公开(公告)号：US20200348349A1

公开(公告)日：2020-11-05

申请号：US16931912

申请日：2020-07-17

Applicant: Micron Technology, Inc.

Inventor： Paul E. Gregory ,  Randon K. Richards

IPC: G01R31/00 ,  G01R31/44 ,  G01R1/067

Abstract: The present disclosure includes apparatuses and methods related to test devices, for example testing devices by measuring signals emitted by a device. One example apparatus can include a first portion including a number of sidewalls positioned to at least partially surround a device under test; and a second portion electrically coupled to the first portion, wherein the second portion is configured to move in the x-direction, the y-direction, and z-direction.

公开(公告)号：US10718805B2

公开(公告)日：2020-07-21

申请号：US15606109

申请日：2017-05-26

Applicant: Micron Technology, Inc.

Inventor： Paul E. Gregory ,  Randon K. Richards

IPC: G01R31/00 ,  G01R31/44 ,  G01R1/067

Abstract: The present disclosure includes apparatuses and methods related to test devices, for example testing devices by measuring signals emitted by a device. One example apparatus can include a first portion including a number of sidewalls positioned to at least partially surround a device under test; and a second portion electrically coupled to the first portion, wherein the second portion is configured to move in the x-direction, the y-direction, and z-direction.

公开(公告)号：US11961825B2

公开(公告)日：2024-04-16

申请号：US17805818

申请日：2022-06-07

Applicant: Micron Technology, Inc.

Inventor： Aparna U. Limaye ,  Dong Soon Lim ,  Randon K. Richards ,  Owen R. Fay

IPC: H01L23/552 ,  H01L21/66 ,  H01L21/78 ,  H01L23/00 ,  H01L23/64 ,  H01L23/66 ,  H01L25/00 ,  H01L25/065 ,  H01L25/18 ,  H01Q1/22 ,  H01Q1/48

CPC classification number: H01L25/0657 ,  H01L21/78 ,  H01L22/12 ,  H01L23/552 ,  H01L23/645 ,  H01L23/66 ,  H01L24/08 ,  H01L24/80 ,  H01L25/0652 ,  H01L25/18 ,  H01L25/50 ,  H01Q1/2283 ,  H01Q1/48 ,  H01L2223/6677 ,  H01L2224/08145 ,  H01L2224/80895 ,  H01L2224/80896 ,  H01L2225/06531 ,  H01L2225/06537 ,  H01L2225/06548 ,  H01L2225/06586 ,  H01L2225/06589 ,  H01L2924/1431 ,  H01L2924/1436 ,  H01L2924/1443 ,  H01L2924/14511 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/19105 ,  H01L2924/3025

Abstract: Disclosed is a microelectronic device assembly comprising a substrate having conductors exposed on a surface thereof. Two or more stacks of microelectronic devices are located on the substrate, and microelectronic devices of the stacks are connected to vertical conductive paths external to the stacks and extending to the substrate and to lateral conductive paths extending between the stacks. Methods of fabrication are also disclosed.

公开(公告)号：US11948921B2

公开(公告)日：2024-04-02

申请号：US17932401

申请日：2022-09-15

Applicant: Micron Technology, Inc.

Inventor： Randon K. Richards ,  Aparna U. Limaye ,  Owen R. Fay ,  Dong Soon Lim

IPC: H01L23/48 ,  H01L21/66 ,  H01L21/78 ,  H01L23/00 ,  H01L23/52 ,  H01L23/552 ,  H01L23/64 ,  H01L23/66 ,  H01L25/00 ,  H01L25/065 ,  H01L25/18 ,  H01L29/40 ,  H01Q1/22 ,  H01Q1/48

CPC classification number: H01L25/0657 ,  H01L21/78 ,  H01L22/12 ,  H01L23/552 ,  H01L23/645 ,  H01L23/66 ,  H01L24/08 ,  H01L24/80 ,  H01L25/0652 ,  H01L25/18 ,  H01L25/50 ,  H01Q1/2283 ,  H01Q1/48 ,  H01L2223/6677 ,  H01L2224/08145 ,  H01L2224/80895 ,  H01L2224/80896 ,  H01L2225/06531 ,  H01L2225/06537 ,  H01L2225/06548 ,  H01L2225/06586 ,  H01L2225/06589 ,  H01L2924/1431 ,  H01L2924/1436 ,  H01L2924/1443 ,  H01L2924/14511 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/19105 ,  H01L2924/3025

Abstract: Disclosed is a microelectronic device assembly comprising a substrate having conductors exposed on a surface thereof. Two or more microelectronic devices are stacked on the substrate and the components are connected with conductive material in preformed holes in dielectric material in the bond lines aligned with TSVs of the devices and the exposed conductors of the substrate. Methods of fabrication are also disclosed.

公开(公告)号：US11830578B2

公开(公告)日：2023-11-28

申请号：US17992651

申请日：2022-11-22

Applicant: Micron Technology, Inc.

Inventor： Randon K. Richards ,  Dirgha Khatri

IPC: G11C7/22 ,  G11C8/18 ,  G06F13/16 ,  G11C11/4076 ,  G11C11/4093

CPC classification number: G11C7/222 ,  G06F13/1689 ,  G11C8/18 ,  G11C11/4076 ,  G11C11/4093

Abstract: Methods, systems, and apparatuses for managing clock signals at a memory device are described. A memory device or other component of a memory module or electronic system may offset a received clock signal. For example, the memory device may receive a clock signal that has a nominal speed or frequency of operation for a system, and the memory device may adjust or offset the clock signal based on other operating factors, such as the speed or frequency of other signals, physical constraints, indications received from a host device, or the like. A clock offset value may be based on propagation of, for example, command/address signaling. In some examples, a memory module may include a registering clock driver (RCD), hub, or local controller that may manage or coordinate clock offsets among or between various memory devices on the module. Clock offset values may be programmed to a mode register or registers.

