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    THROUGH SILICON OPTICAL INTERCONNECTS
    13.
    发明申请
    THROUGH SILICON OPTICAL INTERCONNECTS 有权
    通过硅光学互连

    公开(公告)号：US20140131549A1

    公开(公告)日：2014-05-15

    申请号：US13771638

    申请日：2013-02-20

    Applicant: QUALCOMM INCORPORATED

    Inventor： Kenneth Kaskoun ,  Shiqun Gu ,  Matthew M. Nowak

    IPC: H01L25/16 ,  H01L25/00

    CPC classification number: H01L25/167 ,  H01L24/73 ,  H01L25/50 ,  H01L2224/0401 ,  H01L2224/06181 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/32145 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73253 ,  H01L2224/73257 ,  H01L2224/73265 ,  H04B10/803 ,  H01L2924/00012

    Abstract: Some implementations provide a semiconductor device that includes a first die and an optical receiver. The first die includes a back side layer having a thickness that is sufficiently thin to allow an optical signal to traverse through the back side layer. The optical receiver is configured to receive several optical signals through the back side layer of the first die. In some implementations, each optical signal originates from a corresponding optical emitter coupled to a second die. In some implementations, the back side layer is a die substrate. In some implementations, the optical signal traverses a substrate portion of the back side layer. The first die further includes an active layer. The optical receiver is part of the active layer. In some implementations, the semiconductor device includes a second die that includes an optical emitter. The second die coupled to the back side of the first die.

    Abstract translation: 一些实施方案提供包括第一管芯和光学接收器的半导体器件。 第一模具包括具有足够薄的厚度以允许光信号穿过背侧层的背面层。 光接收器被配置为通过第一管芯的背侧层接收多个光信号。 在一些实现中，每个光信号源自耦合到第二管芯的对应的光发射器。 在一些实施方式中，背面层是模具基板。 在一些实现中，光信号穿过背侧层的衬底部分。 第一裸片还包括有源层。 光接收器是有源层的一部分。 在一些实施方案中，半导体器件包括包括光发射器的第二裸片。 第二模具耦合到第一模具的背面。

    Methods, Devices and Systems for Sensor with Removable Nodes
    15.
    发明申请
    Methods, Devices and Systems for Sensor with Removable Nodes 有权
    传感器与可移动节点的方法，设备和系统

    公开(公告)号：US20160324472A1

    公开(公告)日：2016-11-10

    申请号：US15212428

    申请日：2016-07-18

    Applicant: QUALCOMM Incorporated

    Inventor： Kenneth Kaskoun ,  Brian David Niznik ,  Michael David Atella

    IPC: A61B5/00 ,  A61B5/11

    CPC classification number: A61B5/6833 ,  A61B5/0002 ,  A61B5/11 ,  A61B5/1112 ,  A61B5/684 ,  A61B5/7405 ,  A61B5/742 ,  A61B2560/0443

    Abstract: An integrated adhesive sensor array includes an adhesive a patch, a sensor hub, and a detachable sensor pod packaged as a unit. The patch may include a docking area for the detachable sensor pod. The detachable sensor pod may include at least one sensor and may be configured to be detached from the patch and applied to various locations on a body. The detachable sensor pod may send sensor data to the sensor hub via a wired link when on the patch and via a wireless link when detached from the patch. The sensor hub receives sensor data from the various sensors, and relays the data to a receiver. The sensor hub and detachable sensor pod may include indicators for communicating information. The sensor hub may include a power source for powering the sensor hub and a detachable sensor pod attached to the main sensor unit or patch.

    Abstract translation: 集成的粘合剂传感器阵列包括粘合剂贴剂，传感器毂和作为一个单元包装的可拆卸的传感器盒。 补片可以包括用于可拆卸传感器盒的对接区域。 可拆卸的传感器盒可以包括至少一个传感器，并且可以被配置为从贴片上分离并施加到身体上的各个位置。 可拆卸的传感器盒可以在贴片上时通过有线链路将传感器数据发送到传感器集线器，并且当从贴片分离时通过无线链路发送传感器数据。 传感器集线器从各种传感器接收传感器数据，并将数据中继到接收器。 传感器集线器和可拆卸传感器盒可以包括用于传达信息的指示器。 传感器集线器可以包括用于为传感器集线器供电的电源和附接到主传感器单元或贴片的可拆卸传感器盒。

