摘要:
A modified epoxy resin composition for use in making a printed circuit board comprising: (1) a modified epoxy resin obtained by reacting (a) a low molecular weight epoxy resin having at least two epoxy groups which has the following formula, ##STR1## (b) an N-heterocyclic fatty amino chain-extending agent at least two active hydrogen atoms and represented by the formulas, ##STR2## and (c) at least one catalyst for catalyzing the reaction between components (a) and (b).
摘要:
A liquid crystal display device comprises a color filter substrate and an array substrate. An optical compensation film is disposed on the color filter substrate and/or the array substrate, wherein the optical compensation film comprises a polyimide, comprising the following formula: wherein n is an integer greater than 1, and wherein when A is cyclo-aliphatic compound, B is aromatic compound or cyclo-aliphatic compound, and when A is aromatic compound, B is cyclo-aliphatic compound.
摘要:
Disclosed are encapsulation materials including an 80 to 99.5 weight percentage (wt %) of ethylene vinyl acetate copolymers (EVA) and a 0.5 to 20 weight percentage(wt %) of a photoluminescent polymer, wherein the EVA and the photoluminescent polymers are evenly blended. The encapsulation materials can be applied to packaging solar cells, and the encapsulating structure may protect the EVA from UV damage and enhance light utilization efficiency of the solar cell.
摘要:
An organic/inorganic hybrid material is provided, including an organic polymer, and a plurality of inorganic nano-platelets, wherein the inorganic nano-platelets are self-connected or connected via a linker to constitute an inorganic platelet network. By the formation of the inorganic network structure, the hybrid materials can keep their transparency and flexibility at a high inorganic content, and exhibit greatly reduced coefficients of thermal expansion A method for fabricating the organic/inorganic hybrid material is also provided.
摘要:
The invention provides a halogen-free and thermal resistant composition, including a mixture of bismaleimide and maleimide with molar ratio of 99:1-50:50; a barbituric acid, wherein the molar ratio of the mixture and the barbituric acid is 93:7-80:20; and an epoxy resin, wherein (the mixture with the barbituric acid) and the epoxy resin have a weight ratio of 5:95 to 50:50. The mixture undergoes reaction at 110-130° C. for about 2˜7 hours to form a maleimide modified epoxy resin. The procedure of forming the composition is solvent-free, thereby providing improved integrity for electronic packaging, lower curing temperature, and a simplified process.
摘要:
A protective film for a polarizer. An exemplary polarizer protective film includes a transparent resin with nanoscale particles dispersed therein, having an average diameter not exceeding 50 nanometers.
摘要:
A liquid crystal display device comprises a color filter substrate and an array substrate. An optical compensation film is disposed on the color filter substrate and/or the array substrate, wherein the optical compensation film comprises a polyimide, comprising the following formula: wherein n is an integer greater than 1, and wherein when A is cyclo-aliphatic compound, B is aromatic compound or cyclo-aliphatic compound, and when A is aromatic compound, B is cyclo-aliphatic compound.
摘要:
A high-solubility and high-adhesion poly(amide-imide-ester) resin prepared from a monomer composition comprising: (a) a diisocyanate such as diphenylmethane 4,4'diisocyanate; (b) a trimellitic anhydride; and (c) a bis-anhydride of trimellitic anhydride such as 1,2 bis(trimellitate)ethane dianhydride, dissolved in an appropriate solvent system. Each of the trimellitic anhydride and the bisanhydride of trimellitic anhydride constitutes 1 to 40%, on a molar basis, of the monomer composition and the amount of the diisocyanate is about 1.0 to 1.2 times, also on a molar basis, the sum of the trimellitic anhydride and the bis-anhydride of trimellitic anhydride. In an alternate embodiment, a fourth component (d) diacid such as isophthalic acid can be added to the monomer composition. After the polymerization reaction, the poly(amide-imide-ester) resin so produced can be diluted with a variety of organic solvents, such as xylene and dimethylacetamide, etc., and directly coated onto a copper foil to make polymer/metal laminates without going through an intermediate step involving polyamic acid.
摘要:
A heat resistant adhesive composition comprising an admixture of a modified bismaleimide (BMI) resin, a modified polyamide-imide and a solvent. The bismaleimide is modified by barbituric acid and/or the derivatives thereof and the polyamide-imide is modified by an epoxy resin. The overall solid content of the heat resistant adhesive composition is in the range of about 15 to 50 percent by weight, wherein solid contents per overall solid content of the modified bismaleimide resin and the modified polyamide-imide are 60 to 90 percent and 10 to 40 percent, respectively.
摘要:
Disclosed is an electrode assembly of a lithium secondary battery, including an anode plate, a cathode plate, a separator for separating the anode plate and the cathode plate and conducting lithium ions of an electrolyte, and a composite film disposed between the anode plate and the separator and/or between the cathode plate and the separator. The composite film includes 5 to 95 parts by weight of an inorganic clay and 95 to 5 parts by weight of an organic polymer binder.