公开(公告)号：US20120242363A1

公开(公告)日：2012-09-27

申请号：US13288925

申请日：2011-11-03

Applicant: Keith J. Breinlinger ,  Benjamin N. Eldridge ,  Eric D. Hobbs ,  Michael J. Armstrong ,  John K. Gritters

Inventor： Keith J. Breinlinger ,  Benjamin N. Eldridge ,  Eric D. Hobbs ,  Michael J. Armstrong ,  John K. Gritters

IPC: G01R1/067 ,  H01R43/16 ,  H01R24/66 ,  G01R31/26 ,  H01R24/00 ,  H01R13/02

CPC classification number: G01R1/06716 ,  G01R1/06733 ,  G01R1/07357 ,  H01R13/2407 ,  H01R43/16 ,  Y10T29/49204

Abstract: An electrically conductive contact element can include a first base and a second base with elongate, spaced apart leaves between the bases. A first end of each leaf can be coupled to the first base and an opposite second end of the leaf can be coupled to the second base. A body of the leaf between the first end and the second end can be sufficiently elongate to respond to a force through said contact element substantially parallel with the first axis and the second axis by first compressing axially while said force is less than a buckling force and then bending while said force is greater than the buckling force.

Abstract translation: 导电接触元件可以包括第一基部和在基部之间具有细长间隔开的叶片的第二基部。 每个叶片的第一端可以联接到第一基部，并且叶片的相对的第二端可以联接到第二基部。 在第一端和第二端之间的叶片的主体可以是足够伸长的，以响应于通过所述接触元件的力，所述力通过在所述力小于屈曲力的同时第一轴向压缩而基本上平行于第一轴线和第二轴线，并且 然后在所述力大于屈曲力时弯曲。

公开(公告)号：US07977956B2

公开(公告)日：2011-07-12

申请号：US12431271

申请日：2009-04-28

Applicant: Keith J. Breinlinger ,  Benjamin N. Eldridge ,  Eric D. Hobbs ,  Douglas S. Ondricek

Inventor： Keith J. Breinlinger ,  Benjamin N. Eldridge ,  Eric D. Hobbs ,  Douglas S. Ondricek

IPC: G01R31/00 ,  G01R31/20

CPC classification number: G01R31/2891

Abstract: Embodiments of methods and apparatus for aligning a probe card assembly in a test system are provided herein. In some embodiments, an apparatus for testing devices may include a probe card assembly having a plurality of probes, each probe having a tip for contacting a device to be tested, and having an identified set of one or more features that are preselected in accordance with selected criteria for aligning the probe card assembly within a prober after installation therein. In some embodiments, the identity of the identified set of one or more features may be communicated to the prober to facilitate a global alignment of the probe card assembly that minimizes an aggregate misalignment of all of the tips in the probe card assembly.

Abstract translation: 本文提供了在测试系统中对准探针卡组件的方法和装置的实施例。 在一些实施例中，用于测试装置的装置可以包括具有多个探针的探针卡组件，每个探针具有用于接触要测试的装置的尖端，并且具有根据本发明的预选的一组或多个特征 在探针卡组件安装在其中之后将探针卡组件对准的选择标准。 在一些实施例中，所识别的一个或多个特征集合的身份可以被传送到探测器，以促进探针卡组件的全局对准，其最小化探针卡组件中的所有尖端的聚集失准。

公开(公告)号：US20100271062A1

公开(公告)日：2010-10-28

申请号：US12431271

申请日：2009-04-28

Applicant: Keith J. Breinlinger ,  Benjamin N. Eldridge ,  Eric D. Hobbs ,  Douglas S. Ondricek

Inventor： Keith J. Breinlinger ,  Benjamin N. Eldridge ,  Eric D. Hobbs ,  Douglas S. Ondricek

IPC: G01R31/02

CPC classification number: G01R31/2891

Abstract: Embodiments of methods and apparatus for aligning a probe card assembly in a test system are provided herein. In some embodiments, an apparatus for testing devices may include a probe card assembly having a plurality of probes, each probe having a tip for contacting a device to be tested, and having an identified set of one or more features that are preselected in accordance with selected criteria for aligning the probe card assembly within a prober after installation therein. In some embodiments, the identity of the identified set of one or more features may be communicated to the prober to facilitate a global alignment of the probe card assembly that minimizes an aggregate misalignment of all of the tips in the probe card assembly

Abstract translation: 本文提供了在测试系统中对准探针卡组件的方法和装置的实施例。 在一些实施例中，用于测试装置的装置可以包括具有多个探针的探针卡组件，每个探针具有用于接触要测试的装置的尖端，并且具有根据本发明的预选的一组或多个特征 在探针卡组件安装在其中之后将探针卡组件对准的选择标准。 在一些实施例中，所识别的一组一个或多个特征的身份可以被传送到探测器，以促进探针卡组件的全局对准，其最小化探针卡组件中的所有尖端的聚集失准

