生的热的靶（1）和磁体组件（23）的磁体（28,29,30,31）形成至少一个冷却通道（34,35）。

    Methods and equipment for depositing coatings having sequenced structures
    19.
    发明授权
    Methods and equipment for depositing coatings having sequenced structures 有权
    用于沉积具有测序结构的涂层的方法和设备

    公开(公告)号：US07534466B2

    公开(公告)日：2009-05-19

    申请号：US11273979

    申请日：2005-11-15

    申请人： Klaus Hartig

    发明人： Klaus Hartig

    IPC分类号： B05D5/06 ,  C23C16/00 ,  B05D1/36

    CPC分类号： C03C17/002 ,  C03C17/3417 ,  C03C17/36 ,  C03C17/3626 ,  C03C17/3644 ,  C03C17/3652 ,  C03C2217/71 ,  C03C2218/365 ,  C23C14/568

    摘要： Methods and equipment are provided for processing sheet-like substrates. The methods and equipment are useful for depositing coatings on both major surfaces of a sheet-like substrate. Also provided are substrates with coatings on both major surfaces. Preferably, the coatings on the opposed major surfaces of a substrate have different structures, yet share a common structural sequence of at least two film regions, and in some embodiments at least three film regions.

    摘要翻译： 提供了用于处理片状基材的方法和设备。 所述方法和设备可用于在片状基底的两个主表面上沉积涂层。 还提供了在两个主表面上具有涂层的基底。 优选地，衬底的相对主表面上的涂层具有不同的结构，但是共享至少两个膜区域的共同结构序列，并且在一些实施方案中共享至少三个膜区域。