Abstract:
An input/output delay optimization method, used in an electronic system comprising a host controller and a memory device. The method comprising: switching the memory device from a first mode to a second mode a high power consumption mode of the memory device; transmitting one or more first read commands to the memory device, wherein the one or more first read commands are transmitted according to different output delay values; determining an optimized output delay value according to the response status of memory device for the one or more first read commands; transmitting one or more second read commands to the memory device, wherein the one or more second read commands are transmitted according to the optimized output delay value; receiving a known data from the memory device according to different input delay values; and determining an optimized input delay value according to the correctness of the received known data.
Abstract:
Provided is a method of fabricating a memory device including performing an ion implantation process by using a mask layer as an implanting mask, so as to form a first embedded doped region and a second embedded doped region in a substrate. The first embedded doped region extends along the first direction, passes through the control gate, and is electrically connected to the first doped region, the second doped region and the third doped region at two sides of control gates. The second embedded doped region extends along the second direction, is located in the substrate under the third doped region, and electrically connected to the third doped region. The first embedded doped region is electrically connected to the second embedded doped region.
Abstract:
Provided is a method of fabricating a memory device including performing an ion implantation process by using a mask layer as an implanting mask, so as to form a first embedded doped region and a second embedded doped region in a substrate. The first embedded doped region extends along the first direction, passes through the control gate, and is electrically connected to the first doped region, the second doped region and the third doped region at two sides of control gates. The second embedded doped region extends along the second direction, is located in the substrate under the third doped region, and electrically connected to the third doped region. The first embedded doped region is electrically connected to the second embedded doped region.
Abstract:
A memory controller, which manages a memory device, receives a memory command. The memory controller determines whether the memory command is encrypted. Upon determining that the memory command is encrypted, the memory controller performs a decryption function corresponding to the memory command. Conditioned on the performance of the decryption function resulting in a successful decryption of the memory command, the memory controller performs an operation on a memory location corresponding to a memory address included in the memory command.
Abstract:
A flash memory system and a flash memory thereof are provided. The flash memory device includes a NAND flash memory and a control circuit. The NAND flash memory chip includes a cache memory, a page buffer; and an NAND flash memory array. The NAND flash memory array includes a plurality of pages, wherein each page includes a plurality of sub-pages, each sub-page has a sub-page length. The cache memory is composed of a plurality of sub cache and each sub cache corresponds to different pages of the NAND flash memory array. The page buffer is composed of a plurality of sub-page buffers and each sub-page buffer corresponds to different pages of the NAND flash memory array. The control circuit is coupled to the host and the NAND flash memory, and performs an access operation in units of one sub-page.
Abstract:
A memory device and a read method thereof are provided. The read method of the memory cell array includes: reading a memory cell array to obtain page data; dividing the page data into a plurality of chunk data; performing a first error correction operation on each of the chunk data in sequence to respectively generate a plurality of first corrected chunk data; performing a second error correction operation on the page data to generate corrected page data; and outputting the corrected chunk data by referring to an indicating signal.
Abstract:
A memory device, an electronic device, and associated read method are provided. The electronic device includes the memory device and a host device, which are electrically connected to each other. The memory device includes a NAND flash memory and a control logic. The NAND flash memory includes a first physical page, and the first physical page includes a plurality of first acquisition-units. The control logic is electrically connected to the NAND flash memory. The control logic receives a first-page address corresponding to the first physical page from a host device during a first page-read duration. Data stored at the plurality of first acquisition-units are respectively transferred to the host device during a second page-read duration.
Abstract:
A memory controller, which manages a memory device, receives a memory command. The memory controller determines whether the memory command is encrypted. Upon determining that the memory command is encrypted, the memory controller performs a decryption function corresponding to the memory command. Conditioned on the performance of the decryption function resulting in a successful decryption of the memory command, the memory controller performs an operation on a memory location corresponding to a memory address included in the memory command.
Abstract:
A semiconductor memory device is provided including a plurality of diffusion region pairs comprising first and second diffusion regions, wherein each of the diffusion regions comprise source and drain regions of a bit line transistor pair comprising a first bit line transistor and a second bit line transistor and a plurality of bit line transistor gate pairs in contact with the respective diffusion region pairs, wherein the first bit line transistor gate of the bit line transistor gate pairs comprises a gate portion of a first bit line transistor of the first diffusion region and the first bit lite transistor of the second diffusion region, wherein a second bit line transistor gate of the bit line transistor gate pairs comprises a gate portion of the second bit line transistor of the first diffusion region and the second bit line transistor of the second diffusion layer.
Abstract:
The present invention provides a manufacturing method of a non-volatile memory including forming a gate dielectric layer on a substrate; forming a floating gate on the gate dielectric layer; forming a first charge blocking layer on the floating gate; forming a nitride layer on the first charge blocking layer; forming a second charge blocking layer on the nitride layer; forming a control gate on the second charge blocking layer; and performing a treatment to the nitride layer to get a higher dielectric constant.