Mounting apparatus, recognition device and recognition method for electronic component
    11.
    发明授权
    Mounting apparatus, recognition device and recognition method for electronic component 有权
    电子元件的安装装置,识别装置及识别方法

    公开(公告)号:US06285782B1

    公开(公告)日:2001-09-04

    申请号:US09350707

    申请日:1999-07-09

    CPC classification number: H05K13/0812

    Abstract: An electronic component mounting apparatus, an electronic component recognition device and an electronic component recognition method are provided which enable accurate recognition for correcting deviations in alignment of an electronic component in relation to its mounting position. An electronic component being held by a mounting head is illuminated, and a camera visually recognizes the electronic component. A light reflector disposed on a bottom face of the mounting head has a reflector for totally reflecting light, an illuminating body disposed on the reflector which illuminates by absorbing light from a first light source, and a selectively transmitting body disposed on the illuminating body which transmits light from the first light source and absorbs light from a second light source. This configuration causes the light entering the camera from the light reflector to be even. Two lighting methods, i.e. transillumination and illumination provided by reflection, are selectively used by switching the first and second light sources to select the kind of light.

    Abstract translation: 提供一种电子部件安装装置,电子部件识别装置和电子部件识别方法,其能够准确识别电子部件相对于其安装位置的对准偏差。 由安装头保持的电子部件被照亮,并且相机在视觉上识别电子部件。 设置在安装头的底面上的光反射器具有用于全反射光的反射器,设置在反射器上的照明体,其通过吸收来自第一光源的光而照射;以及选择性透射体,其布置在照明体上, 来自第一光源的光并且吸收来自第二光源的光。 该配置使得从光反射器进入相机的光是均匀的。 通过切换第一和第二光源来选择这种类型的光,有选择地使用两种照明方法,即通过反射提供的透照和照明。

    Sheet Feeders and Image Forming Apparatuses Having the Same
    15.
    发明申请
    Sheet Feeders and Image Forming Apparatuses Having the Same 有权
    具有相同功能的送纸器和图像形成装置

    公开(公告)号:US20130082439A1

    公开(公告)日:2013-04-04

    申请号:US13600391

    申请日:2012-08-31

    Applicant: Masafumi Inoue

    Inventor: Masafumi Inoue

    Abstract: A sheet feeder is provided that includes a feeding unit configured to feed a sheet through a feeding path and a guide portion that is bent in a shape of a relaxation curve and configured to feed the sheet thereon and turn a feeding direction of the sheet.

    Abstract translation: 提供了一种进纸单元,其包括:进给单元,其构造成通过进给路径进给纸张;以及引导部分,其弯曲成松弛曲线的形状并且构造成在其上进给纸张并转动纸张的进给方向。

    Polishing apparatus and program thereof
    16.
    发明授权
    Polishing apparatus and program thereof 有权
    抛光装置及其程序

    公开(公告)号:US08206197B2

    公开(公告)日:2012-06-26

    申请号:US12596333

    申请日:2008-04-17

    Abstract: A polishing apparatus includes a loading section (14) for placing therein a cassette (12) in which a plurality of polishing objects are housed; a first polishing line (20) and a second polishing line (30) for polishing a polishing object; a cleaning line (40) having cleaning machines (42a, 42b, 42c, 42d) for cleaning the polishing object after polishing and a transport unit (44) for transporting the polishing object; a transport mechanism (50) for transporting the polishing object between the loading section (14), the polishing lines (20, 30) and the cleaning line (40); and a control section for controlling the polishing lines (20, 30), the cleaning line (40) and the transport mechanism (50). The control section determines a polishing start time in each of the first and second polishing lines (20, 30) based on a predicted polishing time in each of the first and second polishing lines (20, 30), a predicted transport time in the transport mechanism (50), a predicted cleaning time in the cleaning line (40) and a predicted cleaning start time to start cleaning by driving the transport unit (44) of the cleaning line (40).

