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公开(公告)号:US20200098964A1
公开(公告)日:2020-03-26
申请号:US16582197
申请日:2019-09-25
Applicant: NICHIA CORPORATION
Inventor: Toru HASHIMOTO , Yoichi BANDO , Tadaaki IKEDA , Gensui TAMURA
IPC: H01L33/62 , H01L25/075 , H01L33/40
Abstract: The method of manufacturing a light emitting device includes: providing a first intermediate body, the first intermediate body including a temporary substrate including a base and a pair of first wirings, and a light emitting element including a pair of element electrodes, each of the pair of element electrodes connected to a respective one of the first wirings via a respective one of a plurality of solders; removing a portion of the temporary substrate to form a second intermediate body having a second lower surface in which a lower surface of each of the element electrodes and a lower surface of each of the plurality of solders are located; and forming a pair of external connection electrodes on the second lower surface such that each of the pair of external connection electrodes cover a respective one of the element electrodes and a respective one of the plurality of solders.
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公开(公告)号:US20190198722A1
公开(公告)日:2019-06-27
申请号:US16229409
申请日:2018-12-21
Applicant: NICHIA CORPORATION
Inventor: Takuya NAKABAYASHI , Tadaaki IKEDA , Toru HASHIMOTO , Yukiko YOKOTE
CPC classification number: H01L33/502 , C09K11/617 , H01L25/0753 , H01L33/58 , H01L33/60 , H01L33/62 , H01L33/647 , H01L2933/0091
Abstract: A light emitting device includes a first light emitting element including a rectangular first light extraction surface, a second light emitting element including a rectangular second light extraction surface and emitting light having an emission peak wavelength different from an emission peak wavelength of the first light emitting element, and a light-transmissive member covering the first light extraction surface and the second light extraction surface. The light-transmissive member includes a first light-transmissive layer facing the first light extraction surface and the second light extraction surface, a wavelength conversion layer located on the first light-transmissive layer, and a second light-transmissive layer located on the wavelength conversion layer. The first light-transmissive layer contains a first matrix and first diffusive particles. The wavelength conversion layer contains a second matrix and wavelength conversion particles. The second light-transmissive layer contains a third matrix and second diffusive particles.
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公开(公告)号:US20230027533A1
公开(公告)日:2023-01-26
申请号:US17938017
申请日:2022-10-04
Applicant: NICHIA CORPORATION
Inventor: Takuya NAKABAYASHI , Tadaaki IKEDA , Tetsuya ISHIKAWA
Abstract: A light emitting device includes a substrate including first, second, third and fourth wiring portions on a top surface of a base member and arrayed in a first direction, and a connection wiring portion connecting the second and third wiring portions. The connection wiring portion includes first and second connection ends respectively connected with the second and third wiring portions, and a connection central portion connecting the first and second connection ends and having a maximum width in a second direction different from each of a maximum width of the first connection end and a maximum width of the second connection end. In the second direction, at least a part of the connection wiring portion has a width narrower than each of a maximum width of the second wiring portion and a maximum width of the third wiring portion.
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公开(公告)号:US20200287095A1
公开(公告)日:2020-09-10
申请号:US16883288
申请日:2020-05-26
Applicant: NICHIA CORPORATION
Inventor: Takuya NAKABAYASHI , Tadaaki IKEDA
Abstract: A light-emitting device includes a substrate including a base member having an upper surface having a substantially rectangular shape, a lower surface opposite to the upper surface, a first longer lateral surface, a second longer lateral surface opposite to the first longer lateral surface, a first shorter lateral surface, and a second shorter lateral surface opposite to the first shorter lateral surface, first wirings disposed on the upper surface, and second wirings disposed on the lower surface and each electrically connected with a respective one of the first wirings; at least one light-emitting element; and a light-reflective covering member covering lateral surfaces of the light-emitting element and the upper surface of the base member. The base member has at least one first recess open at the upper surface and the first longer lateral surface. Surfaces defining the at least one first recess are covered with the covering member.