    Integrated circuit module with lead frame micro-needles
    16.
    发明授权
    Integrated circuit module with lead frame micro-needles 有权
    集成电路模块，带引线框微针

    公开(公告)号：US09202705B1

    公开(公告)日：2015-12-01

    申请号：US14824345

    申请日：2015-08-12

    Applicant: QUALCOMM Incorporated

    Inventor： Kenneth Kaskoun ,  Rongtian Zhang ,  Matthew Michael Nowak ,  Shiqun Gu

    IPC: H01L21/44 ,  H01L21/48 ,  H01L21/306 ,  H01L23/495

    CPC classification number: H01L21/306 ,  A61B5/04 ,  A61B5/685 ,  A61B2562/12 ,  A61M37/0015 ,  A61M2037/0023 ,  A61M2037/0053 ,  H01L21/4842 ,  H01L21/565 ,  H01L23/49541 ,  H01L23/49548 ,  H01L2224/16225

    Abstract: An integrated circuit (IC) module with a lead frame micro-needle for a medical device, and methods of forming the IC module are described. The methods include forming a lead frame blank including a micro-needle integrally formed therein. The micro-needle may be bent beyond an initial lower side of the lead frame blank. The initial lower side may be joined with a protection layer such that the bent micro-needle is embedded in the protection layer, which may be removably attached to the initial lower side and the bent micro-needle. An IC component may be affixed to an upper side of the lead frame blank. The IC component and an upper surface of a core of the lead frame blank may be encapsulated with a molding compound forming a packaging of the IC module. Removal of the protection layer may expose the bent micro-needle projecting away from the packaging.

    Abstract translation: 描述了具有用于医疗装置的引线框微针的集成电路（IC）模块以及形成IC模块的方法。 所述方法包括形成包括一体地形成在其中的微针的引线框架坯料。 微针可以弯曲超过引线框架坯件的初始下侧。 初始下侧可以与保护层接合，使得弯曲的微针嵌入保护层中，保护层可以可拆卸地附接到初始下侧和弯曲的微针。 IC部件可以固定在引线框架坯料的上侧。 引线框架坯料的IC部件和芯的上表面可以用形成IC模块封装的模塑料封装。 去除保护层可能使弯曲的微针暴露在远离包装的位置。

    METHODS, DEVICES AND SYSTEMS FOR SELF CHARGING SENSORS
    18.
    发明申请
    METHODS, DEVICES AND SYSTEMS FOR SELF CHARGING SENSORS 有权
    自动充电传感器的方法，装置和系统

    公开(公告)号：US20150128733A1

    公开(公告)日：2015-05-14

    申请号：US14077665

    申请日：2013-11-12

    Applicant: QUALCOMM Incorporated

    Inventor： Kirk Steven Taylor ,  Kenneth Kaskoun

    IPC: H02J7/02 ,  G01D11/00 ,  H02J17/00

    CPC classification number: H02J50/00 ,  G01D11/00 ,  H02J17/00 ,  H02J50/80

    Abstract: Methods, systems and devices for an energy harvesting sensor are disclosed. A sensor device may include an energy harvesting element configured to harvest energy from a source of energy that is to be measured by the sensor device, and an energy storage element configured to store energy generated by the energy harvesting element. The sensor device may further include a transmitter circuit coupled to the energy storage element and configured to transmit a wireless signal when the energy stored in the energy storage element is sufficient to power a transmission of the wireless signal. The time between transmissions by the transmitter may be used by a receiver of those transmissions to calculate a measure of the quantity being used for energy harvesting.

    Abstract translation: 公开了用于能量收集传感器的方法，系统和装置。 传感器装置可以包括能量收集元件，其被配置为从要由传感器装置测量的能量源收集能量，以及能量存储元件，其被配置为存储由能量收集元件产生的能量。 传感器设备还可以包括耦合到能量存储元件并被配置为当存储在能量存储元件中的能量足以为无线信号的传输供电时发送无线信号的发射机电路。 发射机的传输之间的时间可以由这些传输的接收机使用以计算用于能量采集的量的量度。

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