Abstract:
A light emitting device includes a resin package including a first lead and a second lead. A light emitting element includes a first electrode disposed to face the first lead and having a first post electrode projecting toward the first lead in a first projecting direction with a height equal to or larger than 50 μm and equal to or smaller than 150 μm in the first projecting direction and a second electrode disposed to face the second lead and having a second post electrode projecting toward the second lead in a second projecting direction with a height equal to or larger than 50 μm and equal to or smaller than 150 μm in the second projecting direction. A first electrically conductive bonding member connects the first lead and the first post electrode. A second electrically conductive bonding member connects the second lead and the second post electrode.
Abstract:
A light source device includes a plurality of light sources, a substrate on which the light sources are arranged, and a reflective member arranged on the substrate via an adhesive member. The reflective member defines a plurality of through holes. The light sources are respectively disposed inside the through holes in a plan view. The adhesive member is light-reflective.
Abstract:
A method of manufacturing a light emitting device having a resin package which provides an optical reflectivity equal to or more than 70% at a wavelength between 350 nm and 800 nm after thermal curing, and in which a resin part and a lead are formed in a substantially same plane in an outer side surface, includes a step of sandwiching a lead frame provided with a notch part, by means or an upper mold and a lower mold, a step of transfer-molding a thermosetting resin containing a light reflecting material in a mold sandwiched by the upper mold and the lower mold to form a resin-molded body in the lead frame and a step of cutting the resin-molded body and the lead frame along the notch part.
Abstract:
A light emitting device including a molded package having leads including a pair of a first lead and a second lead, a molded resin, and a recess, where an upper surface of the leads is partially exposed from a bottom surface of the recess. The device further including a light emitting component mounted on the bottom surface, and at least one sealing member located in the recess to cover the light emitting component. At least one of the first lead and the second lead has a groove on an upper surface thereof, where the groove is positioned so as to correspond to a corner on the bottom surface of the recess in a cross sectional view. A portion of the molded resin located within the groove is exposed from the bottom surface. A surface of the corner is composed of a curved surface, and the sealing member covers the corner.
Abstract:
A light emitting apparatus includes a package having a long-length direction and a short-length direction perpendicular to the long-length direction as viewed in plan view. The package includes first and second leadframes and a resin portion. The first leadframe has a first leadframe main portion and a first leadframe extension portion which has narrower width than that of the first leadframe main portion. The second leadframe has a second leadframe main portion and a second leadframe extension portion which has narrower width than that of the second leadframe main portion. An inclined portion is formed between the first leadframe and the second leadframe as viewed in plan view. An upper end of the inclined portion is shifted from a lower end of the inclined portion.
Abstract:
A method of manufacturing a light emitting device having a resin package which provides an optical reflectivity equal to or more than 70% at a wavelength between 350 nm and 800 nm after thermal curing, and in which a resin part and a lead are formed in a substantially same plane in an outer side surface, includes a step of sandwiching a lead frame provided with a notch part, by means or an upper mold and a lower mold, a step of transfer-molding a thermosetting resin containing a light reflecting material in a mold sandwiched by the upper mold and the lower mold to form a resin-molded body in the lead frame and a step of cutting the resin-molded body and the lead frame along the notch part.
Abstract:
A light emitting apparatus includes a package and a first light emitting device. The package has a package bottom surface and defining recessed portion having a recessed portion bottom surface therein. The package includes a first leadframe, a second leadframe and resin portion. Each of the first and second leadframes has a leadframe upper surface which is partially exposed at the recessed portion bottom surface and a leadframe bottom surface exposed at the package bottom surface. The first light emitting device is mounted in the recessed portion. The first and second leadframes are spaced apart each other via an separation area having a bending portion and a liner portion connected to the bending portion and extended substantially straight along a boundary line between the first leadframe main body and the first leadframe extension portion at the package bottom surface.
Abstract:
The present invention provides a package for light emitting apparatus has a long-length direction and a short-length direction perpendicular to the long-length direction as viewed in plan view, and includes first, second and third leadframes, and a resin portion. The first and second leadframes are arranged on the both sides in the long-length direction. The third leadframe is arranged between the first and second leadframes. The resin portion is integrally formed with the first, second and third leadframes. The first and second leadframes include main portions, and first and second extension portions that extend from the main portions toward the second and first leadframes, respectively, and have a width smaller than the main portions.
Abstract:
A planar light source has a plurality of light sources, a substrate, and a partitioning member. The partitioning member includes a first member provided with first partitioned parts each having a first bottom part and first oblique parts surrounding the first bottom part that are arranged on the substrate in a matrix, and a second member provided with second partitioned parts each having a second bottom part and second oblique parts surrounding the second bottom part that are arranged on the substrate in a matrix. The first member further has first outer oblique parts overlapping the second oblique parts located along the outer edge of the second member on the first member side. The first bottom parts and the second bottom parts each have a light source disposition opening, and the light sources are individually disposed on the substrate exposed in the light source disposition openings.
Abstract:
A surface light source includes a plurality of light sources, a substrate, a first member disposed on the substrate and including a plurality of recessed first demarcating portions each including a first inclined portion and a first bottom portion and one or more recessed second demarcating portions each including a second inclined portion and a first opening, and a second member overlying a portion of the first member and including a third inclined portion overlapping with the second inclined portion, a fourth inclined portion adjacent to the third inclined portion and not overlapping with the second inclined portion, a second bottom portion located inside the first opening, and a third bottom portion continuous with a lower end of the fourth inclined portion, and the plurality of light sources being respectively disposed on the substrate exposed in the first bottom portion, the second bottom portion, and the third bottom portion.