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    Cooling Structure for Electronic Circuit Board, and Electronic Device Using the Same
    13.
    发明申请
    Cooling Structure for Electronic Circuit Board, and Electronic Device Using the Same 审中-公开
    电子电路板冷却结构及其使用的电子设备

    公开(公告)号：US20150062821A1

    公开(公告)日：2015-03-05

    申请号：US14385754

    申请日：2013-03-14

    Applicant: NEC CORPORATION

    Inventor： Minoru Yoshikawa ,  Hitoshi Sakamoto ,  Akira Shoujiguchi ,  Masaki Chiba ,  Kenichi Inaba ,  Arihiro Matsunaga

    IPC: H05K1/02 ,  H05K7/20

    CPC classification number: H05K1/0203 ,  F28D15/0266 ,  F28F7/02 ,  G06F1/20 ,  G06F2200/201 ,  H01L23/427 ,  H01L2924/0002 ,  H05K7/20309 ,  H05K7/20318 ,  H05K7/20327 ,  H05K7/20809 ,  H01L2924/00

    Abstract: The size of an electronic device using a cooling structure for an electronic circuit board is increased when using a heating element with a large amount of heat generation, therefore, a cooling structure for an electronic circuit board according to an exemplary aspect of the present invention includes an evaporator with an evaporation container storing a refrigerant; a condenser condensing and liquefying a vapor-phase refrigerant vaporized in the evaporator and radiating heat; and a pipe connecting the evaporator to the condenser, wherein the evaporator includes a heat receiving area, on one side of the evaporation container, thermally connecting to a heating element disposed on the electronic circuit board, and a plurality of flow path plates, in an area including the heat receiving area, extending in the direction parallel to the electronic circuit board; and a vapor-liquid interface of the refrigerant is positioned above or at the level of a lower end and below an upper end of the heat receiving area in the vertical direction, in the arrangement condition that the drawing direction of the flow path plates is approximately parallel to the vertical direction.

    Abstract translation: 当使用具有大量发热量的加热元件时，使用电子电路板的冷却结构的电子设备的尺寸增加，因此，根据本发明的示例性方面的电子电路板的冷却结构包括 具有储存制冷剂的蒸发容器的蒸发器; 冷凝和液化在蒸发器中蒸发并蒸发热的气相制冷剂的冷凝器; 以及将蒸发器连接到冷凝器的管道，其中所述蒸发器包括在所述蒸发容器的一侧上的热接收区域，其热连接到设置在所述电子电路板上的加热元件，以及多个流路板， 包括受热面积的区域，沿与电子电路板平行的方向延伸; 并且在流路板的拉拔方向为大致的布置条件下，制冷剂的汽 - 液界面位于上下方向的下端的上方并位于热接收区域的上端的下方 平行于垂直方向。

    COOLING DEVICE
    14.
    发明申请
    COOLING DEVICE 审中-公开
    冷却装置

    公开(公告)号：US20140366572A1

    公开(公告)日：2014-12-18

    申请号：US14370185

    申请日：2012-12-12

    Applicant: Arihiro MATSUNAGA ,  Minoru YOSHIKAWA ,  Hitoshi SAKAMOTO ,  Akira SHOUJIGUCHI ,  Masaki CHIBA ,  Kenichi INABA ,  NEC Corporation

    Inventor： Arihiro Matsunaga ,  Minoru Yoshikawa ,  Hitoshi Sakamoto ,  Akira Shoujiguchi ,  Masaki Chiba ,  Kenichi Inaba

    IPC: F25B39/00 ,  F25B39/04 ,  F25B39/02

    CPC classification number: F25B39/00 ,  F25B23/006 ,  F25B39/028 ,  F25B39/04 ,  F25B2339/02 ,  F25B2339/041 ,  F28D15/0266 ,  F28D2021/0028 ,  H01L23/427 ,  H01L2924/0002 ,  H01L2924/00

    Abstract: [Problem] When a size of a cooling device using a boiling cooling system is reduced, a cooling performance decreases.[Means for solving the problems] It is characterized in that an evaporation unit which stores refrigerant, a condensing unit which condenses a gas-phase refrigerant produced by vaporizing the refrigerant in the evaporation unit to a liquid and dissipates heat, a vapor pipe which conveys the gas-phase refrigerant to the condensing unit, and a liquid pipe which conveys a liquid-phase refrigerant obtained by condensing the gas-phase refrigerant in the condensing unit to the evaporation unit are included, the condensing unit includes a heat dissipation flow path, an upper header which connects the vapor pipe and the heat dissipation flow path, and a lower header which connects the heat dissipation flow path and the liquid pipe, the upper header includes a flow path header portion connected to the heat dissipation flow path and an upper header extension portion located around the flow path header portion, and the upper header extension portion has a connection port connected to the vapor pipe in a face to which the heat dissipation flow path is connected.

    Abstract translation: [问题]当使用沸腾冷却系统的冷却装置的尺寸减小时，冷却性能降低。 解决问题的手段其特征在于，存储制冷剂的蒸发单元，将通过将蒸发单元中的制冷剂蒸发而产生的气相制冷剂冷凝成液体并散热的冷凝单元，传送蒸发管 包含冷凝单元的气相制冷剂和将冷凝单元中的气相制冷剂冷凝至蒸发单元而获得的液相制冷剂的液体管，包括散热流路， 连接蒸气管和散热流路的上部集管和连接散热流路和液体管的下部集管，上部集管包括与散热流路连接的流路集管部，上部 头部延伸部分位于流动路径头部分周围，并且上部标题扩展部分具有连接到蒸气pi的连接端口 pe在散热流路连接的面上。

    Electronic device and cooling system
    15.
    发明授权
    Electronic device and cooling system 有权

    公开(公告)号：US09820407B2

    公开(公告)日：2017-11-14

    申请号：US14768917

    申请日：2014-02-19

    Applicant: NEC Corporation

    Inventor： Hitoshi Sakamoto ,  Minoru Yoshikawa ,  Akira Shoujiguchi ,  Masaki Chiba ,  Kenichi Inaba ,  Arihiro Matsunaga

    IPC: H05K7/20 ,  G06F1/20

    CPC classification number: H05K7/20145 ,  G06F1/20 ,  H05K7/20154 ,  H05K7/202 ,  H05K7/205

    Abstract: An electronic board 200 has a heat generating component 220 mounted on it. An enclosure 300 houses the electronic board 200. A heat transport unit 400 is coupled to the enclosure 300 and transports heat generated by the heat generating component 220 to the outside. A heat receiving unit 510 is provided in a heat transport unit 400, 400A. The heat receiving unit 510 receives heat generated by the heat generating component 220. A heat dissipating unit 530 is provided in the heat transport unit 400 in such a manner that a portion of the heat dissipating unit 530 is exposed to outside air, and is coupled to the heat receiving unit 510. The heat dissipating unit 530 dissipates heat received by the heat receiving unit 510 to the outside. A guide duct unit 340 is formed into a tube interconnecting the heat generating component 220 and the heat receiving unit 510 in order to release heat of the heat generating component 220 to the heat receiving unit 510. This enables the heat generating component on the electronic board to be efficiently cooled with a small and simple configuration.

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