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公开(公告)号：US20180108818A1
公开(公告)日：2018-04-19
申请号：US15715592
申请日：2017-09-26
Inventor： Kosuke TAKEHARA , Hisaki FUJITANI , Masumi ABE
CPC classification number: H01L33/507 , H01L25/0753 , H01L33/54 , H01L33/58 , H01L33/62 , H01L2224/48095 , H01L2224/48465 , H01L2924/181 , H01L2933/0041 , H01L2924/00012
Abstract: A light-emitting module is provided. The light-emitting module includes a substrate, a light-emitting element mounted on the substrate, and a sealant that seals the light-emitting element. The sealant includes a resin material containing a wavelength converter. A cross section of the sealant taken through the light-emitting element satisfies HMAX/W≤0.3, where W is a width of a base of the sealant and HMAX is a maximum height of the sealant.
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公开(公告)号：US20170263835A1
公开(公告)日：2017-09-14
申请号：US15454256
申请日：2017-03-09
Inventor： Masumi ABE , Naoki TAGAMI , Toshiaki KURACHI
CPC classification number: H01L33/62 , H01L25/0753 , H01L33/32 , H01L33/502 , H01L33/56 , H01L33/60 , H01L33/647 , H01L2224/48095 , H01L2224/48465 , H01L2224/73265 , H01L2924/181 , H01L2924/00012
Abstract: An LED module includes a resin substrate, a metal layer formed above the resin substrate, a resist layer formed above the metal layer and including a plurality of layers, and an LED chip mounted above the resist layer via an adhesive. The resist layer comprises an epoxy acrylic-based or a silicon-based resin material, and the adhesive is white.
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公开(公告)号：US20170040506A1
公开(公告)日：2017-02-09
申请号：US15223833
申请日：2016-07-29
Inventor： Masumi ABE , Naoki TAGAMI , Yasuharu UENO , Ryoji YOKOTANI , Toshiaki KURACHI
CPC classification number: H01L33/507 , H01L33/501 , H01L33/56 , H01L2224/48091 , H01L2224/48137 , H01L2224/48227 , H01L2924/181 , H01L2924/00014 , H01L2924/00012
Abstract: A light-emitting apparatus includes: a substrate; an LED chip disposed on the substrate; and a sealing member that contains a yellow phosphor and a cerium oxide, and seals the LED chip. An amount of the cerium oxide contained in the sealing member depends on a peak wavelength of a light emission spectrum of the LED chip, and when the peak wavelength of the light emission, spectrum of the LED chip is 470 nm or less, the amount of the cerium oxide contained in the sealing member is 0.100 wt % or less.
Abstract translation: 发光装置包括：基板; 设置在所述基板上的LED芯片; 以及包含黄色荧光体和氧化铈的密封构件，并且密封LED芯片。 包含在密封构件中的氧化铈的量取决于LED芯片的发光光谱的峰值波长，并且当发光的峰值波长，LED芯片的光谱为470nm以下时， 包含在密封构件中的氧化铈为0.100重量％以下。
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公开(公告)号：US20180082986A1
公开(公告)日：2018-03-22
申请号：US15819069
申请日：2017-11-21
Inventor： Masumi ABE , Naoki TAGAMI , Toshiaki KURACHI
CPC classification number: H01L25/0753 , H01L25/50 , H01L27/156 , H01L33/44 , H01L33/504 , H01L33/60 , H01L33/62 , H01L2224/48091 , H01L2224/48137 , H01L2924/181 , H01L2933/0033 , H01L2933/0041 , H01L2933/005 , H01L2933/0091 , H01L2924/00014 , H01L2924/00012
Abstract: A method of manufacturing a light-emitting apparatus includes mounting a first light-emitting element and a second light-emitting element on a substrate. A sealing layer is formed above the first light-emitting element and the second light-emitting element for sealing the first light-emitting element and the second light-emitting element. A first phosphor layer is applied above a first portion of the sealing layer, in which the first phosphor layer includes at least one first phosphor. A second phosphor layer is applied above a second portion of the sealing layer, in which the second phosphor layer includes at least one second phosphor.
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公开(公告)号：US20180062110A1
公开(公告)日：2018-03-01
申请号：US15671270
申请日：2017-08-08
Inventor： Masumi ABE , Toshifumi OGATA , Naoki TAGAMI , Toshiaki KURACHI
CPC classification number: H01L51/5246 , F21V13/02 , H01L27/153 , H01L33/0095 , H01L33/20 , H01L33/62 , H01L51/5212 , H01L51/5228 , H01L51/5253 , H01L51/5268 , H01L2224/48091 , H01L2251/5361 , H05B33/04
Abstract: A light-emitting apparatus is provided. The light-emitting apparatus includes a substrate, a light-emitting element on the substrate, a first sealing layer which seals the light-emitting element, and a second b sealing layer. The substrate includes a base, an interconnect layer disposed on the base and electrically connected to the light-emitting element, a metal layer which covers a portion of the interconnect layer, and an electrically insulating layer which covers another portion of the interconnect layer. The second sealing layer seals a boundary between the metal layer and the electrically insulating layer.