公开(公告)号：US07772863B2

公开(公告)日：2010-08-10

申请号：US12327643

申请日：2008-12-03

Applicant: Keith J. Breinlinger ,  Eric D. Hobbs

Inventor： Keith J. Breinlinger ,  Eric D. Hobbs

IPC: G01R31/02 ,  G01R31/28

CPC classification number: G01R31/2874 ,  G01R31/2889

Abstract: A stiffener structure, a wiring substrate, and a frame having a major surface disposed in a stack can be part of a probe card assembly. The wiring substrate can be disposed between the frame and the stiffener structure, and probe substrates can be coupled to the frame by one or more non-adjustably fixed coupling mechanisms. Each of the probe substrates can have probes that are electrically connected through the probe card assembly to an electrical interface on the wiring substrate to a test controller. The non-adjustably fixed coupling mechanisms can be simultaneously stiff in a first direction perpendicular to the major surface and flexible in a second direction generally parallel to the major surface.

Abstract translation: 加强结构，布线基板和具有设置在堆叠中的主表面的框架可以是探针卡组件的一部分。 布线基板可以设置在框架和加强件结构之间，并且探针基板可以通过一个或多个不可调节地固定的联接机构联接到框架。 每个探针基板可以具有通过探针卡组件电连接到布线基板上的电接口到测试控制器的探针。 不可调节固定的联接机构可以在垂直于主表面的第一方向上同时刚性，并且在大致平行于主表面的第二方向上是柔性的。

公开(公告)号：US07622935B2

公开(公告)日：2009-11-24

申请号：US11551545

申请日：2006-10-20

Applicant: Eric D. Hobbs ,  Alexander H. Slocum ,  Benjamin N. Eldridge ,  Keith J. Breinlinger ,  Shawn Powell

Inventor： Eric D. Hobbs ,  Alexander H. Slocum ,  Benjamin N. Eldridge ,  Keith J. Breinlinger ,  Shawn Powell

IPC: G01R31/02 ,  G01R31/28

CPC classification number: G01R31/2893

Abstract: A probe card assembly can comprise a probe head assembly and a wiring substrate. The probe head assembly can comprise a plurality of probes disposed to contact an electronic device disposed on a holder in a test housing. The wiring substrate can include an electrical interface to a test controller and a plurality of electrical wiring composing electrical paths between the electrical interface and ones of the probes, and the wiring substrate can comprise a first portion on which the electrical interface is disposed and a second portion composing the probe head assembly. The second portion of the wiring substrate can be moveable with respect to the first portion of the wiring substrate.

Abstract translation: 探针卡组件可以包括探针头组件和布线衬底。 探针头组件可以包括多个探针，其设置成接触设置在测试壳体中的保持器上的电子设备。 布线基板可以包括与测试控制器的电接口以及构成电接口和探针之间的电气路径的多个电线，并且布线基板可以包括其上设置有电接口的第一部分和第二部分 组成探头组件的部分。 布线基板的第二部分能够相对于布线基板的第一部分移动。

公开(公告)号：US20120146679A1

公开(公告)日：2012-06-14

申请号：US12967302

申请日：2010-12-14

Applicant: Kevin S. Chang ,  Eric D. Hobbs

Inventor： Kevin S. Chang ,  Eric D. Hobbs

IPC: G01R31/00

CPC classification number: G01R1/07378 ,  G01R31/2891

Abstract: A stiffener for a probe card assembly can include decoupling mechanisms disposed within radial arms of the stiffener. The decoupling mechanisms can be compliant in a direction along a radial direction of said radial arm and rigid in a direction perpendicular to said radial arm. The decoupling mechanisms can decouple the stiffener from thermally induced differential radial contraction and expansion of the stiffener relative to the cardholder to which the stiffener is mounted. This can reduce thermally-induced vertical translation of the probe card assembly.

Abstract translation: 用于探针卡组件的加强件可以包括设置在加强件的径向臂内的去耦机构。 去耦机构可以沿着所述径向臂的径向的方向并且在垂直于所述径向臂的方向上是刚性的。 解耦机构可以将加强件与加热元件相对于加强件安装到的卡座上的热引起的差分径向收缩和膨胀相分离。 这可以减少探针卡组件的热诱导垂直平移。

公开(公告)号：US20110128029A1

公开(公告)日：2011-06-02

申请号：US13022443

申请日：2011-02-07

Applicant: Eric D. Hobbs ,  Andrew W. McFarland

Inventor： Eric D. Hobbs ,  Andrew W. McFarland

IPC: G01R31/00

CPC classification number: G01R1/07378

Abstract: A stiffener assembly for use with testing devices is provided herein. In some embodiments, a stiffener assembly for use with testing devices can be part of a probe card assembly that can include a stiffener assembly comprising an upper stiffener coupled to a plurality of lower stiffeners; and a substrate constrained between the upper stiffener and the plurality of lower stiffeners, the stiffener assembly restricting non-planar flex of the substrate while facilitating radial movement of the substrate with respect to the stiffener assembly.

