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公开(公告)号：US07794112B2
公开(公告)日：2010-09-14
申请号：US11984930
申请日：2007-11-26
IPC分类号： F21V1/00
CPC分类号： F21V11/16 , F21K9/00 , F21Y2115/10 , H01L33/58 , H01L33/60 , H01L2224/16225 , H01L2924/16195
摘要： It is a lighting apparatus 10 that has a light emitting element 16, a light emitting element housing 15 having a concave portion 28 that accommodates the light emitting element 16, and an optically transparent member 18 that airproofs a space B formed by the concave portion 28 and transmits light emitted from the light emitting element 16. The concave portion 28 is shaped to become wider toward the optically transparent member 18 from the bottom surface 28A of the concave portion 28. The lighting apparatus 10 is provided with a light shielding member 12 for shielding a part of light emitted from the light emitting element 16 is provided on the optically transparent member 18.
摘要翻译： 它是具有发光元件16，具有容纳发光元件16的凹部28的发光元件壳体15的照明装置10以及对由凹部28形成的空间B进行空气隔绝的光学透明构件18 并且透射从发光元件16发射的光。凹部28从凹部28的底面28A朝向光学透明构件18变宽。照明装置10设置有遮光构件12， 屏蔽从发光元件16发射的光的一部分设置在光学透明构件18上。
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公开(公告)号：US07508057B2
公开(公告)日：2009-03-24
申请号：US11892069
申请日：2007-08-20
IPC分类号： H01L23/06
CPC分类号： B81B7/007 , B81B2207/012 , H01L2224/48091 , H01L2224/48145 , H01L2224/73265 , H01L2924/1461 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： An electronic component device of the present invention includes: a silicon package unit having a structure in which a through electrode provided to a silicon substrate while an electrode post connected to the through electrode is provided upright on an upper side of the silicon substrate; an electronic component mounted on the electrode post and having a connection terminal connected to the top end of the electrode post; and a cap package unit joined onto a periphery of the silicon package unit, and constructing a housing portion in which the electronic component is housed to be hermetically sealed.
摘要翻译： 本发明的电子部件装置包括：具有如下结构的硅封装单元，其中设置在硅基板上的通孔与连接到贯通电极的电极柱直立设置在硅衬底的上侧; 安装在所述电极柱上并具有连接到所述电极柱的顶端的连接端子的电子部件; 以及连接到所述硅封装单元的周边上的盖封装单元，以及构成容纳所述电子部件的壳体部分以进行气密密封。
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公开(公告)号：US07488094B2
公开(公告)日：2009-02-10
申请号：US11644977
申请日：2006-12-26
申请人： Kei Murayama , Akinori Shiraishi , Masahiro Sunohara , Naoyuki Koizumi , Hideaki Sakaguchi , Mitsutoshi Higashi , Yuichi Taguchi
发明人： Kei Murayama , Akinori Shiraishi , Masahiro Sunohara , Naoyuki Koizumi , Hideaki Sakaguchi , Mitsutoshi Higashi , Yuichi Taguchi
IPC分类号： F21V5/00
CPC分类号： H01L33/58 , H01L24/97 , H01L33/507 , H01L33/62 , H01L2224/16 , H01L2224/16225 , H01L2224/48091 , H01L2224/48227 , H01L2924/01029 , H01L2924/12041 , H01L2924/00012 , H01L2924/00014
摘要： A semiconductor device made by mounting a light emitting element on a substrate, where an optically-transparent cover with a flat plate shape is installed on the light emitting element and a groove part for suppressing reflection of light emission of the light emitting element is formed in the cover.
摘要翻译： 通过将发光元件安装在基板上而制成的半导体器件，其中在发光元件上安装有平板形状的光学透明盖，并且形成用于抑制发光元件的发光反射的槽部 封面。
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14.发明申请公开(公告)号：US20080123344A1
公开(公告)日：2008-05-29
申请号：US11773155
申请日：2007-07-03
CPC分类号： H01L33/60 , H01L25/0753 , H01L33/486 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/48235 , H01L2224/73265 , H01L2924/3025 , Y10S362/80 , H01L2924/00014 , H01L2924/00
摘要： A light emitting device housing having a concave part is provided therein for housing a light emitting device. Side surfaces of the concave part are each configured to be a perpendicular surface that is substantially perpendicular to a bottom surface of the concave part, and other side surfaces are each configured to be an inclined surface for reflecting light from the light emitting device toward above the light emitting device.
