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公开(公告)号:US20230282270A1
公开(公告)日:2023-09-07
申请号:US17686240
申请日:2022-03-03
Applicant: Micron Technology, Inc.
Inventor: Efrem Bolandrina , Andrea Martinelli , Christophe Vincent Antoine Laurent , Ferdinando Bedeschi
IPC: G11C11/408 , G11C11/4093 , G11C11/4091 , G11C11/4074
CPC classification number: G11C11/4082 , G11C11/4085 , G11C11/4093 , G11C11/4091 , G11C11/4074
Abstract: Methods, systems, and devices for parallel access in a memory array are described. A set of memory cells of a memory device may be associated with an array of conductive structures, where such structures may be coupled using a set of transistors or other switching components that are activated by a first driver. The set of memory cells may be divided into two or more subsets of memory cells, where each subset may be associated with a respective second driver for driving access currents through memory cells of the subset. Two or more of such second drivers may operate concurrently, which may support distributing current or distributing associated circuit structures across a different footprint of the memory device than other different implementations with a single such second driver.
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公开(公告)号:US11289147B2
公开(公告)日:2022-03-29
申请号:US17165529
申请日:2021-02-02
Applicant: Micron Technology, Inc.
Inventor: Umberto Di Vincenzo , Efrem Bolandrina , Riccardo Muzzetto , Ferdinando Bedeschi
Abstract: Methods, systems, and devices for sensing techniques for a memory cell are described to enable a latch to sense a logic state of a memory cell. A transistor coupled with a memory cell may boost a first voltage associated with the memory cell to a second voltage via one or more parasitic capacitances of the transistor. The second voltage may be developed on a first node of a sense component, and the second voltage may be shifted to a third voltage at a first node of the sense component by applying a voltage to a shift node coupled with a capacitor of the sense component. Similar boosting and shifting operations may be performed to develop a reference voltage on a second node of the sense component. The sense component may sense the state of the memory cell by comparing with the reference voltage.
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公开(公告)号:US09418735B2
公开(公告)日:2016-08-16
申请号:US14679745
申请日:2015-04-06
Applicant: MICRON TECHNOLOGY, INC.
Inventor: Efrem Bolandrina , Daniele Vimercati
CPC classification number: G11C13/0033 , G11C11/1653 , G11C11/1655 , G11C11/1657 , G11C11/1659 , G11C11/1673 , G11C11/1693 , G11C13/0002 , G11C13/0004 , G11C13/0023 , G11C13/0026 , G11C13/0028 , G11C13/004 , G11C13/0069 , G11C2213/79
Abstract: In one embodiment, an apparatus, such as a memory device, is disclosed. The apparatus includes a memory cell, digit line driver, access line driver, clamping element, and control circuit. The memory cell and clamping element can be both coupled to a digit line. The control circuit can be configured to cause the clamping element to clamp the voltage of the digit line for a period of time while the digit line driver is caused to bias the digit line at a voltage level sufficient to enable selection of the memory cell. In addition, the control circuit can be configured to cause the access line driver to bias an access line coupled to memory cell when the voltage of the digit line is at the voltage level sufficient to enable selection of the memory cell.
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公开(公告)号:US20240321349A1
公开(公告)日:2024-09-26
申请号:US18622033
申请日:2024-03-29
Applicant: Micron Technology, Inc.
Inventor: Christophe Vincent Antoine Laurent , Andrea Martinelli , Efrem Bolandrina , Ferdinando Bedeschi
IPC: G11C13/00
CPC classification number: G11C13/0023 , G11C13/0004 , G11C13/003 , G11C2213/71
Abstract: Methods, systems, and devices for shared decoder architecture for three-dimensional memory arrays are described. A memory device may include pillars coupled to an access line using two transistors positioned between the pillar and the access line. The gates of the two transistors may be coupled with respective gate lines coupled with circuitry configured to bias the gate line as part of an access operation for a memory cell coupled with the pillar. In some cases, the circuitry may be positioned between tiles of the memory device, at an end of one or more tiles of the memory device, between word line combs of a tile of the memory device, or a combination thereof.
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公开(公告)号:US11915740B2
公开(公告)日:2024-02-27
申请号:US17686240
申请日:2022-03-03
Applicant: Micron Technology, Inc.
Inventor: Efrem Bolandrina , Andrea Martinelli , Christophe Vincent Antoine Laurent , Ferdinando Bedeschi
IPC: G11C8/00 , G11C11/4074 , G11C11/408 , G11C11/4091 , G11C11/4093
CPC classification number: G11C11/4082 , G11C11/4074 , G11C11/4085 , G11C11/4091 , G11C11/4093
Abstract: Methods, systems, and devices for parallel access in a memory array are described. A set of memory cells of a memory device may be associated with an array of conductive structures, where such structures may be coupled using a set of transistors or other switching components that are activated by a first driver. The set of memory cells may be divided into two or more subsets of memory cells, where each subset may be associated with a respective second driver for driving access currents through memory cells of the subset. Two or more of such second drivers may operate concurrently, which may support distributing current or distributing associated circuit structures across a different footprint of the memory device than other different implementations with a single such second driver.
