公开(公告)号：US07797935B2

公开(公告)日：2010-09-21

申请号：US12064940

申请日：2006-08-22

申请人： Tomohiko Yasuda ,  Takashi Yagyu ,  Yasuo Tanaka ,  Michio Fushiki ,  Satoru Kaneko

发明人： Tomohiko Yasuda ,  Takashi Yagyu ,  Yasuo Tanaka ,  Michio Fushiki ,  Satoru Kaneko

IPC分类号： B60K8/00 ,  F15B11/00

CPC分类号： B60W10/30 ,  B60K6/46 ,  B60K25/00 ,  B60L11/08 ,  B60L2220/44 ,  B60L2260/28 ,  B60P1/162 ,  B60W10/06 ,  B60W10/08 ,  B60W20/00 ,  B60W2300/12 ,  B60W2710/0644 ,  B60Y2200/14 ,  B65F3/00 ,  F02D29/04 ,  F02D29/06 ,  F16H61/475 ,  Y02T10/6217 ,  Y02T10/70 ,  Y02T10/7077 ,  Y02W30/10

摘要： A hydraulic drive system is provided with a generator 8 for outputting electricity corresponding to a rotation speed of an engine 7, an electric motor 11 drivable responsive to the electricity from the generator 8, hydraulic pumps 12a, 12b drivable by the electric motor 11, truck-body elevating cylinders 6 for pivoting a truck body 5 in an up-and-down direction, and a stroke detector 14 for detecting a stroke of the control apparatus of the truck-body elevating cylinders 6, and is also provided with a controller 19 for performing control of engine rotation speed. The controller 19 includes a motor electric-power computing means 19a for determining electric power for the electric motor 11, which corresponds to the stroke detected by the stroke detector 14, and a discrimination means 19b for discriminating whether or not the electricity from the generator 8 has become greater than the thus-determined electric power for the electric motor 1.

摘要翻译： 液压驱动系统设有发电机8，用于输出对应于发动机7的转速的电力;响应于发电机8的电力驱动的电动机11;由电动机11驱动的液压泵12a，12b;卡车 用于使上下方向的卡车车身5摆动的主体升降缸6，以及用于检测车体升降缸6的控制装置的行程的行程检测器14，还具备控制器19 用于执行发动机转速的控制。 控制器19包括用于确定电动机11的电力的电动机功率计算装置19a，其对应于由行程检测器14检测到的行程，以及用于鉴别来自发电机8的电力的鉴别装置19b 已经变得大于由此确定的用于电动机1的电力。

公开(公告)号：US07740323B2

公开(公告)日：2010-06-22

申请号：US12065409

申请日：2006-08-30

申请人： Satoru Kaneko ,  Tomohiko Yasuda ,  Takashi Yagyu ,  Yasuo Tanaka ,  Michio Fushiki

发明人： Satoru Kaneko ,  Tomohiko Yasuda ,  Takashi Yagyu ,  Yasuo Tanaka ,  Michio Fushiki

IPC分类号： B60P1/04 ,  F15B11/028 ,  F15B11/04 ,  F15B11/08

CPC分类号： F15B11/028 ,  B60P1/162 ,  F15B2211/20523 ,  F15B2211/20538 ,  F15B2211/3116 ,  F15B2211/329 ,  F15B2211/7053

摘要： In a hydraulic drive device for vertical pivoting movement of a load carrying platform, a first directional control valve has only three switchover positions, including a neutral position relating to operation of stopping and holding a load carrying platform, a switching position relating to operation of lifting the load carrying platform, and a switch over position relating to operation of forced lowering of the load carrying platform. A second directional control valve has only three switchover positions, including a neutral position, a switching position, and a switchover position relating to operation of allowing the load carrying platform to fall by its own weight. The device includes a first on-off valve, a second on-off valve, and a third on-off valve that are proportional control solenoid valves for switching an appropriate one of the first and second directional control valves.

