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    METHOD OF PRODUCING SIDE-EMITTING COMPONENTS AND SIDE-EMITTING COMPONENT
    11.
    发明申请
    METHOD OF PRODUCING SIDE-EMITTING COMPONENTS AND SIDE-EMITTING COMPONENT 审中-公开

    公开(公告)号：US20200058836A1

    公开(公告)日：2020-02-20

    申请号：US16348015

    申请日：2018-02-28

    Applicant: OSRAM Opto Semiconductors GmbH

    Inventor： Martin Brandl

    IPC: H01L33/60

    Abstract: A method of producing side-emitting components includes providing a plurality of semiconductor chips on an auxiliary carrier, wherein the semiconductor chips on the auxiliary carrier are spaced apart from each other and each have a side surface provided with a transparent protective layer; covering the semiconductor chips with a radiation-reflecting molding compound so that in a plan view of the auxiliary carrier, the semiconductor chips are completely covered by the molding compound; and singulating the molding compound and the semiconductor chips into a plurality of components so that the components each include a semiconductor chip, wherein the components are singulated at the associated transparent protective layer, as a result of which the components each have a radiation exit surface exposed by the molding compound and formed by a surface of the remaining or exposed transparent protective layer.

    CARRIER SUBSTRATE FOR AN OPTOELECTRONIC SEMICONDUCTOR COMPONENT
    12.
    发明申请
    CARRIER SUBSTRATE FOR AN OPTOELECTRONIC SEMICONDUCTOR COMPONENT 审中-公开

    公开(公告)号：US20190009441A1

    公开(公告)日：2019-01-10

    申请号：US15752455

    申请日：2016-08-11

    Applicant: OSRAM Opto Semiconductors GmbH

    Inventor： Stephan Eicher ,  Martin Brandl ,  Markus Boss

    IPC: B29C45/14 ,  H01L33/48 ,  H01L23/00

    Abstract: A method of producing a carrier substrate for an optoelectronic semiconductor component includes: providing a leadframe including a first electrically conductive contact section and a second electrically conductive contact section, and injection molding a housing including a housing frame embedding the leadframe by an injection-molding material free of epoxy such that the leadframe embedded in the housing frame of the injection-molded housing forms a carrier substrate for an optoelectronic semiconductor component.

    OPTOELECTRONIC COMPONENT AND METHOD OF PRODUCING SAME
    15.
    发明申请
    OPTOELECTRONIC COMPONENT AND METHOD OF PRODUCING SAME 审中-公开

    公开(公告)号：US20170084805A1

    公开(公告)日：2017-03-23

    申请号：US15116846

    申请日：2015-02-03

    Applicant: OSRAM Opto Semiconductors GmbH

    Inventor： Christian Gatzhammer ,  Martin Brandl ,  Tobias Gebuhr

    IPC: H01L33/62 ,  H01L25/075 ,  H01L33/48

    CPC classification number: H01L33/62 ,  H01L25/0756 ,  H01L33/483 ,  H01L33/486 ,  H01L2933/0066

    Abstract: An optoelectronic component includes an optoelectronic semiconductor chip including a first and second electrical contacts; a first leadframe section comprising a first chip contact pad and a first soldering contact pad situated opposite the first chip contact pad; and a second leadframe section including a second chip contact pad and a second soldering contact pad situated opposite the second chip contact pad, wherein the first electrical contact electrically conductively connects to the first chip contact pad and the second electrical contact electrically conductively connects to the second chip contact pad, a dielectric element is arranged between the first and second leadframe sections, the first and second leadframe sections and the dielectric element are embedded into a housing such that at least parts of the first and second soldering contact pads are accessible, and a surface of the dielectric element is exposed at the underside of the housing.

