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    LIGHT EMITTING DEVICE
    11.
    发明申请
    LIGHT EMITTING DEVICE 审中-公开

    公开(公告)号：US20180301603A1

    公开(公告)日：2018-10-18

    申请号：US16017953

    申请日：2018-06-25

    Applicant: NICHIA CORPORATION

    Inventor： Motokazu YAMADA ,  Yuichi YAMADA

    IPC: H01L33/54 ,  H01L33/50

    Abstract: A light emitting device includes a base having a conductor wiring, at least one light emitting element mounted on the base and electrically connected to the conductor wiring, and a light transmissive sealing member. The light transmissive sealing member includes a light diffusion material. The light transmissive sealing member covers the at least one light emitting element. The light transmissive sealing member has a projection shape. The projection shape has a substantially circular bottom surface facing the base and a height in a light axis direction of the at least one light emitting element. The height is greater than a diameter of the substantially circular bottom surface. The light transmissive sealing member has a maximum length when the light transmissive sealing member is viewed from the light axis direction. The diameter of the substantially circular bottom surface is smaller than the maximum length of the light transmissive sealing member.

    LIGHT EMITTING DEVICE
    12.
    发明申请
    LIGHT EMITTING DEVICE 审中-公开

    公开(公告)号：US20170179345A1

    公开(公告)日：2017-06-22

    申请号：US15387649

    申请日：2016-12-22

    Applicant: NICHIA CORPORATION

    Inventor： Yuichi YAMADA ,  Motokazu YAMADA

    IPC: H01L33/46 ,  H01L33/48 ,  H01L33/62 ,  H01L33/50 ,  H01L33/58

    CPC classification number: H01L33/46 ,  H01L33/486 ,  H01L33/505 ,  H01L33/54 ,  H01L33/58 ,  H01L33/60 ,  H01L33/62 ,  H01L2224/16225 ,  H01L2224/73204

    Abstract: A light emitting device includes a base including a support having a support surface. The light emitting element has a first surface and a second surface opposite to the first surface. The light emitting element is mounted on the base. The first surface faces the support surface. The reflecting film is provided on the second surface of the light emitting element. The light-transmissive covering member is provided on the base on a side of the support surface to cover the light emitting element and a covered region of the base except for an uncovered region of the base. An average reflectivity in the uncovered region of the base with respect to a peak emission wavelength of light emitted from the light emitting element is higher than an average reflectivity in the covered region of the base with respect to the peak emission wavelength of light.

    LIGHT EMITTING DEVICE
    13.
    发明申请
    LIGHT EMITTING DEVICE 有权

    公开(公告)号：US20220013694A1

    公开(公告)日：2022-01-13

    申请号：US17485506

    申请日：2021-09-27

    Applicant: NICHIA CORPORATION

    Inventor： Yuichi YAMADA ,  Motokazu YAMADA

    IPC: H01L33/46 ,  H01L33/48 ,  H01L33/50 ,  H01L33/58 ,  H01L33/62

    Abstract: A light emitting device includes a base including a support having a support surface. A light emitting element includes a semiconductor layer and a sapphire substrate provided on the semiconductor layer opposite to the support surface. A reflecting film provided on the sapphire substrate. A light-transmissive covering member is provided on the support surface. A height of the light-transmissive covering member viewed in a direction in which a width of the light-transmissive covering member appears smallest is 0.5 times or less of the width of the light-transmissive covering member. A light reflecting layer is provided on a first region of the base such that a first reflectivity in the first region of the base being higher than a second reflectivity in a second region of the base, the second region overlapping with the light emitting element and being surrounded by the first region as viewed in the height direction.

    LED PACKAGE AND INTEGRATED LIGHT EMITTING DEVICE
    17.
    发明申请
    LED PACKAGE AND INTEGRATED LIGHT EMITTING DEVICE 有权

    公开(公告)号：US20230096212A1

    公开(公告)日：2023-03-30

    申请号：US18050896

    申请日：2022-10-28

    Applicant: NICHIA CORPORATION

    Inventor： Motokazu YAMADA ,  Yuichi YAMADA ,  Shinsaku IKUTA ,  Takeshi TAMURA

    IPC: H01L33/60 ,  F21V3/06 ,  H01L33/54 ,  F21Y115/10 ,  F21Y105/16

    Abstract: An LED package includes a light source, a light transmissive member, and a light reflecting layer. The light source includes a resin package, a light emitting element and a wavelength conversion material. The resin package includes first and second leads and a resin member. The resin package defines a recess having a bottom face defined by portions of the first and second leads, and a portion of the resin member, and a lateral wall defined by a portion of the resin member. The light emitting element is disposed on or above the bottom face in the recess. The wavelength conversion material is disposed in the recess. The light transmissive member is disposed on or above the light source. The light reflecting layer is disposed on or above the light transmissive member at least on an upper side along an optical axis of the light emitting element.

