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    LED MODULE
    11.
    发明申请
    LED MODULE 有权
    LED模块

    公开(公告)号：US20170040508A1

    公开(公告)日：2017-02-09

    申请号：US15220790

    申请日：2016-07-27

    Applicant: Panasonic Intellectual Property Management Co., Ltd.

    Inventor： Naoki TAGAMI ,  Masumi ABE ,  Hisaki FUJITANI ,  Kosuke TAKEHARA ,  Toshiaki KURACHI

    IPC: H01L33/54 ,  H01L33/48 ,  H01L33/62

    CPC classification number: H01L33/62 ,  H01L33/60 ,  H01L2224/48091 ,  H01L2224/48228 ,  H01L2224/73265 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00012

    Abstract: A light emitting diode (LED) module including: a substrate; a resist including a plurality of layers above the substrate; and an LED element mounted above the substrate. A content percentage of at least one of a phenyl group, an ester bond, and a carbon double bond in a second layer that is an uppermost layer of the plurality of layers is lower than a content percentage of the at least one of the phenyl group, the ester bond, and the carbon double bond in a first layer that is an underlying layer of the plurality of layers, the underlying layer being located below the uppermost layer.

    Abstract translation: 一种发光二极管（LED）模块，包括：基板; 抗蚀剂，其包括在所述基板上方的多个层; 以及安装在基板上方的LED元件。 作为多个层的最上层的第二层中的苯基，酯键和碳双键中的至少一个的含量百分比低于所述至少一个苯基的含量百分比 ，酯键和作为多个层的下层的第一层中的碳双键，下层位于最上层的下方。

    LED MODULE
    12.
    发明申请
    LED MODULE 有权
    LED模块

    公开(公告)号：US20160260871A1

    公开(公告)日：2016-09-08

    申请号：US15013457

    申请日：2016-02-02

    Applicant: Panasonic Intellectual Property Management Co., Ltd.

    Inventor： Kosuke TAKEHARA ,  Hisaki FUJITANI ,  Naoki TAGAMI

    IPC: H01L33/50 ,  H01L33/56 ,  H01L33/62

    CPC classification number: H01L33/502 ,  H01L25/0753 ,  H01L33/50 ,  H01L33/56 ,  H01L33/60 ,  H01L33/62 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48228 ,  H01L2224/49107 ,  H01L2224/73265 ,  H05K1/0274 ,  H05K2201/10106 ,  H01L2924/00014 ,  H01L2924/00

    Abstract: An LED module includes a mount board and an LED chip. The mount board includes: an insulation substrate that includes resin and glass; a first conductor, a second conductor and a third conductor; and a white resist layer. The white resist layer is provided with a first opening, a second opening and at least one third opening for exposing the first conductor, the second conductor and the third conductor, respectively. The LED module further includes a wavelength conversion layer disposed between the LED chip and the third conductor in a thickness direction of the LED chip. The wavelength conversion layer includes phosphor particles that are excited by first light emitted from the LED chip to emit second light having wavelengths greater than wavelengths of the first light.

    Abstract translation: LED模块包括安装板和LED芯片。 安装板包括：包括树脂和玻璃的绝缘基板; 第一导体，第二导​​体和第三导体; 和白色抗蚀剂层。 白色抗蚀剂层设置有分别暴露第一导体，第二导​​体和第三导体的第一开口，第二开口和至少一个第三开口。 LED模块还包括在LED芯片的厚度方向上设置在LED芯片和第三导体之间的波长转换层。 波长转换层包括由从LED芯片发射的第一光激发的荧光体颗粒，以发射具有大于第一光的波长的波长的第二光。

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