Abstract translation: 本文提供了一种与测试装置一起使用的加强装置。 在一些实施例中，用于与测试装置一起使用的加强件组件可以是探针卡组件的一部分，其可以包括加强件组件，该加强件组件包括联接到多个下加强件的上加强件; 以及限制在所述上加强件和所述多个下加强件之间的衬底，所述加强件组件限制所述衬底的非平面弯曲，同时促进所述衬底相对于所述加强件组件的径向移动。

公开(公告)号：US07884627B2

公开(公告)日：2011-02-08

申请号：US11860406

申请日：2007-09-24

Applicant: Eric D. Hobbs ,  Andrew W. McFarland

Inventor： Eric D. Hobbs ,  Andrew W. McFarland

IPC: G01R31/02

CPC classification number: G01R1/07378

Abstract: A stiffener assembly for use with testing devices is provided herein. In some embodiments, a stiffener assembly for use with testing devices can be part of a probe card assembly that can include a stiffener assembly comprising an upper stiffener coupled to a plurality of lower stiffeners; and a substrate constrained between the upper stiffener and the plurality of lower stiffeners, the stiffener assembly restricting non-planar flex of the substrate while facilitating radial movement of the substrate with respect to the stiffener assembly.

Abstract translation: 本文提供了一种与测试装置一起使用的加强装置。 在一些实施例中，用于与测试装置一起使用的加强件组件可以是探针卡组件的一部分，其可以包括加强件组件，该加强件组件包括联接到多个下加强件的上加强件; 以及限制在所述上加强件和所述多个下加强件之间的衬底，所述加强件组件限制所述衬底的非平面弯曲，同时促进所述衬底相对于所述加强件组件的径向移动。

公开(公告)号：US07845072B2

公开(公告)日：2010-12-07

申请号：US12343260

申请日：2008-12-23

Applicant: Eric D. Hobbs ,  Benjamin N. Eldridge ,  Lunyu Ma ,  Gaetan L. Mathieu ,  Steven T. Murphy ,  Makarand S. Shinde ,  Alexander H. Slocum

Inventor： Eric D. Hobbs ,  Benjamin N. Eldridge ,  Lunyu Ma ,  Gaetan L. Mathieu ,  Steven T. Murphy ,  Makarand S. Shinde ,  Alexander H. Slocum

IPC: H05K3/30

CPC classification number: G01R31/2886 ,  G01R1/073 ,  G01R31/31905 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49133 ,  Y10T29/49147 ,  Y10T29/49208 ,  Y10T29/49222

Abstract: A probe card assembly comprises multiple probe substrates attached to a mounting assembly. Each probe substrate includes a set of probes, and together, the sets of probes on each probe substrate compose an array of probes for contacting a device to be tested. Adjustment mechanisms are configured to impart forces to each probe substrate to move individually each substrate with respect to the mounting assembly. The adjustment mechanisms may translate each probe substrate in an “x,” “y,” and/or “z” direction and may further rotate each probe substrate about any one or more of the forgoing directions. The adjustment mechanisms may further change a shape of one or more of the probe substrates. The probes can thus be aligned and/or planarized with respect to contacts on the device to be tested.

Abstract translation: 探针卡组件包括附接到安装组件的多个探针基板。 每个探针衬底包括一组探针，并且每个探针衬底上的探针组合在一起组成一组探针，用于接触待测试的器件。 调整机构构造成赋予每个探针基板以相对于安装组件分别移动每个基板的力。 调节机构可以将每个探针基板转换成“x”，“y”和/或“z”方向，并且可以进一步围绕前述方向上的任何一个或多个旋转每个探针基板。 调节机构可以进一步改变一个或多个探针基板的形状。 因此，探针可以相对于要测试的装置上的触点对准和/或平坦化。

公开(公告)号：US20100264949A1

公开(公告)日：2010-10-21

申请号：US12423927

申请日：2009-04-15

Applicant: Eric D. Hobbs

Inventor： Eric D. Hobbs

IPC: G01R31/02 ,  G01R1/073

CPC classification number: G01R31/2889 ,  G01R31/2891

Abstract: A flexure band can comprise structures configured to have elastic properties. Such a band can be stretched but will return generally to its original shape after forces that stretched the band are removed. The flexure band can hold one or more temperature control devices against a peripheral edge of a stiffening frame in a probe card assembly, or the flexure band can itself be a temperature control device. The band can be made of a metal that can be selected to impart one or more of the following properties: low thermal conductivity, high specific heat, generates little to no appreciable contamination, and/or usable over a wide range of temperatures. A material can be added to the band as a full or partial coating that enhances or adds one or more of the above-mentioned possible properties of the metal band.

Abstract translation: 弯曲带可以包括构造成具有弹性特性的结构。 这样的带可以被拉伸，但是在拉伸带的力被去除之后通常将返回到其原始形状。 挠曲带可以将一个或多个温度控制装置保持在探针卡组件中的加强框架的周边边缘上，或者挠曲带本身可以是温度控制装置。 带可以由可以选择以赋予以下特性中的一种或多种的金属制成：低导热性，高比热，几乎不产生明显的污染，和/或可在宽的温度范围内使用。 可以将材料作为增强或增加金属带的上述可能性质中的一种或多种的全部或部分涂层添加到带中。