    LIGHT EMITTING DEVICE AND INTEGRATED LIGHT EMITTING DEVICE
    18.
    发明申请
    LIGHT EMITTING DEVICE AND INTEGRATED LIGHT EMITTING DEVICE 有权

    公开(公告)号：US20210310632A1

    公开(公告)日：2021-10-07

    申请号：US17353348

    申请日：2021-06-21

    Applicant: NICHIA CORPORATION

    Inventor： Yuichi YAMADA ,  Motokazu YAMADA

    IPC: F21V7/00 ,  F21K9/64 ,  H01L33/46 ,  H01L33/48 ,  H01L25/075 ,  H01L33/50 ,  H01L33/60 ,  H01L33/62 ,  H01L33/54 ,  F21V9/30 ,  F21V17/00

    Abstract: A light emitting device includes: a base; a light emitting element; a light reflective film located on an upper surface of the light emitting element; and a encapsulant. A ratio of a maximum width (Wmax) of the encapsulant with respect to a maximum width of the light emitting element, in a side view, is 2 or more. An outer shape of a part of the encapsulant located within a range of elevation angles that is in a range of 10° to 50° from a center of a mounting region at an upper surface of the base on which the light emitting element is mounted is formed to have a curved surface. A ratio (r/Wmax) of a radius of curvature (r) of the curved surface with respect to the maximum width (Wmax) of the encapsulant, in a side view, is in a range of 0.25 to 0.50.

    LIGHT EMITTING DEVICE AND LED PACKAGE
    19.
    发明申请
    LIGHT EMITTING DEVICE AND LED PACKAGE 有权

    公开(公告)号：US20210167263A1

    公开(公告)日：2021-06-03

    申请号：US17103719

    申请日：2020-11-24

    Applicant: NICHIA CORPORATION

    Inventor： Motokazu YAMADA ,  Yuichi YAMADA ,  Shinsaku IKUTA ,  Takeshi TAMURA

    IPC: H01L33/60 ,  F21V3/06 ,  H01L33/54

    Abstract: A light emitting device includes a substrate, a light source, a cover member, a light transmissive member disposed on or above the light source, a light reflecting layer disposed on or above the light transmissive member, and a light transmissive cover member. The cover member is made of a resin material containing a light reflecting substance and covers a lateral face of the light source. The light transmissive cover member covers at least a lateral face of the light transmissive member and includes an annular lens part. A thickness of a portion of the light transmissive cover member disposed above a perimeter of the light reflecting layer is larger than a thickness of a portion of the light transmissive cover member disposed above a portion of the light reflecting layer where an optical axis of the light emitting element passes through.

    LIGHT-EMITTING DEVICE AND INTEGRATED LIGHT-EMITTING DEVICE
    20.
    发明申请
    LIGHT-EMITTING DEVICE AND INTEGRATED LIGHT-EMITTING DEVICE 有权

    公开(公告)号：US20210140607A1

    公开(公告)日：2021-05-13

    申请号：US17150474

    申请日：2021-01-15

    Applicant: NICHIA CORPORATION

    Inventor： Motokazu YAMADA ,  Yuichi YAMADA

    IPC: F21V7/00 ,  H01L33/62 ,  H01L33/54 ,  H01L33/50

    Abstract: A light-emitting device includes: a base member that includes conductor wirings; a light-emitting element that is mounted on the base member and emits first light; a wavelength conversion member that is disposed on or above an upper surface of the light-emitting element and is adapted to absorb at least part of the first light and emit second light with a wavelength longer than a wavelength of the first light; a light-reflective film that is disposed on an upper surface of the wavelength conversion member; and an encapsulating member that covers the light-emitting element, the wavelength conversion member, and the light-reflective film. A ratio (H/W) of a height (H) to a width (W) of the encapsulating member is smaller than 0.5.

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