公开(公告)号：US20230090116A1

公开(公告)日：2023-03-23

申请号：US17992651

申请日：2022-11-22

Applicant: Micron Technology, Inc.

Inventor： Randon K. Richards ,  Dirgha Khatri

IPC: G11C7/22 ,  G11C8/18 ,  G06F13/16 ,  G11C11/4076 ,  G11C11/4093

Abstract: Methods, systems, and apparatuses for managing clock signals at a memory device are described. A memory device or other component of a memory module or electronic system may offset a received clock signal. For example, the memory device may receive a clock signal that has a nominal speed or frequency of operation for a system, and the memory device may adjust or offset the clock signal based on other operating factors, such as the speed or frequency of other signals, physical constraints, indications received from a host device, or the like. A clock offset value may be based on propagation of, for example, command/address signaling. In some examples, a memory module may include a registering clock driver (RCD), hub, or local controller that may manage or coordinate clock offsets among or between various memory devices on the module. Clock offset values may be programmed to a mode register or registers.

公开(公告)号：US11416437B2

公开(公告)日：2022-08-16

申请号：US16720976

申请日：2019-12-19

Applicant: Micron Technology, Inc.

Inventor： Thomas H. Kinsley ,  George E. Pax ,  Timothy M. Hollis ,  Yogesh Sharma ,  Randon K. Richards ,  Chan H. Yoo ,  Gregory A. King ,  Eric J. Stave

IPC: G06F13/42 ,  G11C7/10 ,  G06F11/10

Abstract: An apparatus is provided, comprising a plurality of memory devices and a buffering device that permits memory devices with a variety of physical dimensions and memory formats to be used in an industry-standard memory module format. The buffering device includes memory interface circuitry and at least one first-in first-out (FIFO) or multiplexer circuit. The apparatus further comprises a parallel bus connecting the buffering device to the plurality of memory devices. The parallel bus includes a plurality of independent control lines, each coupling the memory interface circuitry to a corresponding subset of a plurality of first subsets of the plurality of memory devices. The parallel bus further includes a plurality of independent data channels, each coupling the at least one FIFO circuit or multiplexer circuit to a corresponding subset of a plurality of second subsets of the plurality of memory devices.

公开(公告)号：US11206749B2

公开(公告)日：2021-12-21

申请号：US16530792

申请日：2019-08-02

Applicant: Micron Technology, Inc.

Inventor： Thomas H. Kinsley ,  George E. Pax ,  Yogesh Sharma ,  Gregory A. King ,  Chan H. Yoo ,  Randon K. Richards

IPC: H05K7/20 ,  H01L23/367 ,  H01L23/373 ,  G06F1/20 ,  H01L23/467

Abstract: Systems, apparatuses, and methods for thermal dissipation on or from an electronic device are described. For example, a memory module may have a printed circuit board (PCB) having an edge connector, a plurality of memory devices disposed on a surface of the PCB, and a tubular heat spreader disposed along an edge of the PCB opposite the edge connector. The tubular heat spreader may comprise a tubular portion open at both ends thereof to permit the through flow of a cooling gas; and two planar elements extending in parallel away from the tubular portion and configured to provide a friction fit with the memory module. Each of the planar elements may be configured to convey thermal energy from the memory module to the tubular portion.

公开(公告)号：US20210118849A1

公开(公告)日：2021-04-22

申请号：US16939650

申请日：2020-07-27

Applicant: Micron Technology, Inc.

Inventor： Aparna U. Limaye ,  Dong Soon Lim ,  Randon K. Richards ,  Owen R. Fay

IPC: H01L25/065 ,  H01L25/18 ,  H01L23/00 ,  H01L23/552 ,  H01L23/64 ,  H01L21/78 ,  H01L21/66 ,  H01L25/00

Abstract: Disclosed is a microelectronic device assembly comprising a substrate having conductors exposed on a surface thereof. Two or more stacks of microelectronic devices are located on the substrate, and microelectronic devices of the stacks are connected to vertical conductive paths external to the stacks and extending to the substrate and to lateral conductive paths extending between the stacks. Methods of fabrication are also disclosed.

公开(公告)号：US20210037679A1

公开(公告)日：2021-02-04

申请号：US16530792

申请日：2019-08-02

Applicant: Micron Technology, Inc.

Inventor： Thomas H. Kinsley ,  George E. Pax ,  Yogesh Sharma ,  Gregory A. King ,  Chan H. Yoo ,  Randon K. Richards

IPC: H05K7/20 ,  H01L23/367 ,  H01L23/373 ,  H01L23/467 ,  G06F1/20

Abstract: Systems, apparatuses, and methods for thermal dissipation on or from an electronic device are described. For example, a memory module may have a printed circuit board (PCB) having an edge connector, a plurality of memory devices disposed on a surface of the PCB, and a tubular heat spreader disposed along an edge of the PCB opposite the edge connector. The tubular heat spreader may comprise a tubular portion open at both ends thereof to permit the through flow of a cooling gas; and two planar elements extending in parallel away from the tubular portion and configured to provide a friction fit with the memory module. Each of the planar elements may be configured to convey thermal energy from the memory module to the tubular portion.