公开(公告)号：US5672017A

公开(公告)日：1997-09-30

申请号：US649393

申请日：1996-05-17

申请人： Jun Taniguchi

发明人： Jun Taniguchi

IPC分类号： B41J25/304 ,  B41J2/32 ,  B41J19/18 ,  B41J25/312 ,  B41J2/315

CPC分类号： B41J2/32 ,  B41J19/18 ,  B41J25/312

摘要： A thermal printer which is designed to reduce costs by reducing the number of parts, and which can easily drive a carriage using an inexpensive low-power drive motor by reducing a load acting on the part of the carriage which carries a thermal head. The carriage is provided so as to travel reciprocatively along a platen. A thermal head is directly attached to the opposite side of the carriage to the platen without any intervening member. A biasing member is disposed for urging the carriage toward the platen.

摘要翻译： 一种热敏打印机，其被设计成通过减少部件的数量来降低成本，并且通过减小作用在承载热头的托架的部分上的负载，可以容易地使用廉价的低功率驱动马达驱动托架。 滑架设置成沿着压板往复运动。 热敏头直接连接到托架的相对侧而没有任何中间构件。 偏置构件被设置成用于将托架推向台板。

公开(公告)号：US4814899A

公开(公告)日：1989-03-21

申请号：US96962

申请日：1987-09-21

申请人： John E. Gantzhorn, Jr. ,  John W. McCloud, II ,  Koichi Sota ,  Jun Taniguchi

发明人： John E. Gantzhorn, Jr. ,  John W. McCloud, II ,  Koichi Sota ,  Jun Taniguchi

IPC分类号： G11B5/86 ,  G11B15/00 ,  G11B15/43 ,  G11B15/70 ,  G11B23/12

CPC分类号： G11B15/70 ,  G11B15/00 ,  G11B15/43 ,  G11B23/12 ,  G11B5/865

摘要： A tape transport for driving a continuous master tape and a copy tape through a tape contact printing station at a very high speed. The master tape has a prerecorded signal the reverse image of which is transferred onto the copy tape by the tape contact printing station. The tape transport enables the master and copy tapes to maintain contact and registration with the required degree of accuracy to produce an acceptable signal transfer which generates a high quality video signal for use in home video cassette recorders and viewing equipment.

摘要翻译： 用于以非常高的速度通过带式印刷站驱动连续的母带和复制带的磁带传输。 母带具有预先记录的信号，其反转图像由带式接触印刷台转印到复印带上。 磁带传输使得主和复制磁带能够以所需的准确度保持联系和注册，以产生可接受的信号传输，其产生用于家用录像机和观看设备的高质量视频信号。

公开(公告)号：US20090226754A1

公开(公告)日：2009-09-10

申请号：US12469109

申请日：2009-05-20

申请人： Jun Taniguchi ,  Minoru Ishinabe

发明人： Jun Taniguchi ,  Minoru Ishinabe

IPC分类号： B32B15/00 ,  B32B7/02

CPC分类号： H01L23/3735 ,  H01L23/433 ,  H01L2924/0002 ,  Y10T428/12493 ,  Y10T428/24983 ,  H01L2924/00

摘要： There is provided a thermal conductivity sheet capable of lowering the thermal resistance value of the joint surface more than before in addition to easiness to use, and an electronic device to which the thermal conductivity sheet is applied. Load is applied to the thermal conductivity sheet having a prescribed thickness placed between CPU 10 that is the heat generation parts and the heat sink 11 that is the heat radiation parts. The thermal conductivity sheet has hardness wherein intervals between CPU 10 that is the heat generation parts and the heat sink 11 that is the heat radiation parts narrow more than the prescribed thickness by either of load within the range from 0.01 kgf/cm2 to 5.0 kgf/cm2 with tightening of screw.