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公开(公告)号:US20200035874A1
公开(公告)日:2020-01-30
申请号:US16519809
申请日:2019-07-23
Applicant: NICHIA CORPORATION
Inventor: Takuya NAKABAYASHI , Yukiko YOKOTE , Tadaaki IKEDA
IPC: H01L33/50 , H01L33/10 , H01L25/075 , F21K9/61 , F21K9/68
Abstract: A light-emitting device has a longitudinal direction and a width direction perpendicular to the longitudinal direction, and includes a first light-emitting element, a second light-emitting element having a peak emission wavelength different from a peak emission wavelength of the first light-emitting element and being aligned with the first light-emitting element in the longitudinal direction, a light-transmissive member covering a first element light extracting surface and a second element light extracting surface such that a portion of a light-guide member is located between the light-transmissive member and each of the first element light extracting surface and the second element light extracting surface, a first reflective member surrounding the first light-emitting element, the second light-emitting element, and the light-guide member in a top view, and a first inclined member between the first light-emitting element and the first reflective member in the longitudinal direction and having an inclined surface inclined relative to the light-transmissive member. The first inclined member is spaced apart from the light-transmissive member.
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公开(公告)号:US20180226385A1
公开(公告)日:2018-08-09
申请号:US15889677
申请日:2018-02-06
Applicant: NICHIA CORPORATION
Inventor: Takuya NAKABAYASHI , Tadaaki IKEDA
IPC: H01L25/075 , H01L33/62 , H01L33/60 , H01L33/54 , H01L33/50
CPC classification number: H01L25/0753 , H01L33/505 , H01L33/54 , H01L33/56 , H01L33/60 , H01L33/62 , H01L2933/005 , H01L2933/0058 , H01L2933/0066
Abstract: A light-emitting device includes a mounting board, a first light-emitting element, a second light-emitting element and a light-reflective covering member. The mounting board includes first lands and second lands on an upper surface of the mounting board. The first light-emitting element is flip-chip mounted on the first lands. The second light-emitting element is flip-chip mounted on the second lands. The light-reflective covering member covers a lateral surface of the first light-emitting element, a lateral surface of the second light-emitting element, and the upper surface of the mounting board. The mounting board and the light-reflective covering member define a depressed portion between the first light-emitting element and the second light-emitting element with a bottom surface of the depressed portion being located inside the mounting board.
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公开(公告)号:US20170092816A1
公开(公告)日:2017-03-30
申请号:US15278724
申请日:2016-09-28
Applicant: NICHIA CORPORATION
Inventor: Tadaaki IKEDA , Masaki HAYASHI , Koji ABE , Kimihiro MIYAMOTO
CPC classification number: H01L33/465 , H01L33/44 , H01L33/483 , H01L33/486 , H01L33/60 , H01L33/62 , H01L2224/48227 , H01L2224/48237 , H01L2224/8592 , H01L2224/97 , H01L2933/0025 , H01L2933/0033 , H01L2933/0058 , H01L2933/0066
Abstract: A method of manufacturing a package, the method comprising the steps of: preparing a resin compact having a recess, and including a pair of leads arranged at a bottom surface of the recess, a first resin body forming a lateral wall of the recess, and a second resin body arranged between the pair of leads; forming a reflective film entirely on at least the bottom surface of the recess and an inner surface of the lateral wall of the recess; and removing the reflective film formed on the pair of leads in the recess in the resin compact on which the reflective film has been formed.