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Patent Agency Ranking
公开(公告)号：US20170040510A1
公开(公告)日：2017-02-09
申请号：US15223043
申请日：2016-07-29
Inventor： Naoki TAGAMI , Masumi ABE , Hisaki FUJITANI , Kosuke TAKEHARA , Toshiaki KURACHI
CPC classification number: H01L33/56 , H01L33/44 , H01L33/486 , H01L33/501 , H01L33/62 , H01L33/642 , H01L2224/48091 , H01L2224/48228 , H01L2224/73265 , H01L2924/181 , H01L2924/00014 , H01L2924/00012
Abstract: A light emitting diode (LED) module which includes: a substrate; a resist including a plurality of layers above the substrate; and an LED element mounted above the substrate. The plurality of layers includes a second layer that is an uppermost layer and a first layer that is an underlying layer. The second layer that is the uppermost layer includes fluorine as a component.
Abstract translation: 一种发光二极管（LED）模块，包括：基板; 抗蚀剂，其包括在所述基板上方的多个层; 以及安装在基板上方的LED元件。 多个层包括作为最上层的第二层和作为下层的第一层。 作为最上层的第二层包括氟作为组分。
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7.发明申请公开(公告)号：US20190264099A1
公开(公告)日：2019-08-29
申请号：US16254118
申请日：2019-01-22
Inventor： Masumi ABE , Toshiaki KURACHI
Abstract: A resin powder includes resin particles each binding a first quantum dot phosphor.
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公开(公告)号：US20180119898A1
公开(公告)日：2018-05-03
申请号：US15790674
申请日：2017-10-23
Inventor： Hisaki FUJITANI , Masumi ABE , Kosuke TAKEHARA
IPC: F21K9/64 , H01L25/075
CPC classification number: F21K9/64 , F21K9/00 , F21K9/23 , F21K9/27 , F21K9/68 , F21K9/69 , F21S8/04 , F21V5/00 , F21V5/04 , F21V7/0091 , F21V13/02 , F21Y2103/10 , F21Y2115/10 , H01L25/0753
Abstract: A light-emitting module is provided. The light emitting module includes a substrate; a thin-film layer that is disposed above the substrate, the thin-film layer defining an opening that exposes a surface of the substrate; a light-emitting element disposed above the substrate and in the opening; and a sealant disposed above the substrate and in the opening, the sealant containing a wavelength converter and sealing the light-emitting element. A thickness of the thin-film layer is less than a thickness of the sealant. An edge portion of the sealant is in contact with the thin-film layer. The surface of the substrate and a surface of the thin-film layer are hydrophilic. The surface of the thin-film layer has a lower wettability than a wettability of the surface of the substrate.
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公开(公告)号：US20180069162A1
公开(公告)日：2018-03-08
申请号：US15692527
申请日：2017-08-31
Inventor： Masumi ABE , Toshifumi OGATA , Toshiaki KURACHI
IPC: H01L33/50 , H01L25/075 , H01L27/15 , H01L33/56
CPC classification number: H01L33/507 , H01L25/0753 , H01L27/156 , H01L33/56 , H01L33/62 , H01L2224/48091 , H01L2224/48137
Abstract: A light-emitting apparatus includes a first relay line and a second relay line. The first and second relay lines are disposed between a first region and a second region of a substrate. Further, the first and second relay lines extend at least partially parallel to each other in a second direction that crosses a first direction in which the first region and the second region are aligned. The first relay line electrically connects a first light-emitting element group disposed in the first region and a third light-emitting element group disposed in the second region. The second relay line electrically connects a second light-emitting element group disposed in the first region and a fourth light-emitting element group disposed in the second region.
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公开(公告)号：US20180062058A1
公开(公告)日：2018-03-01
申请号：US15666935
申请日：2017-08-02
Inventor： Masumi ABE , Naoki TAGAMI , Toshiaki KURACHI
IPC: H01L33/64 , C09K11/02 , C09K11/62 , C09K11/77 , H01L33/56 , H01L33/50 , H01L33/60 , H01L33/32 , H01L33/62 , H01L25/075 , F21V29/75 , F21V3/02 , F21V7/22 , F21V29/89 , F21V23/02
CPC classification number: H01L33/644 , C09K11/025 , C09K11/0883 , C09K11/62 , C09K11/7706 , F21S8/026 , F21V3/02 , F21V7/22 , F21V23/023 , F21V29/75 , F21V29/89 , F21Y2115/10 , H01L25/0753 , H01L33/32 , H01L33/502 , H01L33/56 , H01L33/60 , H01L33/62 , H01L33/641 , H01L2224/48091 , H01L2224/48137 , H01L2924/00014
Abstract: A light-emitting apparatus is provided. The light-emitting apparatus includes: a substrate; an LED chip on the substrate; and a sealant which seals the LED chip. The sealant includes at least 0.05 wt % oxide of a transition metal as an additive for inhibiting deterioration of a base material of the sealant. Additionally or alternatively, the sealant includes at least one of a metal salt of a transition metal and an organic complex of a transition metal, as the additive.
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