摘要:
Interference of a leakage vortex flow generated at the tip end side of the full blade with the leading edge of the splitter blade is avoided and high pressure ratio and enhanced efficiency can be achieved. A throat of am impeller is formed so that a distance from a leading edge of a rear side full blade on the rear side of the rotation direction of the compressor to a front side full blade adjacent to the rear side full blade is minimized, and the leading edge of the splitter blade is placed in a fluid flow streaming along the flow passage between the mutually adjacent full blades, on the downstream side of a leakage vortex line formed to connect the middle location of the throat to the leading edge of the front side full blade.
摘要:
An impeller of a centrifugal includes, a plurality of full blades provided from the fluid inlet part to the fluid outlet part of the impeller; a plurality of splitter blades provided on the hub surface, wherein the geometry of a flow entering part of the splitter blade is compatible with the complicated flow inside the compressor so that the evenly distributed flow rate distribution, the increased pressure ratio and the enhanced efficiency are achieved. The leading edge blade angle θ in the tip end part of the flow entering front-end-part of the splitter blade 7 in the area of the higher height level from the hub surface is further inclined smoothly toward the blade suction surface side Sb of the full blade 5 in comparison with the inclination standard curve, the increased inclination angle becoming smoothly greater in response to the increase of the height level.
摘要:
It is intended to provide a cooling structure for a bearing housing for a turbocharger, the cooling structure being configured so that the cooling structure is manufactured with improved productivity, the occurrence of heat soak-back is reduced, and the cooling structure has improved cooling performance. The cooling structure is configured to cool both a bearing housing 13 and a bearing 52 by cooling water flowing through an annular cooling water path 13f formed in the bearing housing 13, and is provided with: a water path inlet 13h for supplying the cooling water and a water path outlet 13j for discharging the cooling water, which are provided in the bearing housing 13 so as to communicate with the annular cooling water path 13f and a partial partition 14a in the bearing housing 13 to partially close a water path which forms the shortest route between the water path inlet 13h and the water path outlet 13j.
摘要:
The invention provides a resin-coated composite foil characterized in that an organic insulating layer is disposed on an ultra-thin copper foil is disposed on a supporting metal layer through an intermediate organic release layer. The resin-coated composite foil is free from the peeling or blistering between the supporting metal foil and the ultra-thin copper foil during the production of a copper clad laminate.
摘要:
The object is to provide copper foil of high adhesion even when the roughness Rz of a nodular surface of the copper foil is low, and a method of manufacturing the copper foil. To achieve this object, there is adopted a copper foil which is characterized in that an area coefficient C(S), which is defined by A(S)/B(S) from a three-dimensional surface area A(S), which is obtained by performing three-dimensional measurement of a surface area of a nodular surface of a copper foil sample S under a laser microscope, and from a measuring region area B(S), which is an area of a measuring region of the three-dimensional surface area A(S), and a roughness Rz(S) of a nodular surface of the copper foil sample S, which is measured by a stylus-type roughness meter, have a relationship of equation (1) below, and in that the roughness Rz(S) is 1.0 μm to 3.0 μm, 0.5×Rz(S)+0.5≦C(S) (1) where Rz(S) is a numerical value represented by μm.
摘要:
A cooling structure for a bearing housing for a turbocharger is provided. The cooling structure is configured so that the cooling structure has improved productivity, the occurrence of heat soak-back is reduced, and the cooling structure has improved cooling performance. The cooling structure cools both a bearing housing 13 and a bearing 52 by cooling water flowing through an annular cooling water path 13f formed in the bearing housing 13, and is provided with: a water path inlet 13h for supplying the cooling water and a water path outlet 13j for discharging the cooling water, which are provided in the bearing housing 13 to communicate with the annular cooling water path 13f; and a partial partition 14a in the bearing housing 13 to partially close a water path which forms the shortest route between the water path inlet 13h and the water path outlet 13j.
摘要:
Present invention provides an electrodeposited copper foil with carrier foil that assure high bonding strength between a surface of the bulk copper layer and a resin substrate layer even when surface roughness is low, and hardly occurs delamination even when pin holes and the like remain in a bulk copper layer or in the side wall of the through holes or via holes and the like after contact with a desmear solution and the like. To solve such a problem, electrodeposited copper foil with carrier foil with a primer resin layer comprising a bonding interface layer, a bulk copper layer, a plated Ni—Zn alloy layer and a primer resin layer which is formed in this order at least on one surface of the carrier foil is applied.
摘要:
The object is to provide a method of manufacturing electrodeposited copper foil with a carrier foil for high-temperature heat-resistance in which the peeling of the carrier foil is easy even by press working at temperatures of not less than 200°C. For this purpose are adopted “a method of manufacturing electrodeposited copper foil with a carrier foil for high-temperature heat-resistance in which an organic adhesive interface layer is formed on a surface of carrier foil by use of an organic agent, and an electrodeposited copper foil layer is formed on the organic adhesive interface layer, characterized in that the formation of the organic adhesive interface layer on the surface of the carrier foil is performed by acid pickling the surface of the carrier foil by use of an acid pickling solution containing 50 ppm to 2000 ppm of organic agent used in the formation of the adhesive interface layer and by simultaneously causing the organic agent to be adsorbed whereby an acid pickled and adsorbed organic film is formed” and others.
摘要:
A composite material for use in making printed wiring boards comprising a carrier having releasable conductive fine particles on its surface. The composite is laminated to a substrate with the conductive fine particles facing the substrate and the carrier removed, leaving the surface of the conductive fine particles exposed. Printed wiring is formed using the conductive fine particles as its base, thus providing improved peel strength and permitting formation of fine wiring lines and spaces.
摘要:
This invention provides a composite foil comprising an organic release layer between a metal carrier layer and an ultra-thin copper foil, and a process for producing such composite foils comprising the steps of depositing the organic release layer on the metal carrier layer and then forming an ultra-thin copper foil layer on said organic release layer, preferably by electrodeposition. The organic release layer preferably is a heterocyclic compound selected from triazoles, thiazoles, imidazoles, or their derivatives, and provides a uniform bond strength which is adequate to prevent separation of the carrier and ultra-thin copper foil during handling and lamination, but which is significantly lower than the peel strength of a copper/substrate bond, so that the carrier can easily be removed after lamination of the composite foil to an insulating substrate. The invention also includes laminates made from such composite foils and printed wiring boards made from such laminates.