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    Cooling Structure for Electronic Circuit Board, and Electronic Device Using the Same
    14.
    发明申请
    Cooling Structure for Electronic Circuit Board, and Electronic Device Using the Same 审中-公开
    电子电路板冷却结构及其使用的电子设备

    公开(公告)号：US20150062821A1

    公开(公告)日：2015-03-05

    申请号：US14385754

    申请日：2013-03-14

    Applicant: NEC CORPORATION

    Inventor： Minoru Yoshikawa ,  Hitoshi Sakamoto ,  Akira Shoujiguchi ,  Masaki Chiba ,  Kenichi Inaba ,  Arihiro Matsunaga

    IPC: H05K1/02 ,  H05K7/20

    CPC classification number: H05K1/0203 ,  F28D15/0266 ,  F28F7/02 ,  G06F1/20 ,  G06F2200/201 ,  H01L23/427 ,  H01L2924/0002 ,  H05K7/20309 ,  H05K7/20318 ,  H05K7/20327 ,  H05K7/20809 ,  H01L2924/00

    Abstract: The size of an electronic device using a cooling structure for an electronic circuit board is increased when using a heating element with a large amount of heat generation, therefore, a cooling structure for an electronic circuit board according to an exemplary aspect of the present invention includes an evaporator with an evaporation container storing a refrigerant; a condenser condensing and liquefying a vapor-phase refrigerant vaporized in the evaporator and radiating heat; and a pipe connecting the evaporator to the condenser, wherein the evaporator includes a heat receiving area, on one side of the evaporation container, thermally connecting to a heating element disposed on the electronic circuit board, and a plurality of flow path plates, in an area including the heat receiving area, extending in the direction parallel to the electronic circuit board; and a vapor-liquid interface of the refrigerant is positioned above or at the level of a lower end and below an upper end of the heat receiving area in the vertical direction, in the arrangement condition that the drawing direction of the flow path plates is approximately parallel to the vertical direction.

    Abstract translation: 当使用具有大量发热量的加热元件时，使用电子电路板的冷却结构的电子设备的尺寸增加，因此，根据本发明的示例性方面的电子电路板的冷却结构包括 具有储存制冷剂的蒸发容器的蒸发器; 冷凝和液化在蒸发器中蒸发并蒸发热的气相制冷剂的冷凝器; 以及将蒸发器连接到冷凝器的管道，其中所述蒸发器包括在所述蒸发容器的一侧上的热接收区域，其热连接到设置在所述电子电路板上的加热元件，以及多个流路板， 包括受热面积的区域，沿与电子电路板平行的方向延伸; 并且在流路板的拉拔方向为大致的布置条件下，制冷剂的汽 - 液界面位于上下方向的下端的上方并位于热接收区域的上端的下方 平行于垂直方向。

    COOLING DEVICE
    15.
    发明申请
    COOLING DEVICE 审中-公开
    冷却装置

    公开(公告)号：US20140366572A1

    公开(公告)日：2014-12-18

    申请号：US14370185

    申请日：2012-12-12

    Applicant: Arihiro MATSUNAGA ,  Minoru YOSHIKAWA ,  Hitoshi SAKAMOTO ,  Akira SHOUJIGUCHI ,  Masaki CHIBA ,  Kenichi INABA ,  NEC Corporation

    Inventor： Arihiro Matsunaga ,  Minoru Yoshikawa ,  Hitoshi Sakamoto ,  Akira Shoujiguchi ,  Masaki Chiba ,  Kenichi Inaba

    IPC: F25B39/00 ,  F25B39/04 ,  F25B39/02

    CPC classification number: F25B39/00 ,  F25B23/006 ,  F25B39/028 ,  F25B39/04 ,  F25B2339/02 ,  F25B2339/041 ,  F28D15/0266 ,  F28D2021/0028 ,  H01L23/427 ,  H01L2924/0002 ,  H01L2924/00

    Abstract: [Problem] When a size of a cooling device using a boiling cooling system is reduced, a cooling performance decreases.[Means for solving the problems] It is characterized in that an evaporation unit which stores refrigerant, a condensing unit which condenses a gas-phase refrigerant produced by vaporizing the refrigerant in the evaporation unit to a liquid and dissipates heat, a vapor pipe which conveys the gas-phase refrigerant to the condensing unit, and a liquid pipe which conveys a liquid-phase refrigerant obtained by condensing the gas-phase refrigerant in the condensing unit to the evaporation unit are included, the condensing unit includes a heat dissipation flow path, an upper header which connects the vapor pipe and the heat dissipation flow path, and a lower header which connects the heat dissipation flow path and the liquid pipe, the upper header includes a flow path header portion connected to the heat dissipation flow path and an upper header extension portion located around the flow path header portion, and the upper header extension portion has a connection port connected to the vapor pipe in a face to which the heat dissipation flow path is connected.