摘要翻译： 在其中设置有具有凹部的发光器件壳体，用于容纳发光器件。 凹部的侧面分别构成为大致垂直于凹部的底面的垂直面，其他侧面各自构成为将来自发光元件的光向上方倾斜的倾斜面 发光装置。
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公开(公告)号：US20080029852A1
公开(公告)日：2008-02-07
申请号：US11882568
申请日：2007-08-02
申请人： Kei Murayama , Yuichi Taguchi , Naoyuki Koizumi , Masahiro Sunohara , Akinori Shiraishi , Mitsutoshi Higashi
发明人： Kei Murayama , Yuichi Taguchi , Naoyuki Koizumi , Masahiro Sunohara , Akinori Shiraishi , Mitsutoshi Higashi
CPC分类号： H01L23/055 , B81B2207/012 , B81C1/0023 , H01L23/13 , H01L23/147 , H01L23/49822 , H01L23/49827 , H01L23/49838 , H01L2224/16 , H01L2224/16235 , H01L2924/00011 , H01L2924/00014 , H01L2924/01078 , H01L2924/1461 , H01L2924/15153 , H01L2924/1517 , H01L2924/1532 , H01L2924/16195 , H01L2924/00 , H01L2224/0401
摘要： A semiconductor device includes a laminated substrate formed by laminating a plurality of semiconductor substrates, a concave part formed in the laminated substrate, and a semiconductor element mounted in the concave part. A method of manufacturing a semiconductor device includes a first step of forming a laminated substrate by laminating a plurality of semiconductor substrates, a second step of forming a concave part by etching the laminated substrate, and a third step of mounting a semiconductor element in the concave part.
摘要翻译： 半导体器件包括通过层叠多个半导体衬底，形成在层叠衬底中的凹部和安装在凹部中的半导体元件而形成的层叠衬底。 一种制造半导体器件的方法包括：通过层叠多个半导体衬底形成层叠衬底的第一步骤，通过蚀刻层叠衬底形成凹部的第二步骤，以及将半导体元件安装在凹部中的第三步骤 部分。
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公开(公告)号：US20070194712A1
公开(公告)日：2007-08-23
申请号：US11700761
申请日：2007-02-01
申请人： Akinori Shiraishi , Yuichi Taguchi , Masahiro Sunohara , Hideaki Sakaguchi , Naoyuki Koizumi , Kei Murayama , Mitsutoshi Higashi
发明人： Akinori Shiraishi , Yuichi Taguchi , Masahiro Sunohara , Hideaki Sakaguchi , Naoyuki Koizumi , Kei Murayama , Mitsutoshi Higashi
IPC分类号： H01L33/00
CPC分类号： H01L33/58 , H01L24/97 , H01L33/44 , H01L33/507 , H01L33/60 , H01L2224/13 , H01L2224/48091 , H01L2924/12041 , H01L2924/00014 , H01L2924/00
摘要： In a semiconductor device 100, a light emitting device 102 is mounted on a substrate 101. A light reflection preventing film 130 for preventing a reflection of a light is formed on an upper surface of the light emitting device 102. Moreover, a plate-shaped cover 103 formed of a glass having a light transparency is disposed above the light emitting device 102, and a light reflection preventing film 140 for preventing a reflection of a light is also formed on an upper surface of the cover 103.
摘要翻译： 在半导体装置100中，发光装置102安装在基板101上。 在发光装置102的上表面上形成用于防止光反射的光反射防止膜130。 此外，由发光元件102的上方配置由具有透光性的玻璃构成的板状的盖103，在盖103的上表面也形成防止光反射的防光膜140 。
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公开(公告)号：US20070181778A1
公开(公告)日：2007-08-09
申请号：US11671167
申请日：2007-02-05
申请人： Naoyuki Koizumi , Masahiro Sunohara , Akinori Shiraishi , Yuichi Taguchi , Kei Murayama , Hideaki Sakaguchi , Mitsutoshi Higashi
发明人： Naoyuki Koizumi , Masahiro Sunohara , Akinori Shiraishi , Yuichi Taguchi , Kei Murayama , Hideaki Sakaguchi , Mitsutoshi Higashi
IPC分类号： H01L27/00
CPC分类号： G03B21/208 , G03B21/008 , G03B21/145 , H04N9/315
摘要： The optical device 10 includes a light source 13, a mirror element 12 including a mirror 36 for reflecting light emitted from the light source 13 in a predetermined direction, and a mirror element housing body 11 that accommodates the mirror element 12 as well as seals a space D where the mirror element 12 is accommodated, characterized in that the light source 13 is provided inside the mirror element housing body 11.