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公开(公告)号:US20230307041A1
公开(公告)日:2023-09-28
申请号:US17655957
申请日:2022-03-22
Applicant: Micron Technology, Inc.
Inventor: Christophe Vincent Antoine Laurent , Andrea Martinelli , Efrem Bolandrina , Ferdinando Bedeschi
IPC: G11C13/00
CPC classification number: G11C13/0023 , G11C13/0004 , G11C13/003 , G11C2213/71
Abstract: Methods, systems, and devices for shared decoder architecture for three-dimensional memory arrays are described. A memory device may include pillars coupled to an access line using two transistors positioned between the pillar and the access line. The gates of the two transistors may be coupled with respective gate lines coupled with circuitry configured to bias the gate line as part of an access operation for a memory cell coupled with the pillar. In some cases, the circuitry may be positioned between tiles of the memory device, at an end of one or more tiles of the memory device, between word line combs of a tile of the memory device, or a combination thereof.
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公开(公告)号:US20230245701A1
公开(公告)日:2023-08-03
申请号:US17588718
申请日:2022-01-31
Applicant: Micron Technology, Inc.
Inventor: Andrea Ghetti , Andrea Martinelli , Efrem Bolandrina , Ferdinando Bedeschi , Paolo Fantini
IPC: G11C13/00
CPC classification number: G11C13/0069 , G11C13/0028 , G11C13/0026 , G11C13/004 , G11C13/003 , G11C13/0004 , G11C2213/30 , G11C2213/15
Abstract: Systems, methods, and apparatus related to memory devices. In one approach, a vertical three-dimensional cross-point memory device uses digit line decoders that include, on the digit line side of memory cells, a current limiter and sensing circuit configured to control program current in either of positive or negative program polarities, as selected by a controller. Two current limiters are each used on the digit line side of each memory cell. A negative polarity current limiter is used for pull-up, and a positive polarity current limiter is used for pull-down. A negative polarity sensing circuit is used between the respective digit line decoder and a positive supply voltage. A positive polarity sensing circuit is used between the respective digit line decoder and a negative supply voltage. The current limiter and sensing circuit pair of the same polarity is coupled to each digit line decoder based on the selected program polarity.
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公开(公告)号:US11626151B2
公开(公告)日:2023-04-11
申请号:US16983469
申请日:2020-08-03
Applicant: Micron Technology, Inc.
Inventor: Ferdinando Bedeschi , Efrem Bolandrina
Abstract: Methods, systems, and devices for a single plate configuration and memory array operation are described. A non-volatile memory array may utilize a single plate to cover a subset of the array. One or more memory cells of the subset may be selected by operating the plate and an access line of an unselected memory cell at a fixed voltage. A second voltage may be applied to an access line of the selected cell, and subsequently reduced to perform an access operation. Removing the applied voltage may allow for the memory cell to undergo a recovery period prior to a subsequent access operation.
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公开(公告)号:US11545219B2
公开(公告)日:2023-01-03
申请号:US16975619
申请日:2020-03-24
Applicant: Micron Technology, Inc.
Inventor: Ferdinando Bedeschi , Efrem Bolandrina , Umberto Di Vincenzo , Riccardo Muzzetto
Abstract: A memory device with single transistor drivers and methods to operate the memory device are described. In some embodiments, the memory device may comprise memory cells at cross points of access lines of a memory array, a first even single transistor driver configured to drive a first even access line to a discharging voltage during an IDLE phase, to drive the first even access line to a floating voltage during an ACTIVE phase, and to drive the first even access line to a read/program voltage during a PULSE phase, and a first odd single transistor driver configured to drive a first odd access line, the first odd access line physically adjacent to the first even access line, to the discharging voltage during the IDLE phase, to drive the first odd access line to the floating voltage during the ACTIVE phase, and to drive the first odd access line to a shielding voltage during the PULSE phase.
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公开(公告)号:US20220013157A1
公开(公告)日:2022-01-13
申请号:US17381976
申请日:2021-07-21
Applicant: Micron Technology, Inc.
Inventor: Graziano Mirichigni , Efrem Bolandrina
IPC: G11C8/08 , G06F3/06 , G11C11/22 , G11C11/408 , G11C7/10 , G11C7/22 , G11C11/4096
Abstract: Techniques herein may allow a row of a subarray in a bank of a memory device to be activated before a precharge operation has been completed for a previously opened row of memory cells in the same bank. Each subarray within the bank may be associated with a respective local latching circuit, which may be used to maintain phases at the subarray independent of subsequent commands to the same bank. For example, the latching circuit may internalize timing signals triggered by a precharge command for a first row such that if an activation command is received for a different subarray in the same bank at a time before the precharge operation of the first row is complete, the precharge operation may continue until the first row is closed, as the timing signals triggered by the precharge command may be maintained locally at the subarray using the latching circuit.
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