    Abstract translation: 抛光装置包括用于放置其中容纳有多个抛光对象的盒(12)的装载部(14); 用于抛光抛光对象的第一抛光线(20)和第二抛光线(30); 清洁线(40),其具有用于清洁抛光后的抛光对象物的清洁机(42a,42b,42c,42d)和用于输送抛光对象物的输送单元(44) 用于在加载部分(14),抛光线(20,30)和清洁线(40)之间传送抛光对象的传送机构(50); 以及用于控制研磨线(20,30),清洁线(40)和输送机构(50)的控制部。 控制部分基于第一和第二研磨线(20,30)中的每一个中的预测的抛光时间来确定第一和第二抛光线(20,30)中的每一个中的抛光开始时间,运送中预测的运送时间 机构(50),清洁管线(40)中的预测清洁时间和通过驱动清洗管线(40)的输送单元(44)开始清洁的预测清洁开始时间。

    METHOD AND/OR PRIMERS FOR THE DETECTION OF MYCOBACTERIUM TUBERCULOSIS
    17.
    发明申请
    METHOD AND/OR PRIMERS FOR THE DETECTION OF MYCOBACTERIUM TUBERCULOSIS 审中-公开
    用于检测MYCOBACTERIUM TUBERCULOSIS的方法和/或引导剂

    公开(公告)号:US20120100545A1

    公开(公告)日:2012-04-26

    申请号:US13382056

    申请日:2010-07-05

    CPC classification number: C12Q1/689

    Abstract: The invention provides oligonucleotide(s) for simple, specific and/or sensitive test(s) for the presence of Mycobacterium tuberculosis. In particular, the present invention provides oligonucleotide(s) for test(s) for Mycobacterium tuberculosis. Kit(s) comprising the oligonucleotide(s) for use as probe(s) and/or primer(s) useful in the test(s) are also provided.

    Abstract translation: 本发明提供了用于存在结核分枝杆菌的简单,特异性和/或敏感性测试的寡核苷酸。 特别地,本发明提供了用于测试结核分枝杆菌的寡核苷酸。 还提供了包含用作试验用的探针和/或引物的寡核苷酸的试剂盒。

    ELECTRONIC COMPONENT MOUNTING SYSTEM, ELECTRONIC COMPONENT PLACING APPARATUS, AND ELECTRONIC COMPONENT MOUNTING METHOD
    18.
    发明申请
    ELECTRONIC COMPONENT MOUNTING SYSTEM, ELECTRONIC COMPONENT PLACING APPARATUS, AND ELECTRONIC COMPONENT MOUNTING METHOD 有权
    电子元件安装系统,电子元件放置装置和电子元件安装方法

    公开(公告)号:US20090014501A1

    公开(公告)日:2009-01-15

    申请号:US12162588

    申请日:2007-03-26

    Abstract: Regarding electronic component mounting in which an electronic component having plural solder bumps for external connection on its lower surface is mounted on a board, in an electronic component mounting operation of previously measuring the height position of solder paste on the board on which the solder paste has been printed, and mounting the electronic component on the board on which the solder paste has been printed by a loading head, whether the transfer of the solder paste to the solder bumps is necessary or not is judged on the basis of the measurement result of the height of the solder paste. In case that it is judged that the transfer is necessary, the transfer of the solder paste is executed, and thereafter the electronic component is mounted on the board. Hereby, it is possible to prevent the poor joint in case that a thin-sized semiconductor package which causes easily warp deformation is mounted on the board by solder-joint.

    Abstract translation: 关于电子部件安装,其中具有在其下表面上具有用于外部连接的多个焊料凸块的电子部件安装在板上,在预先测量焊膏的焊膏的高度位置的电子部件安装操作中, 并且通过装载头将电子部件安装在印刷了焊锡膏的印刷电路板上,是否需要焊锡膏向焊料凸块的转印是否需要根据 锡膏的高度。 在判断需要进行转印的情况下,执行焊膏的转印,之后将电子部件安装在基板上。 因此,通过焊接将能够容易翘曲变形的薄型半导体封装安装在基板上的情况下,可以防止不良接合。

