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公开(公告)号：US20170263835A1
公开(公告)日：2017-09-14
申请号：US15454256
申请日：2017-03-09
Inventor： Masumi ABE , Naoki TAGAMI , Toshiaki KURACHI
CPC classification number: H01L33/62 , H01L25/0753 , H01L33/32 , H01L33/502 , H01L33/56 , H01L33/60 , H01L33/647 , H01L2224/48095 , H01L2224/48465 , H01L2224/73265 , H01L2924/181 , H01L2924/00012
Abstract: An LED module includes a resin substrate, a metal layer formed above the resin substrate, a resist layer formed above the metal layer and including a plurality of layers, and an LED chip mounted above the resist layer via an adhesive. The resist layer comprises an epoxy acrylic-based or a silicon-based resin material, and the adhesive is white.
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公开(公告)号：US20170040506A1
公开(公告)日：2017-02-09
申请号：US15223833
申请日：2016-07-29
Inventor： Masumi ABE , Naoki TAGAMI , Yasuharu UENO , Ryoji YOKOTANI , Toshiaki KURACHI
CPC classification number: H01L33/507 , H01L33/501 , H01L33/56 , H01L2224/48091 , H01L2224/48137 , H01L2224/48227 , H01L2924/181 , H01L2924/00014 , H01L2924/00012
Abstract: A light-emitting apparatus includes: a substrate; an LED chip disposed on the substrate; and a sealing member that contains a yellow phosphor and a cerium oxide, and seals the LED chip. An amount of the cerium oxide contained in the sealing member depends on a peak wavelength of a light emission spectrum of the LED chip, and when the peak wavelength of the light emission, spectrum of the LED chip is 470 nm or less, the amount of the cerium oxide contained in the sealing member is 0.100 wt % or less.
Abstract translation: 发光装置包括：基板; 设置在所述基板上的LED芯片; 以及包含黄色荧光体和氧化铈的密封构件，并且密封LED芯片。 包含在密封构件中的氧化铈的量取决于LED芯片的发光光谱的峰值波长，并且当发光的峰值波长，LED芯片的光谱为470nm以下时， 包含在密封构件中的氧化铈为0.100重量％以下。
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3.发明申请公开(公告)号：US20150204493A1
公开(公告)日：2015-07-23
申请号：US14596548
申请日：2015-01-14
Inventor： Koji OMURA , Toshiaki KURACHI
CPC classification number: F21K9/64 , F21K9/232 , F21S8/026 , F21Y2105/10 , F21Y2113/13 , F21Y2115/10 , H01L25/00 , H01L2224/45144 , H01L2224/48137 , H01L2924/181 , H01L2924/00 , H01L2924/00012
Abstract: A light emitting device that emits white light includes first and second light emitting elements which have different emission peak wavelengths within a range of 440 nm to 495 nm. The device also includes a wavelength conversion material which converts a wavelength of light emitted by at least one of the first and second light emitting elements. The white light has an emission spectrum peaked at a first peak wavelength and a second peak wavelength. The first peak wavelength corresponds to the emission peak wavelength of the first light emitting element, and the second peak wavelength corresponds to the emission peak wavelength of the second light emitting element. Where a light intensity at one of the first peak wavelength and the second peak wavelength is 1, a light intensity at a bottom of a valley between the first and second peak wavelengths is 0.5 or higher but lower than 1.0.
