公开(公告)号：US20160040043A1

公开(公告)日：2016-02-11

申请号：US14782200

申请日：2014-12-12

Applicant: LG CHEM, LTD.

Inventor： Young Kook KIM ,  Hee Jung KIM ,  Se Ra KIM ,  Jung Ho JO ,  Jung Hak KIM ,  Seung Hee NAM ,  Kwang Joo LEE

IPC: C09J11/08 ,  H01L21/26 ,  H01L21/78 ,  C09J133/00 ,  C09J7/02

Abstract: There are provided a composition for forming an adhesive layer of a dicing film, including: a polymer additive including at least one polymer selected from the group consisting of a polymer containing a (meth)acrylate-based functional group and a non-polar functional group, a (meth)acrylate-based polymer containing at least one fluorine, and a silicon-modified (meth)acrylate-based polymer containing a reactive functional group; an adhesive binder; and a photoinitiator, wherein a weight ratio of the polymer additive to the adhesive binder is 0.01% to 4.5%, a dicing film including an adhesive layer including the composition, a dicing die bonding film including the dicing film, and a method for dicing a semiconductor wafer using the dicing die bonding film.

Abstract translation: 提供了一种用于形成切割膜的粘合剂层的组合物，其包括：包含至少一种选自包含（甲基）丙烯酸酯官能团和非极性官能团的聚合物的聚合物的聚合物添加剂 ，含有至少一个氟的（甲基）丙烯酸酯系聚合物和含有反应性官能团的硅改性（甲基）丙烯酸酯系聚合物， 粘合剂; 和光引发剂，其中所述聚合物添加剂与所述粘合剂粘合剂的重量比为0.01％至4.5％，包含所述组合物的粘合剂层的切割膜，包括所述切割膜的切割模片接合膜以及用于切割 半导体晶片使用切割芯片接合膜。

公开(公告)号：US20200369925A1

公开(公告)日：2020-11-26

申请号：US16959625

申请日：2019-01-11

Applicant: LG CHEM, LTD.

Inventor： Mi Seon YOON ,  Se Ra KIM ,  Kwang Joo LEE ,  Bora YEON ,  Sung Chan PARK ,  Eun Yeong KIM

IPC: C09J7/30 ,  C09J133/08 ,  C09J133/10 ,  C09J7/22 ,  H01L21/683

Abstract: The present invention relates to a back grinding tape including a polymer substrate and an adhesive layer, wherein the adhesive layer includes a (meth)acrylate resin containing 30 to 60% by weight of a repeating unit derived from a monomer or an oligomer having a glass transition temperature of 0° C. or higher, and wherein the adhesive layer has a glass transition temperature of −20° C. to 10° C., and a method of grinding wafers using the back grinding tape.

公开(公告)号：US20200211889A1

公开(公告)日：2020-07-02

申请号：US16626102

申请日：2018-08-30

Applicant: LG CHEM, LTD.

Inventor： Ji Ho HAN ,  Se Ra KIM ,  Mun Seop SONG ,  Kwang Joo LEE ,  Yeong Im YU

IPC: H01L21/683 ,  H01L21/78

Abstract: The present invention relates to a dicing die-bonding film including: a substrate; an antistatic layer formed on the substrate and including an aliphatic or alicyclic polyurethane resin and a conductive filler; a cohesive layer formed on the antistatic layer; and an adhesive layer formed on the cohesive layer, and a dicing method of a semiconductor wafer using the dicing die-bonding film.

公开(公告)号：US20180237663A1

公开(公告)日：2018-08-23

申请号：US15752151

申请日：2017-03-28

Applicant: LG CHEM, LTD.