    Abstract translation: [问题]当使用沸腾冷却系统的冷却装置的尺寸减小时，冷却性能降低。 解决问题的手段其特征在于，存储制冷剂的蒸发单元，将通过将蒸发单元中的制冷剂蒸发而产生的气相制冷剂冷凝成液体并散热的冷凝单元，传送蒸发管 包含冷凝单元的气相制冷剂和将冷凝单元中的气相制冷剂冷凝至蒸发单元而获得的液相制冷剂的液体管，包括散热流路， 连接蒸气管和散热流路的上部集管和连接散热流路和液体管的下部集管，上部集管包括与散热流路连接的流路集管部，上部 头部延伸部分位于流动路径头部分周围，并且上部标题扩展部分具有连接到蒸气pi的连接端口 pe在散热流路连接的面上。

    Valve control device, cooling device, and valve control method
    16.
    发明授权
    Valve control device, cooling device, and valve control method 有权

    公开(公告)号：US11226130B2

    公开(公告)日：2022-01-18

    申请号：US16477935

    申请日：2018-01-09

    Applicant: NEC CORPORATION

    Inventor： Koichi Todoroki ,  Arihiro Matsunaga ,  Masanori Sato ,  Mizuki Wada ,  Minoru Yoshikawa

    IPC: F24F11/84 ,  F28F27/00 ,  F25B41/20 ,  F25B41/31

    Abstract: A valve control device includes a receiving unit, an opening degree control unit, and a fixing control unit. The receiving unit receives information concerning the measured temperature of a fluid to be cooled that is cooled by a vaporizer in a refrigerant circulation path that is equipped with the vaporizer and a condenser. The opening degree control unit variably controls the opening degree of a valve that controls the flow rate of the refrigerant that circulates through the circulation path in accordance with the difference between the measured temperature and a target temperature provided in advance. The fixing control unit fixes the opening degree of the valve with priority over variable control performed by the opening degree control unit in the case where a fixing condition based on the difference between the measured temperature and the target temperature and a valve opening degree variation condition is satisfied.

    Cooling apparatus and cooling system
    17.
    发明授权
    Cooling apparatus and cooling system 有权
    冷却装置和冷却系统

    公开(公告)号：US09459031B2

    公开(公告)日：2016-10-04

    申请号：US14378659

    申请日：2013-02-13

    Applicant: NEC Corporation

    Inventor： Kenichi Inaba ,  Minoru Yoshikawa ,  Hitoshi Sakamoto ,  Akira Shoujiguchi ,  Masaki Chiba ,  Arihiro Matsunaga

    IPC: F25B43/00 ,  G06F1/20 ,  H05K7/20 ,  F28D15/02 ,  F25B39/00 ,  F25B39/02 ,  F25B39/04

    CPC classification number: F25B43/00 ,  F25B39/00 ,  F25B39/02 ,  F25B39/04 ,  F28D15/0266 ,  G06F1/20 ,  H05K7/20818

    Abstract: A cooling apparatus includes N (N is an integer of 2 or larger) refrigerant storage units arranged in a vertical direction and configured to store refrigerants, a condensation unit disposed above the N refrigerant storage units, a steam pipe for circulating gas phase refrigerants flowing out of the N refrigerant storage units to the condensation unit, a liquid pipe for circulating a liquid phase refrigerant flowing out of the condensation unit to an uppermost refrigerant storage unit, and separation piping for circulating a liquid phase refrigerant flowing out of an upper refrigerant storage unit to a lower refrigerant storage unit. The liquid phase refrigerant flows into each refrigerant storage unit via an inlet, and flows out from the refrigerant storage unit via a first connection port formed below the inlet.

    Abstract translation: 一种冷却装置，其特征在于，包括N个（N为2以上的整数）制冷剂储存单元，其沿垂直方向配置，构成为储存制冷剂，冷凝单元设置在所述N个制冷剂储存单元的上方;蒸气管，其使流出的气相制冷剂循环 的N个制冷剂储存单元的冷凝装置，将从冷凝装置流出的液相制冷剂循环到最上层的制冷剂储存部的液体管，以及使从上部制冷剂储存部流出的液相制冷剂循环的分离配管 到下部制冷剂储存单元。 液相制冷剂经由入口流入各制冷剂储存单元，经由形成在入口下方的第一连接口从制冷剂储存单元流出。

