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公开(公告)号：US20170263823A1
公开(公告)日：2017-09-14
申请号：US15454310
申请日：2017-03-09
Inventor： Masumi ABE , Naoki TAGAMI , Toshiaki KURACHI
CPC classification number: H01L33/486 , H01L33/502 , H01L33/56 , H01L33/60 , H01L33/62 , H01L2224/48095 , H01L2224/48465 , H01L2224/73265
Abstract: A light-emitting diode (LED) module is provided. The LED module includes a substrate, a metal layer disposed above the substrate, a resist layer disposed above the substrate and including a plurality of layers, an LED chip mounted above the substrate, and a wire connecting the metal layer and the LED chip. In a first region in which the LED chip is mounted, at least a portion of the resist layer is disposed directly on the substrate with the LED chip being mounted above the resist layer via an adhesive. In a second region which includes a connection at which the wire and the metal layer are connected and a periphery of the connection, the metal layer is disposed above the substrate with the resist layer being disposed above the metal layer.
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公开(公告)号：US20160260878A1
公开(公告)日：2016-09-08
申请号：US15012133
申请日：2016-02-01
Inventor： Kosuke TAKEHARA , Hisaki FUJITANI , Naoki TAGAMI , Toshiaki KURACHI
CPC classification number: H01L33/62 , H01L33/50 , H01L33/505 , H01L33/52 , H01L33/60 , H01L2224/45144 , H01L2224/48091 , H01L2224/49107 , H01L2224/73265 , H05K1/0274 , H05K2201/0195 , H05K2201/10106 , H01L2924/00014 , H01L2924/00
Abstract: A mount substrate includes: an insulation substrate containing resin and glass; connection conductors formed on a surface of the insulation substrate; a first white resist layer that covers the connection conductors; and a second white resist layer that covers the first white resist. Each of the connection conductors includes a copper foil and a plating layer partly formed on the copper foil. The plating layer is formed of metal having oxidation-resistant and corrosion-resistant characteristics higher than those of copper. The first white resist layer is formed with first openings that respectively expose the plating layers of the connection conductors. The second white resist layer covers a periphery of each plating layer of the connection conductors in planar view.
Abstract translation: 安装基板包括：包含树脂和玻璃的绝缘基板; 形成在所述绝缘基板的表面上的连接导体; 覆盖连接导体的第一白色抗蚀剂层; 以及覆盖第一白色抗蚀剂的第二白色抗蚀剂层。 每个连接导体包括铜箔和部分地形成在铜箔上的镀层。 镀层由具有比铜高的抗氧化性和耐腐蚀性的金属形成。 第一白色抗蚀剂层形成有分别暴露连接导体的镀层的第一开口。 第二白色抗蚀剂层在平面图中覆盖连接导体的每个镀层的周边。
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公开(公告)号：US20170263835A1
公开(公告)日：2017-09-14
申请号：US15454256
申请日：2017-03-09
Inventor： Masumi ABE , Naoki TAGAMI , Toshiaki KURACHI
CPC classification number: H01L33/62 , H01L25/0753 , H01L33/32 , H01L33/502 , H01L33/56 , H01L33/60 , H01L33/647 , H01L2224/48095 , H01L2224/48465 , H01L2224/73265 , H01L2924/181 , H01L2924/00012
Abstract: An LED module includes a resin substrate, a metal layer formed above the resin substrate, a resist layer formed above the metal layer and including a plurality of layers, and an LED chip mounted above the resist layer via an adhesive. The resist layer comprises an epoxy acrylic-based or a silicon-based resin material, and the adhesive is white.
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公开(公告)号：US20170040506A1
公开(公告)日：2017-02-09
申请号：US15223833
申请日：2016-07-29
Inventor： Masumi ABE , Naoki TAGAMI , Yasuharu UENO , Ryoji YOKOTANI , Toshiaki KURACHI
CPC classification number: H01L33/507 , H01L33/501 , H01L33/56 , H01L2224/48091 , H01L2224/48137 , H01L2224/48227 , H01L2924/181 , H01L2924/00014 , H01L2924/00012
Abstract: A light-emitting apparatus includes: a substrate; an LED chip disposed on the substrate; and a sealing member that contains a yellow phosphor and a cerium oxide, and seals the LED chip. An amount of the cerium oxide contained in the sealing member depends on a peak wavelength of a light emission spectrum of the LED chip, and when the peak wavelength of the light emission, spectrum of the LED chip is 470 nm or less, the amount of the cerium oxide contained in the sealing member is 0.100 wt % or less.