Inventor： Jung Hak KIM ,  Hee Jung KIM ,  Seung Hee NAM ,  Kwang Joo LEE ,  Se Ra KIM ,  Young Kook KIM

IPC: C09J7/30 ,  H01L23/14 ,  C09J11/04 ,  C09J11/06 ,  C09J133/08 ,  C09J133/10 ,  C09J163/04

CPC classification number: C09J7/30 ,  C08G59/621 ,  C09J7/10 ,  C09J11/04 ,  C09J11/06 ,  C09J133/08 ,  C09J133/10 ,  C09J163/00 ,  C09J163/04 ,  C09J2201/622 ,  C09J2203/326 ,  C09J2433/00 ,  C09J2463/00 ,  H01L23/14 ,  H01L23/49513 ,  H01L24/00 ,  C08K3/36 ,  C08L33/08 ,  C08L63/00 ,  C08L63/04

Abstract: The present invention relates to a semiconductor device including: a first semiconductor element formed on an adherend; and an adhesive film for embedding the first semiconductor element, wherein the adhesive film satisfies a predetermined ratio between a melt viscosity and a weight loss ratio at a high temperature.

公开(公告)号：US20170290217A1

公开(公告)日：2017-10-05

申请号：US15622988

申请日：2017-06-14

Applicant: LG CHEM, LTD.

Inventor： Se Ra KIM ,  Yoon Jeong BAEK ,  Jang Soon KIM ,  Jae Kwan LEE ,  Hyun Woo PARK

IPC: C09J133/04

CPC classification number: C09J7/22 ,  C08F220/14 ,  C08F220/18 ,  C09J4/06 ,  C09J7/38 ,  C09J133/04 ,  C09J133/08 ,  C09J133/10 ,  C09J2201/606 ,  C09J2203/326 ,  C09J2423/006 ,  C09J2427/006 ,  C09J2433/00 ,  C09J2467/006 ,  C09J2475/006 ,  H01L21/6836 ,  H01L2221/68327 ,  H01L2221/6834 ,  Y10T428/1476 ,  Y10T428/264 ,  Y10T428/266 ,  Y10T428/2891 ,  C08F2220/1808 ,  C08F2220/1825 ,  C08F2220/281

Abstract: The present invention relates to a pressure-sensitive adhesive composition including a polymer of a monomer mixture containing isobornyl (meth)acrylate, a pressure-sensitive adhesive sheet, and a semiconductor wafer backgrinding method. In the present invention, by using isobornyl (meth)acrylate which is a hard-type monomer and has a low hydrophilic property, a pressure-sensitive adhesive composition having superior releasing and re-releasing properties and wettability with respect to the wafer, and having an excellent wafer-proofing property; a pressure-sensitive adhesive sheet prepared by using the pressure-sensitive adhesive composition; and a backgrinding method using the pressure-sensitive adhesive sheet can be provided.

公开(公告)号：US20170198182A1

公开(公告)日：2017-07-13

申请号：US15313441

申请日：2016-04-29

Applicant: LG CHEM, LTD.

Inventor： Hee Jung KIM ,  Se Ra KIM ,  Jung Hak KIM ,  Seung Hee NAM ,  Jung Ho JO ,  Kwang Joo LEE ,  Young Kook KIM

IPC: C09J163/00 ,  C09J7/00 ,  C09J7/02 ,  B32B27/38 ,  H01L21/78 ,  B32B27/36 ,  B32B27/32 ,  B32B7/12 ,  H01L21/683 ,  C09J163/04 ,  B32B27/30

Abstract: The present invention relates to an adhesive composition for a semiconductor including: a thermoplastic resin having a glass transition temperature of −10° C. to 20° C.; a curing agent containing a phenol resin having a softening point of 70° C. or more; a solid epoxy resin; and a liquid epoxy resin, wherein a weight ratio of the total contents of the solid epoxy resin and the liquid epoxy resin to the thermoplastic resin is 1.6 to 2.6, an adhesive film for a semiconductor including the adhesive composition for a semiconductor, a dicing die bonding film including an adhesive layer including the adhesive composition for a semiconductor, and a method for dicing a semiconductor wafer using the dicing die bonding film.