    Electrical component and method of producing electrical components
    17.
    发明授权
    Electrical component and method of producing electrical components 有权
    电气部件的制造方法和电气部件的制造方法

    公开(公告)号：US09209367B2

    公开(公告)日：2015-12-08

    申请号：US14410956

    申请日：2013-06-18

    Applicant: OSRAM Opto Semiconductors GmbH

    Inventor： Markus Boss ,  Markus Pindl ,  Tobias Gebuhr ,  Simon Jerebic ,  Martin Brandl

    IPC: H01L33/00 ,  H01L33/54 ,  H01L33/48 ,  H01L33/62 ,  H01L21/56 ,  H01L21/78 ,  H01L23/29 ,  H01L23/498 ,  H01L33/58

    CPC classification number: H01L33/54 ,  H01L21/565 ,  H01L21/78 ,  H01L23/29 ,  H01L23/49811 ,  H01L23/49861 ,  H01L33/486 ,  H01L33/58 ,  H01L33/62 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2933/005 ,  H01L2924/00014

    Abstract: An electrical component includes a closed lead frame with a passage opening at least one electrical component arranged within the passage opening, the electrical component including a first contact pad on one side of the electrical component and a second contact pad on a second side of the electric component, wherein the second side faces the first side and the second contact pad is electrically coupled to the lead frame; and an encapsulation which mechanically couples the electrical component to the lead frame, wherein the lead frame includes a recess on one side, the recess extending from an edge of the lead frame to the passage opening and connecting at least one electrical connecting element from the edge of the lead frame to the component arranged in the passage opening.

    Abstract translation: 电气部件包括具有通道开口的封闭引线框架，所述通道开口至少设置在通道开口内的电气部件，所述电气部件包括在所述电气部件的一侧上的第一接触焊盘和所述电气部件的第二侧上的第二接触焊盘 其中所述第二侧面向所述第一侧，并且所述第二接触焊盘电耦合到所述引线框架; 以及封装，其将所述电气部件机械耦合到所述引线框架，其中所述引线框架包括在一侧上的凹部，所述凹部从所述引线框架的边缘延伸到所述通道开口，并且将至少一个电连接元件从所述边缘 引导框架布置在通道开口中的部件。

    LIGHT-EMITTING COMPONENT AND METHOD OF PRODUCING A LIGHT-EMITTING COMPONENT
    19.
    发明申请
    LIGHT-EMITTING COMPONENT AND METHOD OF PRODUCING A LIGHT-EMITTING COMPONENT 审中-公开

    公开(公告)号：US20200028038A1

    公开(公告)日：2020-01-23

    申请号：US16490944

    申请日：2018-03-08

    Applicant: OSRAM Opto Semiconductors GmbH

    Inventor： Martin Brandl ,  Markus Pindl

    IPC: H01L33/54 ,  H01L33/48 ,  H01L33/58 ,  H01L33/56

    Abstract: A light-emitting component includes a light-emitting element and a housing with a cavity. The housing includes a housing material that absorbs at least 80 percent of light in the visible range. The cavity is formed by a limiting wall, formed by a housing surface, and a plane of the element. The light-emitting element arranged within the cavity of the housing and positioned above the element plane includes an emission side located opposite to the element plane. The cavity is at least partially filled with a transparent material composed of a first material and a second material, wherein the first material at least partially covers the limiting wall, and the second material at least partially covers the emission side. A boundary surface is formed between the first material and the second material. A first refractive index of the first material is smaller than a second refractive index of the second material.

    Light Emitting Device and Method for Manufacturing Light Emitting Device
    20.
    发明申请
    Light Emitting Device and Method for Manufacturing Light Emitting Device 审中-公开

    公开(公告)号：US20190326490A1

    公开(公告)日：2019-10-24

    申请号：US16382008

    申请日：2019-04-11

    Applicant: OSRAM Opto Semiconductors GmbH

    Inventor： Luca Haiberger ,  Sam Chou ,  Martin Brandl

    IPC: H01L33/60 ,  H01L33/48 ,  H01L33/50 ,  H01L33/44

    Abstract: A light-emitting device and a method for manufacturing a light emitting device are disclosed. In an embodiment a light-emitting device includes a light-emitting semiconductor chip having a light-outcoupling surface and an optical element arranged on the light-outcoupling surface, wherein the light-emitting semiconductor chip is laterally surrounded by a frame element in a form-locking manner, wherein the optical element is mounted on the frame element, wherein the frame element projects beyond the light-outcoupling surface in a vertical direction such that a gas-filled gap is present at least in a partial region between the light-outcoupling surface and the optical element, and wherein the frame element has a channel connecting the gap to an atmosphere surrounding the light-emitting device.

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