摘要翻译： 光学装置10包括光源13，反射镜元件12，其包括反射镜36，反射镜36用于反射从光源13沿预定方向发射的光;以及镜元件壳体11，其容纳镜元件12以及密封 其中容纳镜子元件12的空间D，其特征在于，光源13设置在镜元件壳体11的内部。
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公开(公告)号：US20070145404A1
公开(公告)日：2007-06-28
申请号：US11644977
申请日：2006-12-26
申请人： Kei Murayama , Akinori Shiraishi , Masahiro Sunohara , Naoyuki Koizumi , Hideaki Sakaguchi , Mitsutoshi Higashi , Yuichi Taguchi
发明人： Kei Murayama , Akinori Shiraishi , Masahiro Sunohara , Naoyuki Koizumi , Hideaki Sakaguchi , Mitsutoshi Higashi , Yuichi Taguchi
IPC分类号： H01L33/00
CPC分类号： H01L33/58 , H01L24/97 , H01L33/507 , H01L33/62 , H01L2224/16 , H01L2224/16225 , H01L2224/48091 , H01L2224/48227 , H01L2924/01029 , H01L2924/12041 , H01L2924/00012 , H01L2924/00014
摘要： A semiconductor device made by mounting a light emitting element on a substrate, where an optically-transparent cover with a flat plate shape is installed on the light emitting element and a groove part for suppressing reflection of light emission of the light emitting element is formed in the cover.
摘要翻译： 通过将发光元件安装在基板上而制成的半导体器件，其中在发光元件上安装有平板形状的光学透明盖，并且形成用于抑制发光元件的发光反射的槽部 封面。
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公开(公告)号：US08368206B2
公开(公告)日：2013-02-05
申请号：US12187641
申请日：2008-08-07
IPC分类号： H01L33/64
CPC分类号： H05K3/107 , H01L23/3735 , H01L23/49861 , H01L33/483 , H01L33/62 , H01L33/641 , H01L33/647 , H01L2224/16 , H05K1/0203 , H05K1/0263 , H05K1/0306 , H05K3/0061 , H05K3/108 , H05K2201/10106
摘要： A heat radiation package of the present invention includes a substrate in an upper surface side of which recess portion is provided, embedded wiring portion which is filled in the recess portion of the substrate and on which semiconductor element which generates a heat is mounted, and a heat sink connected to a lower surface side of the substrate. The substrate is made of silicon, ceramics, or insulating resin.
摘要翻译： 本发明的散热封装包括设置有凹部的上表面侧的基板，填充在基板的凹部内并嵌入有发热部件的半导体元件的嵌入布线部， 散热器连接到基板的下表面侧。 基板由硅，陶瓷或绝缘树脂制成。
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20.发明授权Semiconductor device having an element mounted on a substrate and an electrical component connected to the element 有权具有安装在基板上的元件和连接到元件的电气元件的半导体器件公开(公告)号：US08148738B2
公开(公告)日：2012-04-03
申请号：US11812149
申请日：2007-06-15
申请人： Kei Murayama , Mitsutoshi Higashi , Naoyuki Koizumi , Yuichi Taguchi , Akinori Shiraishi , Masahiro Sunohara
发明人： Kei Murayama , Mitsutoshi Higashi , Naoyuki Koizumi , Yuichi Taguchi , Akinori Shiraishi , Masahiro Sunohara
IPC分类号： H01L31/12
CPC分类号： H01L25/167 , H01L23/147 , H01L23/4926 , H01L23/62 , H01L24/48 , H01L25/16 , H01L2224/32145 , H01L2224/48137 , H01L2224/4823 , H01L2224/73265 , H01L2924/00014 , H01L2924/01078 , H01L2924/01079 , H01L2924/12035 , H01L2924/12041 , H01L2924/14 , H01L2924/1461 , H01L2924/181 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： In a semiconductor device 100, a light emitting element 120 has been mounted on an upper plane of a semiconductor substrate 102. In an impurity diffusion region of the semiconductor substrate 102, a P conducting type of a layer 104, and an N layer 106 have been formed, while an N conducting type impurity is implanted to the P layer 104, and then the implanted impurity is diffused to constitute the N layer 106. A zener diode 108 made of a semiconductor device has been formed by the P layer 104 and the N layer 106.
摘要翻译： 在半导体器件100中，发光元件120已经被安装在半导体衬底102的上平面上。在半导体衬底102的杂质扩散区域中，P导电类型的层104和N层106具有 形成N导电型杂质，然后将N导电型杂质注入到P层104中，然后将注入的杂质扩散以构成N层106.由P层104形成由半导体器件制成的齐纳二极管108， N层106。
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