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公开(公告)号:US20170062684A1
公开(公告)日:2017-03-02
申请号:US15246730
申请日:2016-08-25
Applicant: NICHIA CORPORATION
Inventor: Tadaaki IKEDA , Takuya NAKABAYASHI
IPC: H01L33/62 , H01L25/075 , H01L33/60 , H01L27/15
CPC classification number: H01L33/62 , H01L25/0753
Abstract: A light-emitting device includes a substrate having a first surface extended in a first direction, a second surface opposite to the first surface, a third surface between the first and second surfaces and extended in the first direction, and a fourth surface opposite to the third surface, a conductive member including at least four element mounting portions arranged in the first direction on the first surface, a first wiring portion on the second surface, a second wiring portion on the third surface, and a third wiring portion on the fourth surface, and first, second, third, and fourth light-emitting elements respectively mounted on the four element mounting portions. With the first, second, and third wiring portions, the first and second light-emitting elements are connected in series, the third and fourth light-emitting elements are connected in series, and the first and third light-emitting elements are connected in parallel.
Abstract translation: 发光装置包括具有沿第一方向延伸的第一表面的基板,与第一表面相对的第二表面,在第一和第二表面之间并在第一方向上延伸的第三表面和与第一表面相对的第四表面 第三表面,包括在第一表面上沿第一方向布置的至少四个元件安装部分的第二表面上的第一布线部分,第三表面上的第二布线部分和第四表面上的第三布线部分的导电部件 以及分别安装在四个元件安装部上的第一,第二,第三和第四发光元件。 利用第一,第二和第三布线部分,第一和第二发光元件串联连接,第三和第四发光元件串联连接,并且第一和第三发光元件并联连接 。
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19.
公开(公告)号:US20150140702A1
公开(公告)日:2015-05-21
申请号:US14548102
申请日:2014-11-19
Applicant: NICHIA CORPORATION
Inventor: Tadaaki IKEDA
CPC classification number: H01L33/56 , H01L33/0079 , H01L33/54 , H01L2224/13 , H01L2924/10157 , H01L2933/0033
Abstract: The method for manufacturing the semiconductor light emitting device includes steps of forming a plurality of semiconductor light emitting element regions on a substrate, forming a recess portion between the plurality of semiconductor light emitting element regions on a surface of the substrate, disposing a light reflective sealing resin on the substrate to cover the plurality of semiconductor light emitting element regions with the sealing resin and to fill the recess portion with a part of the sealing resin that covers the plurality of semiconductor light emitting element regions, removing the substrate, disposing a light transmissive resin on surfaces of the plurality of semiconductor light emitting element regions where the substrate has been removed, and dividing the plurality of semiconductor light emitting element regions into individual pieces, wherein the recess portion includes a first recess portion and one or more second recess portions shallower than the first recess portion.
Abstract translation: 半导体发光器件的制造方法包括以下步骤:在衬底上形成多个半导体发光元件区域,在衬底的表面上的多个半导体发光元件区域之间形成凹部,设置光反射密封 树脂,用密封树脂覆盖多个半导体发光元件区域,并且用覆盖多个半导体发光元件区域的密封树脂的一部分填充凹部,去除基板,设置透光的 在去除了基板的多个半导体发光元件区域的表面上的树脂,并将多个半导体发光元件区域分割成单独的片,其中凹部包括第一凹部和一个或多个第二凹部 比第一个凹槽 上。
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公开(公告)号:US20210305218A1
公开(公告)日:2021-09-30
申请号:US17209015
申请日:2021-03-22
Applicant: NICHIA CORPORATION
Inventor: Tadaaki IKEDA , Yuki KAGEYAMA , Tetsuya ISHIKAWA , Toshifumi IMURA
IPC: H01L25/075 , H01L33/58 , H01L33/54
Abstract: A light emitting device includes light emitting elements, light-transmissive members, a covering member, at least one first protrusion, and two second protrusions. The light emitting elements are aligned in a first direction. The light-transmissive members are respectively disposed on upper surfaces of the light emitting elements. The covering member includes at least one first covering portion and two second covering portions. The at least one first covering portion is arranged between adjacent ones of the light-transmissive members, and the second covering portions are arranged at distal ends of the light emitting device in the first direction with the light-transmissive members being arranged between the second covering portions. The at least one first protrusion is arranged on an upper surface of the at least one first covering portion and being spaced apart from the light-transmissive members. The second protrusions respectively arranged on upper surfaces of the second covering portions.
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