Abstract translation: 发射白光的发光器件包括在440nm至495nm的范围内具有不同发射峰值波长的第一和第二发光元件。 该装置还包括波长转换材料，其转换由第一和第二发光元件中的至少一个发射的光的波长。 白光具有在第一峰值波长和第二峰值波长处峰值的发射光谱。 第一峰值波长对应于第一发光元件的发射峰值波长，第二峰值波长对应于第二发光元件的发射峰值波长。 在第一峰值波长和第二峰值波长之一处的光强度为1的情况下，第一和第二峰值波长之间的谷底部的光强度为0.5以上且低于1.0。
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公开(公告)号：US20170263591A1
公开(公告)日：2017-09-14
申请号：US15451985
申请日：2017-03-07
Inventor： Masumi ABE , Naoki TAGAMI , Toshiaki KURACHI
IPC: H01L25/075 , H01L33/62 , H01L25/00 , H01L33/50
CPC classification number: H01L25/0753 , H01L25/50 , H01L27/156 , H01L33/44 , H01L33/504 , H01L33/60 , H01L33/62 , H01L2224/48091 , H01L2224/48137 , H01L2924/181 , H01L2933/0033 , H01L2933/0041 , H01L2933/005 , H01L2933/0091 , H01L2924/00014 , H01L2924/00012
Abstract: A light-emitting apparatus is provided. The light-emitting apparatus includes a first and second light-emitting elements disposed on a substrate. A sealing layer is above the first and second light-emitting elements for sealing the first and second light-emitting elements. A first phosphor layer is above a first portion of the sealing layer. The first phosphor layer includes at least one first phosphor. A second phosphor layer is above a second portion of the sealing layer. The second phosphor layer includes at least one second phosphor. The first phosphor layer is configured to emit light, which is emitted as a result of emission by the first light-emitting element, having a first color. The second phosphor layer is configured to emit light, which is emitted as a result of emission by the second light-emitting element, having a second color different from the first color.
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公开(公告)号：US20170040497A1
公开(公告)日：2017-02-09
申请号：US15223713
申请日：2016-07-29
Inventor： Naoki TAGAMI , Masumi ABE , Hisaki FUJITANI , Kosuke TAKEHARA , Toshiaki KURACHI
CPC classification number: H01L33/486 , H01L2224/32225 , H01L2224/48227 , H01L2224/48228 , H01L2224/73265 , H01L2924/181 , H01L2924/00012 , H01L2924/00
Abstract: A light emitting diode (LED) module including: a substrate; a resist including a plurality of layers, above the substrate; and an LED element mounted above the resist via an adhesive. The adhesive includes an addition-reaction type silicone resin. In the resist, a higher positioned layer of the plurality of layers is lower in at least one of sulfur content, phosphorus content, and nitrogen content than a lower positioned layer of the plurality of layers.
Abstract translation: 一种发光二极管（LED）模块，包括：基板; 包含多个层的抗蚀剂; 以及通过粘合剂安装在抗蚀剂上方的LED元件。 粘合剂包括加成反应型有机硅树脂。 在抗蚀剂中，与多层的下定位层相比，多层中较高定位层的硫含量，磷含量和氮含量中的至少一种较低。
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Patent Agency Ranking
公开(公告)号：US20160081142A1
公开(公告)日：2016-03-17
申请号：US14828586
申请日：2015-08-18
Inventor： Masumi ABE , Toshifumi OGATA , Atsuyoshi ISHIMORI , Kenji SUGIURA , Toshiaki KURACHI
CPC classification number: H05B33/04 , H01L33/501 , H01L33/504 , H01L33/508 , H01L2224/48091 , H01L2224/48137 , H01L2924/181 , H01L2933/0041 , H05B33/10 , H01L2924/00014 , H01L2924/00012
Abstract: Light emitting apparatus including: substrate; LED chips on substrate; first sealing layer sealing LED chips; second sealing layer above first sealing layer; and phosphor layer containing yellow phosphor, disposed between first sealing layer and second sealing layer, wherein phosphor layer contains the yellow phosphor in higher density than first sealing layer and second sealing layer.
Abstract translation: 发光装置，包括：基板; 基板上的LED芯片; 第一密封层密封LED芯片; 第一密封层上方的第二密封层; 以及配置在第一密封层和第二密封层之间的含有黄色荧光体的荧光体层，其中荧光体层含有比第一密封层和第二密封层更高密度的黄色荧光体。
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公开(公告)号：US20180082986A1
公开(公告)日：2018-03-22
申请号：US15819069
申请日：2017-11-21
Inventor： Masumi ABE , Naoki TAGAMI , Toshiaki KURACHI
CPC classification number: H01L25/0753 , H01L25/50 , H01L27/156 , H01L33/44 , H01L33/504 , H01L33/60 , H01L33/62 , H01L2224/48091 , H01L2224/48137 , H01L2924/181 , H01L2933/0033 , H01L2933/0041 , H01L2933/005 , H01L2933/0091 , H01L2924/00014 , H01L2924/00012
Abstract: A method of manufacturing a light-emitting apparatus includes mounting a first light-emitting element and a second light-emitting element on a substrate. A sealing layer is formed above the first light-emitting element and the second light-emitting element for sealing the first light-emitting element and the second light-emitting element. A first phosphor layer is applied above a first portion of the sealing layer, in which the first phosphor layer includes at least one first phosphor. A second phosphor layer is applied above a second portion of the sealing layer, in which the second phosphor layer includes at least one second phosphor.