Abstract translation: 发光装置包括：基板; 设置在所述基板上的LED芯片; 以及包含黄色荧光体和氧化铈的密封构件，并且密封LED芯片。 包含在密封构件中的氧化铈的量取决于LED芯片的发光光谱的峰值波长，并且当发光的峰值波长，LED芯片的光谱为470nm以下时， 包含在密封构件中的氧化铈为0.100重量％以下。
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公开(公告)号：US20180082986A1
公开(公告)日：2018-03-22
申请号：US15819069
申请日：2017-11-21
Inventor： Masumi ABE , Naoki TAGAMI , Toshiaki KURACHI
CPC classification number: H01L25/0753 , H01L25/50 , H01L27/156 , H01L33/44 , H01L33/504 , H01L33/60 , H01L33/62 , H01L2224/48091 , H01L2224/48137 , H01L2924/181 , H01L2933/0033 , H01L2933/0041 , H01L2933/005 , H01L2933/0091 , H01L2924/00014 , H01L2924/00012
Abstract: A method of manufacturing a light-emitting apparatus includes mounting a first light-emitting element and a second light-emitting element on a substrate. A sealing layer is formed above the first light-emitting element and the second light-emitting element for sealing the first light-emitting element and the second light-emitting element. A first phosphor layer is applied above a first portion of the sealing layer, in which the first phosphor layer includes at least one first phosphor. A second phosphor layer is applied above a second portion of the sealing layer, in which the second phosphor layer includes at least one second phosphor.
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Patent Agency Ranking
公开(公告)号：US20180062110A1
公开(公告)日：2018-03-01
申请号：US15671270
申请日：2017-08-08
Inventor： Masumi ABE , Toshifumi OGATA , Naoki TAGAMI , Toshiaki KURACHI
CPC classification number: H01L51/5246 , F21V13/02 , H01L27/153 , H01L33/0095 , H01L33/20 , H01L33/62 , H01L51/5212 , H01L51/5228 , H01L51/5253 , H01L51/5268 , H01L2224/48091 , H01L2251/5361 , H05B33/04
Abstract: A light-emitting apparatus is provided. The light-emitting apparatus includes a substrate, a light-emitting element on the substrate, a first sealing layer which seals the light-emitting element, and a second b sealing layer. The substrate includes a base, an interconnect layer disposed on the base and electrically connected to the light-emitting element, a metal layer which covers a portion of the interconnect layer, and an electrically insulating layer which covers another portion of the interconnect layer. The second sealing layer seals a boundary between the metal layer and the electrically insulating layer.
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公开(公告)号：US20170040510A1
公开(公告)日：2017-02-09
申请号：US15223043
申请日：2016-07-29
Inventor： Naoki TAGAMI , Masumi ABE , Hisaki FUJITANI , Kosuke TAKEHARA , Toshiaki KURACHI
CPC classification number: H01L33/56 , H01L33/44 , H01L33/486 , H01L33/501 , H01L33/62 , H01L33/642 , H01L2224/48091 , H01L2224/48228 , H01L2224/73265 , H01L2924/181 , H01L2924/00014 , H01L2924/00012
Abstract: A light emitting diode (LED) module which includes: a substrate; a resist including a plurality of layers above the substrate; and an LED element mounted above the substrate. The plurality of layers includes a second layer that is an uppermost layer and a first layer that is an underlying layer. The second layer that is the uppermost layer includes fluorine as a component.