摘要翻译： 在用于负载平台的垂直枢转运动的液压驱动装置中，第一方向控制阀仅具有三个切换位置，包括与停止和保持承载平台的操作有关的中立位置，与提升操作相关的切换位置 承载平台，以及与负载平台的强制降低操作有关的切换位置。 第二方向控制阀仅具有三个切换位置，包括中立位置，切换位置以及与允许承载平台自重下降的操作有关的切换位置。 该装置包括第一开关阀，第二开关阀和第三开关阀，其是用于切换第一和第二方向控制阀中适当的一个的比例控制电磁阀。

公开(公告)号：US07389061B2

公开(公告)日：2008-06-17

申请号：US11008630

申请日：2004-12-10

申请人： Hideo Yamaki ,  Yasunori Nakayama ,  Hidetoshi Noguchi ,  Satoru Shibuya ,  Tomohide Mori ,  Yasuo Tanaka ,  Hideji Higashimura

发明人： Hideo Yamaki ,  Yasunori Nakayama ,  Hidetoshi Noguchi ,  Satoru Shibuya ,  Tomohide Mori ,  Yasuo Tanaka ,  Hideji Higashimura

IPC分类号： G03G15/00

CPC分类号： G03G21/0035

摘要： A secondary cleaning device has a cleaning brush, collection roller, and controller. The cleaning brush is driven by a drive mechanism and thereby rotates in a state that brush fibers thereof are contacting with a secondary transfer belt to collect toner on the secondary transfer belt. The collection roller is driven by another drive mechanism and thereby rotates in a state contacting with the cleaning brush to collect toner from the cleaning brush. The collection roller rotates in such a manner that the collection roller and the cleaning brush move in the same direction with each other at a contact area between the collection roller and the cleaning brush. The controller controls the drive mechanism such that the circumferential speed ratio of the collection roller with respect to the cleaning brush is greater than one and smaller than two.

摘要翻译： 二次清洁装置具有清洁刷，收集辊和控制器。 清洁刷由驱动机构驱动，从而在其刷纤维与二次转印带接触的状态下旋转，以在二次转印带上收集调色剂。 收集辊由另一个驱动机构驱动，从而以与清洁刷接触的状态旋转，以从清洁刷收集调色剂。 收集辊以收集辊和清洁刷在收集辊和清洁刷之间的接触区域处于相同方向移动的方式旋转。 控制器控制驱动机构，使得收集辊相对于清洁刷的圆周速度比大于1且小于2。

公开(公告)号：US20070238289A1

公开(公告)日：2007-10-11

申请号：US11652120

申请日：2007-01-11

申请人： Yasuo Tanaka

发明人： Yasuo Tanaka

IPC分类号： H01L21/44

CPC分类号： H01L21/76819 ,  H01L21/7684 ,  H01L23/3114 ,  H01L24/11 ,  H01L24/12 ,  H01L2224/0231 ,  H01L2224/0401 ,  H01L2224/13011 ,  H01L2224/13099 ,  H01L2224/16 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/351 ,  H01L2924/00

摘要： A method of producing a semiconductor device includes the steps of forming a protrusion electrode on a semiconductor chip; and sealing the protrusion electrode and a semiconductor substrate with a resin layer. The method further includes the steps of polishing the resin layer until an upper surface of the protrusion electrode is exposed; polishing the exposed upper surface of the protrusion electrode; and forming a solder terminal on the polished upper surface of the protrusion electrode.

摘要翻译： 一种制造半导体器件的方法包括在半导体芯片上形成突起电极的步骤; 并用树脂层密封突起电极和半导体衬底。 该方法还包括：抛光树脂层直到突起电极的上表面露出的步骤; 抛光突出电极的暴露的上表面; 并在突出电极的抛光上表面上形成焊接端子。

公开(公告)号：US20070172674A1

公开(公告)日：2007-07-26

申请号：US11657529

申请日：2007-01-25

申请人： Mitsuru Nozaki ,  Morio Gaku ,  Yasuo Tanaka ,  Eiji Nagata ,  Yasuo Kikuchi ,  Masashi Yano

发明人： Mitsuru Nozaki ,  Morio Gaku ,  Yasuo Tanaka ,  Eiji Nagata ,  Yasuo Kikuchi ,  Masashi Yano

IPC分类号： B32B15/08

CPC分类号： B32B27/281 ,  B32B7/06 ,  B32B15/14 ,  B32B15/20 ,  B32B27/38 ,  C08G73/1042 ,  C08G73/12 ,  H05K3/181 ,  H05K3/386 ,  H05K2201/0154 ,  H05K2201/0358 ,  H05K2203/1152 ,  Y10S428/901 ,  Y10T428/31681 ,  Y10T428/31721

摘要： A resin composite copper foil comprising a copper foil and a resin layer containing a block copolymer polyimide and a maleimide compound, the resin layer being formed on one surface of the copper foil, a production process thereof, a copper-clad laminate using the resin composite copper foil, a production process of a printed wiring board using the copper-clad laminate, and a printed wiring board obtained by the above process.