摘要翻译： 另外，除了易于使用之外，还提供了能够比以前更多地降低接合面的热阻值的热传导性片和应用导热性片的电子器件。 在作为发热部的CPU10和作为散热部的散热器11之间，将具有规定厚度的导热性片施加负荷。 热导率片具有硬度，其中作为发热部的CPU 10与作为散热部的散热片11之间的间隔通过0.01kgf / cm 2至5.0kgf / cm 2的范围内的任一负载而比规定厚度窄， cm2，拧紧螺丝。

公开(公告)号：US20080055860A1

公开(公告)日：2008-03-06

申请号：US11898254

申请日：2007-09-11

申请人： Jun Taniguchi ,  Hiroki Uchida ,  Hideshi Tokuhira ,  Minoru Ishinabe ,  Masanobu Ishiduka ,  Hiroaki Date ,  Masatomo Asano ,  Nobuhiro Nanri

发明人： Jun Taniguchi ,  Hiroki Uchida ,  Hideshi Tokuhira ,  Minoru Ishinabe ,  Masanobu Ishiduka ,  Hiroaki Date ,  Masatomo Asano ,  Nobuhiro Nanri

IPC分类号： H05K7/20

CPC分类号： H01L23/473 ,  G06F1/203 ,  G06F2200/201 ,  H01L2924/0002 ,  H01L2924/00

摘要： Electronic components differing in height (a CPU 2a, a capacitor 2b, and coil elements 2c) are mounted on a printed circuit board 1. A heat-absorbing member 3 is provided above the printed circuit board 1 in such a way that the member 3 contacts not only the top surface of the CPU 2a that is the shortest but the sides of the capacitor 2b and the coil elements 2c. To circulate a cooling medium, a flow path 4 is formed in the heat-absorbing member 3. Heat generated at the CPU2a is transmitted from its top surface to the cooling medium in the flow path 4 via the heat-absorbing member 3; heat generated at the capacitor 2b and the coil elements 2c is transmitted from their sides to the cooling medium in the flow path 4 via the heat-absorbing member 3.

摘要翻译： 高度不同的电子部件（CPU2a，电容器2b和线圈元件2c）安装在印刷电路板1上。在印刷电路板1的上方设有吸热部件3， 构件3不仅接触CPU2a的最短但电容器2b的侧面和线圈元件2c的顶表面。 为了循环冷却介质，在吸热部件3中形成有流路4.在CPU2a产生的热量经由吸热部件3从流路4的顶面向冷媒介质传递。 在电容器2b和线圈元件2c产生的热量经由吸热部件3从侧面传递到流路4中的冷却介质。

公开(公告)号：US20070000655A1

公开(公告)日：2007-01-04

申请号：US11255952

申请日：2005-10-24

申请人： Hiroki Uchida ,  Hideshi Tokuhira ,  Minoru Ishinabe ,  Hiroaki Date ,  Jun Taniguchi

发明人： Hiroki Uchida ,  Hideshi Tokuhira ,  Minoru Ishinabe ,  Hiroaki Date ,  Jun Taniguchi

IPC分类号： H05K7/20

CPC分类号： G06F1/203 ,  G06F2200/201 ,  G06F2200/203

摘要： To realize a flat heat exchanger with superior stability of the flow path, a heat exchanger for liquid cooling in which a cooling liquid flows inside the heat exchanger includes a pouch made of a water-resistant sheet having an inflow port and an outflow port for the cooling liquid; a heat exchange plate overlapping with the pouch; a presser plate pressing the pouch against the heat exchange plate; wherein protrusions and depressions delimiting a flow path linking the inflow port and the outflow port are formed on the inner side of at least one of the heat exchange plate and the presser plate.

摘要翻译： 为了实现具有优异的流路稳定性的扁平式热交换器，冷却液体在热交换器内部流动的液体冷却用热交换器包括：由具有流入口和流出口的防水片制成的袋， 冷却液 与所述袋重叠的热交换板; 压板压住热交换板; 其特征在于，在所述热交换板和所述压板的至少一个的内侧形成有限定连通所述流入口和所述流出口的流路的突起和凹部。

公开(公告)号：US20060133032A1

公开(公告)日：2006-06-22

申请号：US11085483

申请日：2005-03-22

申请人： Hiroki Uchida ,  Jun Taniguchi ,  Hideshi Tokuhira ,  Minoru Ishinabe ,  Masanobu Ishiduka ,  Hiroaki Date