    Polishing apparatus
    19.
    发明授权
    Polishing apparatus 失效
    抛光设备

    公开(公告)号:US07270594B2

    公开(公告)日:2007-09-18

    申请号:US11602336

    申请日:2006-11-21

    CPC classification number: B24B47/22 B24B37/30 B24B49/16 H01L21/30625

    Abstract: A polishing apparatus has a polishing table (12) with a polishing surface (10) attached thereon, and a top ring (20) for pressing a workpiece (W) against the polishing surface (10). The top ring (20) has a housing (40) and a retainer ring (44) vertically movable in the housing (40) for holding an outer circumferential edge of the workpiece (W). The polishing apparatus includes a vertically moving mechanism operable to vertically move the top ring (20), a bracket (28) vertically movable together with the top ring (20), a stopper (32) adjustable in vertical position to prevent downward movement of the bracket (28), and a sensor (36) for detecting a distance between the stopper (32) and the bracket (28). The polishing apparatus also includes a control unit (34) operable to adjust the stopper (32) in vertical position when the retainer ring (44) is brought into contact with the polishing surface (10) while a lower surface of the housing (40) of the top ring (20) is located at a predetermined height from the polishing surface (10) so that the distance between the stopper (32) and the bracket (28) is equal to a difference between a height of the lower surface of the housing (40) from the polishing surface (10) at the time of polishing and the predetermined height.

    Abstract translation: 抛光装置具有安装有研磨面(10)的研磨台(12)和用于将工件(W)压靠在研磨面(10)上的顶环(20)。 顶环(20)具有壳体(40)和可在壳体(40)中垂直移动以用于保持工件(W)的外周边缘的保持环(44)。 所述抛光装置包括可垂直移动所述顶环(20)的垂直移动机构,与所述顶环(20)一起可垂直移动的托架(28);可在垂直位置上调节的止动件(32),以防止所述顶环 支架(28)和用于检测止动件(32)和支架(28)之间的距离的传感器(36)。 抛光装置还包括控制单元(34),当保持环(44)与抛光表面(10)接触时,可操作以在垂直位置调节止动件(32),而壳体(40)的下表面 所述顶环(20)位于距所述研磨面(10)的预定高度处,使得所述止动件(32)与所述支架(28)之间的距离等于 在抛光时从抛光表面(10)的外壳(40)和预定的高度。

    Polishing apparatus
    20.
    发明授权
    Polishing apparatus 失效
    抛光设备

    公开(公告)号:US07156719B2

    公开(公告)日:2007-01-02

    申请号:US10530277

    申请日:2003-11-04

    CPC classification number: B24B47/22 B24B37/30 B24B49/16 H01L21/30625

    Abstract: A polishing apparatus has a polishing table (12) with a polishing surface (10) attached thereon, and a top ring (20) for pressing a workpiece (W) against the polishing surface (10). The top ring (20) has a housing (40) and a retainer ring (44) vertically movable in the housing (40) for holding an outer circumferential edge of the workpiece (W). The polishing apparatus includes a vertically moving mechanism operable to vertically move the top ring (20), a bracket (28) vertically movable together with the top ring (20), a stopper (32) adjustable in vertical position to prevent downward movement of the bracket (28), and a sensor (36) for detecting a distance between the stopper (32) and the bracket (28). The polishing apparatus also includes a control unit (34) operable to adjust the stopper (32) in vertical position when the retainer ring (44) is brought into contact with the polishing surface (10) while a lower surface of the housing (40) of the top ring (20) is located, at a predetermined height from the polishing surface (10) so that the distance between the stopper (32) and the bracket (28) is equal to a difference between a height of the lower surface of the housing (40) from the polishing surface (10) at the time of polishing and the predetermined height.

    Abstract translation: 抛光装置具有安装有研磨面(10)的研磨台(12)和用于将工件(W)压靠在研磨面(10)上的顶环(20)。 顶环(20)具有壳体(40)和可在壳体(40)中垂直移动以用于保持工件(W)的外周边缘的保持环(44)。 所述抛光装置包括可垂直移动所述顶环(20)的垂直移动机构,与所述顶环(20)一起可垂直移动的托架(28);可在垂直位置上调节的止动件(32),以防止所述顶环 支架(28)和用于检测止动件(32)和支架(28)之间的距离的传感器(36)。 抛光装置还包括控制单元(34),当保持环(44)与抛光表面(10)接触时,可操作以在垂直位置调节止动件(32),而壳体(40)的下表面 所述顶环(20)的距离与所述抛光表面(10)的预定高度相对应,使得所述止动件(32)和所述支架(28)之间的距离等于 在抛光时来自抛光表面(10)的壳体(40)和预定高度。

Patent Agency Ranking