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公开(公告)号：US20180062110A1
公开(公告)日：2018-03-01
申请号：US15671270
申请日：2017-08-08
Inventor： Masumi ABE , Toshifumi OGATA , Naoki TAGAMI , Toshiaki KURACHI
CPC classification number: H01L51/5246 , F21V13/02 , H01L27/153 , H01L33/0095 , H01L33/20 , H01L33/62 , H01L51/5212 , H01L51/5228 , H01L51/5253 , H01L51/5268 , H01L2224/48091 , H01L2251/5361 , H05B33/04
Abstract: A light-emitting apparatus is provided. The light-emitting apparatus includes a substrate, a light-emitting element on the substrate, a first sealing layer which seals the light-emitting element, and a second b sealing layer. The substrate includes a base, an interconnect layer disposed on the base and electrically connected to the light-emitting element, a metal layer which covers a portion of the interconnect layer, and an electrically insulating layer which covers another portion of the interconnect layer. The second sealing layer seals a boundary between the metal layer and the electrically insulating layer.
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公开(公告)号：US20170040510A1
公开(公告)日：2017-02-09
申请号：US15223043
申请日：2016-07-29
Inventor： Naoki TAGAMI , Masumi ABE , Hisaki FUJITANI , Kosuke TAKEHARA , Toshiaki KURACHI
CPC classification number: H01L33/56 , H01L33/44 , H01L33/486 , H01L33/501 , H01L33/62 , H01L33/642 , H01L2224/48091 , H01L2224/48228 , H01L2224/73265 , H01L2924/181 , H01L2924/00014 , H01L2924/00012
Abstract: A light emitting diode (LED) module which includes: a substrate; a resist including a plurality of layers above the substrate; and an LED element mounted above the substrate. The plurality of layers includes a second layer that is an uppermost layer and a first layer that is an underlying layer. The second layer that is the uppermost layer includes fluorine as a component.
Abstract translation: 一种发光二极管（LED）模块，包括：基板; 抗蚀剂，其包括在所述基板上方的多个层; 以及安装在基板上方的LED元件。 多个层包括作为最上层的第二层和作为下层的第一层。 作为最上层的第二层包括氟作为组分。
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公开(公告)号：US20150137165A1
公开(公告)日：2015-05-21
申请号：US14546326
申请日：2014-11-18
Inventor： Naoki TAGAMI , Toshiaki KURACHI
CPC classification number: H01L33/507 , H01L25/0753 , H01L2224/45124 , H01L2224/45139 , H01L2224/45144 , H01L2224/45147 , H01L2224/48091 , H01L2224/48137 , H01L2224/73265 , H01L2224/8592 , H01L2924/181 , H01L2933/0091 , H01L2924/00012 , H01L2924/00014
Abstract: A light-emitting device includes a mounting board, a light-emitting element mounted on a main face of the mounting board, and a sealing member covering the light-emitting element. The sealing member includes a first sealing layer covering a part of the main face of the mounting board and the light-emitting element, and a second sealing layer covering the first sealing layer. The first sealing layer includes particles containing at least one material selected from a group consisting of cerium oxide, titanium oxide, iron oxide, and carbon, and silicone resin. The second sealing layer includes phosphor particles for converting a part of light emitted from light-emitting element into a long wavelength light and radiating it, and silicone resin.
Abstract translation: 发光装置包括安装板，安装在安装板的主面上的发光元件和覆盖发光元件的密封构件。 密封构件包括覆盖安装板的主面的一部分和发光元件的第一密封层和覆盖第一密封层的第二密封层。 第一密封层包括含有选自由氧化铈，氧化钛，氧化铁和碳组成的组中的至少一种材料的颗粒和有机硅树脂。 第二密封层包括用于将从发光元件发射的光的一部分转换成长波长光并将其放射的荧光体颗粒，以及硅树脂。
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