RESIN COMPOSITION
    16.
    发明申请

    公开(公告)号:US20250075067A1

    公开(公告)日:2025-03-06

    申请号:US18481241

    申请日:2023-10-05

    Abstract: Disclosed is a resin composition including a resin. The resin includes a benzoxazine resin, an epoxy resin, and a modified maleimide resin. The modified maleimide resin is formed from a dicyclopentadiene (DCPD)-based resin having an amino group and a maleic anhydride by a condensation polymerization. The dicyclopentadiene-based resin having an amino group is formed by performing a nitration and a hydrogenation to a dicyclopentadiene phenolic resin.

    RESIN COMPOSITION
    18.
    发明公开
    RESIN COMPOSITION 审中-公开

    公开(公告)号:US20240166866A1

    公开(公告)日:2024-05-23

    申请号:US18182399

    申请日:2023-03-13

    CPC classification number: C08L71/00 C08L2201/08

    Abstract: A resin composition is provided. The resin composition includes a resin and an inorganic filler. The resin includes a bismaleimide resin and a polyphenylene ether resin. The inorganic filler includes a first inorganic filler and a second inorganic filler. An average particle size of the first inorganic filler is 0.3 μm to 0.6 μm. An average particle size of the second inorganic filler is 20 μm to 50 μm.

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