摘要翻译： 一种树脂复合铜箔，其包含铜箔和含有嵌段共聚物聚酰亚胺和马来酰亚胺化合物的树脂层，所述树脂层形成在所述铜箔的一个表面上，其制造方法，使用所述树脂复合材料的覆铜层压板 铜箔，使用覆铜层压板的印刷电路板的制造方法，以及通过上述方法得到的印刷电路板。

公开(公告)号：US20070045793A1

公开(公告)日：2007-03-01

申请号：US11211517

申请日：2005-08-26

申请人： Yasuo Tanaka

发明人： Yasuo Tanaka

IPC分类号： H01L23/02

CPC分类号： H01L21/6835 ,  H01L21/7813 ,  H01L23/3114 ,  H01L23/525 ,  H01L24/11 ,  H01L24/12 ,  H01L2221/6834 ,  H01L2224/0231 ,  H01L2224/0401 ,  H01L2224/05147 ,  H01L2224/05647 ,  H01L2224/13099 ,  H01L2224/16 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/014 ,  H01L2924/00014

摘要： A semiconductor device includes a silicon substrate having first and second surfaces, in which a wiring pattern is formed on the first surface; a first resin layer formed over the first surface of the silicon substrate; and a second resin layer formed over the second surface of the silicon substrate. The silicon substrate has a thickness less than 150 μm, and each of the first and second resin layers has a thickness larger than that of the silicon substrate.

摘要翻译： 半导体器件包括具有第一表面和第二表面的硅衬底，其中在第一表面上形成布线图案; 形成在所述硅基板的所述第一表面上的第一树脂层; 以及形成在硅衬底的第二表面上的第二树脂层。 硅衬底具有小于150μm的厚度，并且第一和第二树脂层中的每一个的厚度都大于硅衬底的厚度。

公开(公告)号：US20070020946A1

公开(公告)日：2007-01-25

申请号：US11475242

申请日：2006-06-27

申请人： Yasuo Tanaka

发明人： Yasuo Tanaka

IPC分类号： H01L21/31

CPC分类号： H01L24/10 ,  H01L23/3114 ,  H01L24/13 ,  H01L2224/05001 ,  H01L2224/05008 ,  H01L2224/05024 ,  H01L2224/05026 ,  H01L2224/05147 ,  H01L2224/05548 ,  H01L2224/05647 ,  H01L2224/13 ,  H01L2224/13099 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01018 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01045 ,  H01L2924/01074 ,  H01L2924/014 ,  H05K3/28 ,  H05K3/381 ,  H01L2924/00 ,  H01L2924/00014

摘要： An insulating film is formed on a substrate selected from a group containing a BT resin substrate and an epoxy resin substrate. Copper wirings and copper posts including wirings are formed on the insulating film. Plasma processing is effected on exposed surfaces of the insulating film, copper wirings and copper posts provided over the semiconductor substrate, using nitrogen-type gas. An encapsulating portion is formed which covers and seals the exposed surfaces.

摘要翻译： 在选自含有BT树脂基板和环氧树脂基板的基板的基板上形成绝缘膜。 在绝缘膜上形成包括布线的铜布线和铜柱。 使用氮型气体，在设置在半导体衬底上的绝缘膜，铜布线和铜柱的暴露表面进行等离子体处理。 形成封盖部分，其覆盖和密封暴露的表面。

公开(公告)号：US20060046436A1

公开(公告)日：2006-03-02

申请号：US11235354

申请日：2005-09-27

申请人： Shinji Ohuchi ,  Yasushi Shiraishi ,  Yasuo Tanaka

发明人： Shinji Ohuchi ,  Yasushi Shiraishi ,  Yasuo Tanaka

IPC分类号： H01L21/78 ,  H01L21/44 ,  H01L21/50

CPC分类号： H01L23/3114 ,  H01L24/29 ,  H01L24/32 ,  H01L24/33 ,  H01L25/0657 ,  H01L2224/13 ,  H01L2224/274 ,  H01L2224/29027 ,  H01L2224/30135 ,  H01L2224/32058 ,  H01L2224/32105 ,  H01L2224/32145 ,  H01L2224/32227 ,  H01L2224/83191 ,  H01L2224/83815 ,  H01L2225/06513 ,  H01L2225/06524 ,  H01L2225/06551 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01075 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/15311 ,  H01L2924/00014 ,  H01L2924/00