发明人： Hiroki Uchida ,  Jun Taniguchi ,  Hideshi Tokuhira ,  Minoru Ishinabe ,  Masanobu Ishiduka ,  Hiroaki Date

IPC分类号： G06F1/20

CPC分类号： G06F1/203 ,  G06F2200/201

摘要： A body flow path in a first housing having an MPU element communicates with an inner flow path and outer flow path formed in an inner heat-dissipating board and an outer heat-dissipating board, respectively, and a pump drives a cooling liquid to circulate in these flow paths. A beam is arranged between a pivot provided in a second housing and a pivot provided in the inner heat-dissipating board, a beam is arranged between the pivot of the inner heat-dissipating board and a pivot provided in the outer heat-dissipating board, and the inner heat-dissipating board and the outer heat-dissipating board are movable to the second housing. According to the operation of opening the second housing, a distance between the second housing and the inner heat-dissipating board, and a distance between the inner flow path and the outer flow path are increased.

公开(公告)号：US20050009243A1

公开(公告)日：2005-01-13

申请号：US10853288

申请日：2004-05-26

申请人： Jun Taniguchi

发明人： Jun Taniguchi

IPC分类号： H01L23/12 ,  H01L21/00 ,  H01L21/44 ,  H01L21/50 ,  H01L21/56 ,  H01L21/58 ,  H01L21/60 ,  H01L21/98 ,  H01L23/28 ,  H01L23/48 ,  H01L25/065 ,  H01L25/10 ,  H01L25/11 ,  H01L25/18

CPC分类号： H01L25/50 ,  H01L24/73 ,  H01L24/97 ,  H01L25/0657 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2225/0651 ,  H01L2225/06551 ,  H01L2225/06572 ,  H01L2225/06582 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/07802 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/15787 ,  H01L2924/1627 ,  H01L2924/181 ,  H01L2924/19043 ,  H01L2224/83 ,  H01L2224/85 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： A method of manufacturing a semiconductor device including: mounting a semiconductor chip in which an integrated circuit is formed on a wiring board having an interconnecting pattern; mounting a board for electrical connection having a plurality of penetrating conductive sections on the wiring board; disposing a first end surface of each of the penetrating conductive sections to face the interconnecting pattern; electrically connecting the first end surface and the interconnecting pattern; and forming a sealing section which seals the semiconductor chip and the board for electrical connection such that a second end surface of each of the penetrating conductive sections is exposed from the sealing section.

摘要翻译： 一种制造半导体器件的方法，包括：在具有互连图案的布线板上安装集成电路形成的半导体芯片; 在所述布线板上安装具有多个穿透导电部分的电连接板; 布置每个穿透导电部分的第一端面以面对互连图案; 电连接第一端面和互连图案; 以及形成密封所述半导体芯片和所述电路板用于电连接的密封部分，使得每个所述穿透导电部分的第二端面从所述密封部分露出。

公开(公告)号：US6011572A

公开(公告)日：2000-01-04

申请号：US208515

申请日：1998-12-09

申请人： Chikashi Osakama ,  Jun Taniguchi

发明人： Chikashi Osakama ,  Jun Taniguchi

IPC分类号： B41J2/32 ,  B41J25/304 ,  B41J25/312

CPC分类号： B41J25/312 ,  B41J25/304

摘要： A head up-down mechanism in a printer is to be provided wherein, by a simple construction, a carriage is returned up to a printing start position while a thermal head is spaced apart from a platen and at the same time there is performed a paper feed operation and which can thereby improve an effective printing speed. To this end the head up-down mechanism includes a head up-down lever with a thermal head mounted thereon at a position opposed to a platen, the head up-down lever being supported pivotably by a carriage which reciprocates along the platen between both side plates spaced a predetermined distance from each other, an urging member for urging the head up-down lever in a direction in which the thermal head comes into abutment against the platen, and a head up-down cam which is moved by abutment thereof against each of the side plates and which causes the head up-down lever to turn so that the thermal head comes into or out of contact with the platen.

