公开(公告)号：US20190023962A1

公开(公告)日：2019-01-24

申请号：US16144319

申请日：2018-09-27

Applicant: Laird Technologies, Inc.

Inventor： Karen J. BRUZDA ,  Jason L. STRADER

IPC: C09K5/14 ,  C08L91/00 ,  H01L23/427 ,  H01L23/42

Abstract: Materials are disclosed that include or are based on thermally reversible gels, such as thermally reversible gelled fluids, oil gels and solvent gel resins. In an exemplary embodiment, a material includes at least one filler in a thermally reversible gel.

公开(公告)号：US20180255666A1

公开(公告)日：2018-09-06

申请号：US15912067

申请日：2018-03-05

Applicant: Laird Technologies, Inc.

Inventor： Jason L. STRADER ,  Eugene Anthony PRUSS ,  Gerald R. ENGLISH

IPC: H05K9/00 ,  B32B37/20 ,  H05K1/03 ,  H05K3/32 ,  H05K3/46

CPC classification number: H05K9/0024 ,  B26F1/00 ,  B32B37/206 ,  B32B38/04 ,  B32B2309/02 ,  B32B2309/12 ,  B32B2457/08 ,  H05K1/0216 ,  H05K1/0393 ,  H05K3/321 ,  H05K3/4655 ,  H05K3/4658 ,  H05K3/4691 ,  H05K9/003 ,  H05K9/0084 ,  H05K2201/0195 ,  H05K2201/0715 ,  H05K2201/10371

Abstract: According to various aspects, disclosed are exemplary embodiments of a multilayered thin film board level shield and exemplary embodiments of a system in package that comprise a a multilayer flexible board level shield. Also disclosed are exemplary embodiments of methods relating to making multilayer thin film board level shields. Additional exemplary embodiments are disclosed of systems and methods of applying board level shielding.

公开(公告)号：US20230320049A1

公开(公告)日：2023-10-05

申请号：US18207259

申请日：2023-06-08

Applicant: Laird Technologies, Inc.

Inventor： Hoang Dinh DO ,  Robert Howard BOUTIER, JR. ,  Jason L. STRADER ,  Michael S. PLANTE

IPC: H05K9/00 ,  C09K5/14

CPC classification number: H05K9/0081 ,  H05K9/0083 ,  C09K5/14

Abstract: According to various aspects, exemplary embodiments are disclosed of thermally-conductive EMI absorbers that generally includes thermally-conductive particles, EMI absorbing particles, and silicon carbide. The silicon carbide is present in an amount sufficient to synergistically enhance thermal conductivity and/or EMI absorption. By way of example, an exemplary embodiment of a thermally-conductive EMI absorber may include silicon carbide, magnetic flakes, manganese zinc ferrite, alumina, and carbonyl iron.

公开(公告)号：US20210028142A1

公开(公告)日：2021-01-28

申请号：US16988919

申请日：2020-08-10

Applicant: Laird Technologies, Inc.

Inventor： Jason L. STRADER ,  Michael S. WLADYKA ,  Keith David JOHNSON ,  Jingting YANG ,  Kevin Joel BOHRER ,  Mark D. KITTEL

IPC: H01L23/00 ,  H01L23/552 ,  H01L23/373 ,  H01L23/367 ,  B32B38/00 ,  B32B38/06 ,  B32B37/00 ,  H01L21/48 ,  H01L21/67

Abstract: A system for applying materials to components generally includes a tool operable for transferring a portion of a material from a supply of the material to a component. The tool may include a resilient material configured for tamping the portion of the material onto the component and imprinting the portion of the material for release and transfer from the supply.

公开(公告)号：US20200287253A1

公开(公告)日：2020-09-10

申请号：US16811684

申请日：2020-03-06

Applicant: Laird Technologies, Inc.

Inventor： Jason L. STRADER ,  John SONG

IPC: H01M10/653 ,  H01M2/02 ,  H05K9/00 ,  C04B14/06

Abstract: Disclosed are exemplary embodiments of thermal management and/or electromagnetic interference (EMI) mitigation materials including coated fillers (e.g., coated thermally-conductive, electrically-conductive, dielectric absorbing, and/or electromagnetic wave absorbing particles, sand particles coated with a binder, other coated functional fillers, combinations thereof, etc.). For example, a thermal management and/or EMI mitigation material may comprise a thermal interface material (TIM) including one or more coated fillers (e.g., coated thermally-conductive particles, sand particles coated with a binder, etc.), whereby the TIM is suitable for providing a thermal management solution for one or more batteries and/or battery packs (e.g., a battery pack for electric vehicle, etc.), or other device(s), etc.

公开(公告)号：US20190371697A1

公开(公告)日：2019-12-05

申请号：US16529063

申请日：2019-08-01

Applicant: Laird Technologies, Inc.

Inventor： Jason L. STRADER ,  Richard F. HILL

IPC: H01L23/367 ,  H01L23/42 ,  H01L23/427 ,  B23P15/26

Abstract: According to various aspects, exemplary embodiments are disclosed of thermal interface materials, electronic devices, and methods for establishing thermal joints between heat spreaders or lids and heat sources. In exemplary embodiments, a method of establishing a thermal joint for conducting heat between a heat spreader and a heat source of an electronic device generally includes positioning a thermal interface material (TIM1) between the heat spreader and the heat source.

公开(公告)号：US20190229035A1

公开(公告)日：2019-07-25

申请号：US16250214

申请日：2019-01-17

Applicant: Laird Technologies, Inc.

Inventor： Jason L. STRADER ,  Eugene Anthony PRUSS

IPC: H01L23/373 ,  C09K5/14 ,  C08L25/08 ,  C08J9/228 ,  C08J9/00

Abstract: Disclosed are exemplary embodiments of highly compliant non-silicone putties and thermal interface materials including the same. In an exemplary embodiment, a non-silicone putty includes at least one thermally-conductive filler and at least one other filler including hollow polymeric particles in a non-silicone polymer base or matrix. The non-silicone putty may have a thermal conductivity of at least about 3 Watts per meter-Kelvin and/or may have a hardness of less than about 30 Shore 00.