Abstract translation: 一种发光二极管（LED）模块，包括：基板; 抗蚀剂，其包括在所述基板上方的多个层; 以及安装在基板上方的LED元件。 多个层包括作为最上层的第二层和作为下层的第一层。 作为最上层的第二层包括氟作为组分。
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公开(公告)号：US20150137165A1
公开(公告)日：2015-05-21
申请号：US14546326
申请日：2014-11-18
Inventor： Naoki TAGAMI , Toshiaki KURACHI
CPC classification number: H01L33/507 , H01L25/0753 , H01L2224/45124 , H01L2224/45139 , H01L2224/45144 , H01L2224/45147 , H01L2224/48091 , H01L2224/48137 , H01L2224/73265 , H01L2224/8592 , H01L2924/181 , H01L2933/0091 , H01L2924/00012 , H01L2924/00014
Abstract: A light-emitting device includes a mounting board, a light-emitting element mounted on a main face of the mounting board, and a sealing member covering the light-emitting element. The sealing member includes a first sealing layer covering a part of the main face of the mounting board and the light-emitting element, and a second sealing layer covering the first sealing layer. The first sealing layer includes particles containing at least one material selected from a group consisting of cerium oxide, titanium oxide, iron oxide, and carbon, and silicone resin. The second sealing layer includes phosphor particles for converting a part of light emitted from light-emitting element into a long wavelength light and radiating it, and silicone resin.
Abstract translation: 发光装置包括安装板，安装在安装板的主面上的发光元件和覆盖发光元件的密封构件。 密封构件包括覆盖安装板的主面的一部分和发光元件的第一密封层和覆盖第一密封层的第二密封层。 第一密封层包括含有选自由氧化铈，氧化钛，氧化铁和碳组成的组中的至少一种材料的颗粒和有机硅树脂。 第二密封层包括用于将从发光元件发射的光的一部分转换成长波长光并将其放射的荧光体颗粒，以及硅树脂。
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公开(公告)号：US20180062058A1
公开(公告)日：2018-03-01
申请号：US15666935
申请日：2017-08-02
Inventor： Masumi ABE , Naoki TAGAMI , Toshiaki KURACHI
IPC: H01L33/64 , C09K11/02 , C09K11/62 , C09K11/77 , H01L33/56 , H01L33/50 , H01L33/60 , H01L33/32 , H01L33/62 , H01L25/075 , F21V29/75 , F21V3/02 , F21V7/22 , F21V29/89 , F21V23/02
CPC classification number: H01L33/644 , C09K11/025 , C09K11/0883 , C09K11/62 , C09K11/7706 , F21S8/026 , F21V3/02 , F21V7/22 , F21V23/023 , F21V29/75 , F21V29/89 , F21Y2115/10 , H01L25/0753 , H01L33/32 , H01L33/502 , H01L33/56 , H01L33/60 , H01L33/62 , H01L33/641 , H01L2224/48091 , H01L2224/48137 , H01L2924/00014
Abstract: A light-emitting apparatus is provided. The light-emitting apparatus includes: a substrate; an LED chip on the substrate; and a sealant which seals the LED chip. The sealant includes at least 0.05 wt % oxide of a transition metal as an additive for inhibiting deterioration of a base material of the sealant. Additionally or alternatively, the sealant includes at least one of a metal salt of a transition metal and an organic complex of a transition metal, as the additive.
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公开(公告)号：US20170077368A1
公开(公告)日：2017-03-16
申请号：US15258548
申请日：2016-09-07
Inventor： Hisaki FUJITANI , Kenji SUGIURA , Naoki TAGAMI , Kosuke TAKEHARA
Abstract: A light-emitting device includes: a board which is a resin board having an elongated shape; a conductive film formed on the board; and a plurality of LED elements disposed over the board. The plurality of LED elements include two adjacent LED elements arranged along a first direction. The conductive film includes (i) a first conductive part which electrically connects the two adjacent LED elements and at least a portion of which is located between the two adjacent LED elements and (ii) a second conductive part located on two outer sides of the first conductive part in a second direction intersecting the first direction. The second conductive part has a slit on each of the two outer sides of the first conductive part, and the slit extends in the second direction intersecting the longitudinal direction of the board.
Abstract translation: 发光装置包括：作为具有细长形状的树脂板的板; 形成在板上的导电膜; 以及设置在所述板上的多个LED元件。 多个LED元件包括沿着第一方向布置的两个相邻的LED元件。 导电膜包括：（i）第一导电部分，其电连接两个相邻的LED元件，并且其至少一部分位于两个相邻的LED元件之间;以及（ii）第二导电部件，位于第一 导电部分在与第一方向相交的第二方向上。 第二导电部分在第一导电部分的两个外侧的每一个上具有狭缝，并且狭缝在与板的纵向相交的第二方向上延伸。
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