摘要： A manufacturing method of a semiconductor device capable of mounting semiconductor elements having different functions without increasing the area of the semiconductor device, wherein a part of a wiring is formed at the side surface of a semiconductor element, and bump electrodes are formed so as to be nearly on a same plane as the wiring formed at the side surface of the semiconductor element. At least a part of ball electrodes are formed so as to connect electrically to the wiring at the side surface of the semiconductor element, the side surface of the semiconductor element is sealed with resin exposing the wiring, and the confronting surface of the circuit forming surface is sealed with resin.

摘要翻译： 一种半导体器件的制造方法，其能够安装具有不同功能的半导体元件，而不增加半导体器件的面积，其中在半导体元件的侧表面处形成布线的一部分，并且形成凸起电极，以便形成 几乎与在半导体元件的侧表面处形成的布线在同一平面上。 至少一部分球电极被形成为与半导体元件的侧表面处的布线电连接，半导体元件的侧表面被暴露布线的树脂密封，并且电路形成表面的相对表面 用树脂密封。

公开(公告)号：US20050253033A1

公开(公告)日：2005-11-17

申请号：US11126317

申请日：2005-05-11

申请人： Suguru Mizukoshi ,  Tomio Shibuya ,  Yasuo Tanaka ,  Shunya Jinnai ,  Masato Kanbe

发明人： Suguru Mizukoshi ,  Tomio Shibuya ,  Yasuo Tanaka ,  Shunya Jinnai ,  Masato Kanbe

IPC分类号： B23Q3/06 ,  B60H1/00 ,  F16L3/08 ,  F16L3/22 ,  B25B1/00 ,  G09F7/18

CPC分类号： B60H1/00557 ,  F16L3/2235

摘要： A clamp device for mounting elongated components such as pipes on a support such as a car body comprises a first clamp to be mounted on the support and a second clamp to be mounted in a recess in the first clamp. The clamp device is constructed to permit limited transverse movement of the second clamp in the recess, to accommodate bending or curving of elongated components held by the second clamp. The first clamp may also hold elongated components.

摘要翻译： 用于将细长部件（例如管道）安装在诸如车体的支撑件上的夹紧装置包括要安装在支撑件上的第一夹具和要安装在第一夹具中的凹部中的第二夹具。 夹持装置被构造成允许第二夹具在凹部中的有限的横向移动，以适应由第二夹具保持的细长部件的弯曲或弯曲。 第一夹具还可以保持细长部件。

公开(公告)号：US06746955B2

公开(公告)日：2004-06-08

申请号：US10305247

申请日：2002-11-27

申请人： Yasuo Tanaka

发明人： Yasuo Tanaka

IPC分类号： H01L2144

CPC分类号： H01L24/10 ,  H01L23/3114 ,  H01L23/3142 ,  H01L24/13 ,  H01L2224/13 ,  H01L2224/13099 ,  H01L2924/01004 ,  H01L2924/01006 ,  H01L2924/01018 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/12044 ,  H01L2924/00

摘要： A method of manufacturing a semiconductor device includes forming copper conductive patterns on an insulating layer formed on a semiconductor base, ashing the whole insulating layer including the copper conductive patterns at a temperature at which no oxide film is formed on the copper conductive patterns, and thereafter baking the whole insulating layer including the copper conductive patterns in an oxidative atmosphere at a temperature range of about 150° C. to about 200° C. After the baking step, an encapsulating resin is formed on the insulating layer including the copper conductive patterns.

摘要翻译： 一种制造半导体器件的方法包括在形成于半导体基底上的绝缘层上形成铜导电图案，在铜导电图案上没有形成氧化膜的温度下，将包括铜导电图案的整个绝缘层灰化，此后 在约150℃至约200℃的温度范围内在氧化气氛中烘烤包括铜导电图案的整个绝缘层。在烘烤步骤之后，在包括铜导电图案的绝缘层上形成封装树脂。