Memory device
    11.
    发明授权

    公开(公告)号:US11282559B1

    公开(公告)日:2022-03-22

    申请号:US17201114

    申请日:2021-03-15

    Abstract: According to one embodiment, a memory device includes: a third layer between first and a second layers above a substrate; a pillar being adjacent to the first to third layers and including a ferroelectric layer; a memory cell between the third layer and the pillar; and a circuit which executes a first operation for a programming, a second operation for an erasing using a first voltage, and a third operation of applying a second voltage between the third layer and the pillar. The first voltage has a first potential difference, the second voltage has a second potential difference smaller than the first potential difference. A potential of the third conductive layer is lower than a potential of the pillar in each of the first and second voltages. The third operation is executed between the first operation and the second operation.

    Semiconductor storage device
    12.
    发明授权

    公开(公告)号:US11049573B2

    公开(公告)日:2021-06-29

    申请号:US16802471

    申请日:2020-02-26

    Abstract: A semiconductor storage device includes a first memory cell and a second memory cell which are connected to each other in series, a first word line which is connected to the first memory cell, a second word line which is connected to the second memory cell, and a control circuit. The control circuit is configured to charge a first node while applying a second voltage to the second word line and a first voltage to the first word line, to charge a second node on the basis of a voltage of the charged first node, to discharge the second node while applying the second voltage to the second word line and a third voltage to the first word line, and to read data from the first memory cell on the basis of voltages of the charged and discharged second node.

    Nonvolatile semiconductor storage device and method for performing a read operation on the same

    公开(公告)号:US11232843B2

    公开(公告)日:2022-01-25

    申请号:US17009376

    申请日:2020-09-01

    Abstract: A nonvolatile semiconductor storage device includes a first channel layer including a first drain-side select transistor, a first source-side select transistor, and a first memory cell transistor, a second channel layer including a second drain-side select transistor, a second source-side select transistor, and a second memory cell transistor, a word line that functions as a gate electrode of the first and second memory cell transistors, and a controller. When a read operation is executed on the first memory cell transistor, the controller turns on the second drain-side select transistor and the second source-side select transistor, supplies a first voltage to the word line in a state where the first drain-side select transistor and the first source-side select transistor are turned off, and then, supplies a second voltage to the word line in a state where the first drain-side select transistor and the first source-side select transistor are turned on.

    Semiconductor memory device
    17.
    发明授权

    公开(公告)号:US12125545B2

    公开(公告)日:2024-10-22

    申请号:US17689182

    申请日:2022-03-08

    CPC classification number: G11C16/3427 G11C16/0483 G11C16/10 G11C16/08

    Abstract: A semiconductor memory device includes a driver that, in a write operation, applies a first voltage to a first select gate line, applies a second voltage lower than the first voltage to a second select gate line, applies a third voltage equal to or higher than the first voltage to a first dummy word line on an uppermost layer, applies a fourth voltage different from the third voltage and higher than the second voltage to a second dummy word line on an uppermost layer, applies a fifth voltage equal to or higher than the third voltage to a first dummy word line on a lowermost layer, and applies a sixth voltage different from the fifth voltage and equal to or higher than the fourth voltage to a second dummy word line on a lowermost layer.

    Semiconductor memory device having insulating layers disposed between a plurality of memory string structures

    公开(公告)号:US11538536B2

    公开(公告)日:2022-12-27

    申请号:US17199718

    申请日:2021-03-12

    Abstract: A semiconductor memory device includes first conductive layers arranged in a first direction, second conductive layers arranged in the first direction, a first semiconductor layer disposed therebetween, a charge storage layer, a first wiring electrically connected to the first semiconductor layer, and first and second transistors connected to the first and the second conductive layers. In the semiconductor memory device, in an erase operation, a first voltage is supplied to at least a part of the first conductive layers, an erase voltage larger than the first voltage is supplied to the first wiring, and a first signal voltage is supplied to at least a part of the second transistors. The first signal voltage turns OFF the second transistor.

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