    COOLING APPARATUS, HEAT RECEIVING SECTION AND BOILING SECTION USED THEREIN, AND METHOD OF MANUFACTURING THE SAME
    19.
    发明申请
    COOLING APPARATUS, HEAT RECEIVING SECTION AND BOILING SECTION USED THEREIN, AND METHOD OF MANUFACTURING THE SAME 有权
    冷却装置，加热部分及其使用的沸腾部分及其制造方法

    公开(公告)号：US20150241096A1

    公开(公告)日：2015-08-27

    申请号：US14427487

    申请日：2013-07-19

    Applicant: NEC Corporation

    Inventor： Arihiro Matsunaga ,  Minoru Yoshikawa ,  Hitoshi Sakamoto ,  Akira Shoujiguchi ,  Masaki Chiba ,  Kenichi Inaba

    IPC: F25B39/02 ,  B23P15/26

    CPC classification number: F25B39/028 ,  B23P15/26 ,  H01L23/427 ,  H01L2924/0002 ,  Y10T29/49359 ,  H01L2924/00

    Abstract: In order to maintain a high cooling capability even in a case where a heating element has a lower calorific value, a boiling section of a heat receiving section in a phase change cooling apparatus includes a comb-shaped structure and a porous layer provided on a bottom portion of the comb-shaped structure between fins of the comb-shaped structure. With such a boiling section, a liquid film of a liquid phase refrigerant is forcedly made thinner. Thus, the liquid phase refrigerant is changed in phase into a gaseous phase refrigerant even in a case of a small difference between the temperature of the gaseous phase refrigerant and the temperature of the heat receiving surface.

    Abstract translation: 为了即使在加热元件具有较低的发热量的情况下也能保持高的冷却能力，相变冷却装置中的受热部的沸腾部分包括梳状结构和设置在底部的多孔层 该梳形结构的一部分在梳形结构的翅片之间。 通过这样的沸腾部分，强制使液相制冷剂的液膜变薄。 因此，即使在气相制冷剂的温度与受热面的温度之间的差异较小的情况下，液相制冷剂也相位变化为气相制冷剂。

    COOLING DEVICE AND ELECTRONIC DEVICE USING THE SAME
    20.
    发明申请
    COOLING DEVICE AND ELECTRONIC DEVICE USING THE SAME 审中-公开

    公开(公告)号：US20140331709A1

    公开(公告)日：2014-11-13

    申请号：US14370190

    申请日：2012-12-12

    Applicant: NEC Corporation

    Inventor： Masaki Chiba ,  Minoru Yoshikawa ,  Hitoshi Sakamoto ,  Akira Shoujiguchi ,  Kenichi Inaba ,  Arihiro Matsunaga

    IPC: H05K7/20 ,  F25B39/00 ,  F25B39/04 ,  F28D15/02 ,  F25B39/02

    CPC classification number: H05K7/2029 ,  F25B39/00 ,  F25B39/02 ,  F25B39/04 ,  F28D15/02 ,  F28D15/0266 ,  F28F13/06 ,  F28F2250/08 ,  H01L23/367 ,  H01L23/427 ,  H01L23/467 ,  H01L2924/0002 ,  H05K7/20309 ,  H05K7/20318 ,  H01L2924/00

    Abstract: When a cooling device employing an ebullient cooling system is mounted in a low-profile electronic device, not only is it impossible to obtain the sufficient cooling performance, but also the cooling efficiency of the entire electronic device decreases, therefore, a cooling device according to an exemplary aspect of the invention includes evaporating means for storing a refrigerant; condensing means for condensing and liquefying a vapor-phase refrigerant vaporized in the evaporation means and radiating heat; a pipe connecting the evaporating means to the condensing means; and flow regulating means for regulating a flow direction of air passing through the condensing means, wherein the evaporating means and the condensing means are located on roughly the same level in the vertical direction; the evaporating means includes an evaporation container and bulkhead means for separating the refrigerant disposed in the evaporation container; the height of the bulkhead means is larger than or equal to the height of a vapor-liquid interface of the refrigerant and is smaller than the height of the evaporation container; the pipe includes a vapor pipe through which vapor-phase refrigerant flows and a liquid pipe through which condensed and liquefied liquid-phase refrigerant flows; the condensing means includes first condensing means and second condensing means which differ in condensing-means height which is defined as the height in vertical direction of a condensation container composing the condensing means, and the condensing-means height of the first condensing means is configured to be larger than the condensing-means height of the second condensing means; the first condensing means includes a vapor pipe connection portion which is connected to the vapor pipe at the position above the condensing-means height of the second condensing means in vertical direction; and the flow regulating means is disposed in the upper part of the second condensing means.

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