摘要翻译： 提供一种打印机中的头部上下机构，其中，通过简单的结构，将托架返回到打印开始位置，同时热敏头与压板间隔开，同时执行纸张 进给操作，从而可以提高打印速度。 为此，头部上下机构包括：头部上下杆，其具有安装在与压板相对的位置处的热敏头，头部上下杆由可沿着压板的两侧往复运动的滑架支撑 彼此间隔预定距离的板，用于沿着热敏头与台板抵接的方向推压头部上下杆的推动构件，以及通过抵靠每一个而被移动的头部上下凸轮 的侧板，并且使得头部上下杆转动，使得热敏头进入或不与压板接触。

公开(公告)号：US09332651B2

公开(公告)日：2016-05-03

申请号：US12675537

申请日：2009-02-09

申请人： Jun Taniguchi

发明人： Jun Taniguchi

IPC分类号： H05K3/00 ,  H05K3/20 ,  C23C4/18 ,  C23C14/00 ,  C23C14/02 ,  C23C14/16 ,  C23C26/00

CPC分类号： H05K3/205 ,  C23C4/185 ,  C23C14/0005 ,  C23C14/025 ,  C23C14/16 ,  C23C26/00 ,  H05K3/20 ,  H05K2203/0108 ,  H05K2203/1152

摘要： The invention provides is a process for producing a structure (22) with a metal film, including the steps of preparing a mother die (10) in which a first metal film (16) is formed on the surface of a base (12) on which a concave and convex pattern (14) is formed, forming a second metal film (18) on the first metal film (16), adhering a support member (20) to the second metal film (18), and separating the second metal film (18) to which the concave and convex pattern has been transferred to the second metal film (18) together with the support member from the first metal film (16). Preferably, the first metal film (16) is a film containing Cr and Al, and the second metal film (18) is a film containing at least one metal selected from the group consisting of Au, Ag, Cu, Al, and Pt.

摘要翻译： 本发明提供了一种用金属膜制造结构（22）的方法，包括以下步骤：制备母模（10），其中第一金属膜（16）形成在基底（12）的表面上， 形成凹凸图案（14），在第一金属膜（16）上形成第二金属膜（18），将支撑构件（20）粘附到第二金属膜（18）上，并将第二金属 其中凹凸图案已经与第一金属膜（16）与支撑构件一起被转印到第二金属膜（18）上的膜（18）。 优选地，第一金属膜（16）是含有Cr和Al的膜，第二金属膜（18）是含有选自Au，Ag，Cu，Al和Pt中的至少一种金属的膜。

公开(公告)号：US08817470B2

公开(公告)日：2014-08-26

申请号：US13447515

申请日：2012-04-16

申请人： Nobumitsu Aoki ,  Hideo Kubo ,  Yoshinori Uzuka ,  Jun Taniguchi

发明人： Nobumitsu Aoki ,  Hideo Kubo ,  Yoshinori Uzuka ,  Jun Taniguchi

IPC分类号： H05K7/20 ,  G06F1/20 ,  G11B33/14

CPC分类号： H05K7/20727 ,  G11B33/142 ,  H05K7/20736

摘要： DIMMs to be cooled are mounted in DIMM areas of a printed circuit board of a system board. An air intake port that introduces cooling air is arranged on a side plate of the system board, whereas an air discharge port that discharges the cooling air is arranged on another side plate. The cooling air flows in a direction that is oblique with respect to the side plate. The air intake port is arranged at a position that is offset in the direction in which the cooling air is supplied. Accordingly, cooling is possible by efficiently bringing the cooling air into contact with the DIMMs.

摘要翻译： 要冷却的DIMM安装在系统板印刷电路板的DIMM区域中。 在系统板的侧板上配置有引入冷气的吸气口，而排出冷气的排气口配置在另一侧板上。 冷却空气相对于侧板倾斜的方向流动。 进气口布置在沿供给冷却空气的方向偏移的位置。 因此，可以通过有效地使冷却空气与DIMM接触来进行冷却。