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公开(公告)号：US20200006846A1
公开(公告)日：2020-01-02
申请号：US16022851
申请日：2018-06-29
Applicant: QUALCOMM Incorporated
Inventor： Jon LASITER , Seong Heon JEONG , Ravindra Vaman SHENOY , Jeremy Darren DUNWORTH , Mohammad Ali TASSOUDJI
Abstract: Certain aspects of the present disclosure provide a glass ceramic antenna package having a large bandwidth (e.g., 19 GHz) for millimeter wave (mmWave) applications, for example. The antenna package generally includes an antenna element comprising a first substrate layer and a second substrate layer, wherein the first substrate layer comprises an antenna, wherein the second substrate layer comprises shielding elements and feed lines, and wherein the feed lines are electrically coupled to the antenna. The antenna package also includes a lead frame adjacent to one or more lateral surfaces of the antenna element.
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公开(公告)号：US20190259677A1
公开(公告)日：2019-08-22
申请号：US16135906
申请日：2018-09-19
Applicant: QUALCOMM Incorporated
Inventor： Jon LASITER , Ravindra Vaman SHENOY , Kambiz SAMADI , Jing XIE
IPC: H01L23/29 , H01L21/768 , H01L23/48 , H01L23/538 , H01L21/56 , H01L21/02
Abstract: A device comprising a first die, a second die coupled to a first die, and a polymer planarization layer. The second die includes a side portion and a backside portion. The polymer planarization layer is coupled to the first die and the second die such that the polymer planarization layer is coupled to the side portion and the backside portion of the second die. The polymer planarization layer includes an organic polymer. The polymer planarization layer may include a self planarizing material.
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公开(公告)号：US20190067221A1
公开(公告)日：2019-02-28
申请号：US15839831
申请日：2017-12-12
Applicant: QUALCOMM Incorporated
Inventor： Jon Bradley LASITER , Ravindra Vaman SHENOY , Donald William KIDWELL, JR. , Mohammad Ali TASSOUDJI , Vladimir APARIN , Seong Heon JEONG , Jeremy DUNWORTH , Alireza MOHAMMADIAN , Mario Francisco VELEZ , Chin-Kwan KIM
IPC: H01L23/66 , H01L23/00 , H01L23/498 , H01L23/552 , H01L23/31 , H01L21/50 , H01Q1/22 , H01Q1/24
Abstract: In conventional packaging strategies for mm wave applications, the size of the package is dictated by the antenna size, which is often much larger than the RFIC (radio frequency integrated circuit). Also, the operations are often limited to a single frequency which limits their utility. In addition, multiple addition build-up layers are required to provide the necessary separation between the antennas and ground layers. To address these issues, it is proposed to provide a device that includes an antenna package, an RFIC package, and an interconnect assembly between the antenna and the RFIC packages. The interconnect assembly may comprise a plurality of interconnects with high aspect ratios and configured to connect one or more antennas of the antenna package with an RFIC of the RFIC package. An air gap may be formed in between the antenna package and the RFIC package for performance improvement.
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公开(公告)号：US20190067219A1
公开(公告)日：2019-02-28
申请号：US15686131
申请日：2017-08-24
Applicant: QUALCOMM Incorporated
Inventor： Jon Bradley LASITER , Ravindra Vaman SHENOY , Donald William KIDWELL, JR. , Mohammad TASSOUDJI , Mario Francisco VELEZ
IPC: H01L23/66 , H01L23/31 , H01L23/538 , H01L23/00 , H01L25/10 , H01L21/48 , H01L21/56 , H01L25/00 , H01Q1/22
Abstract: An package and related methods are disclosed. The package may include an antenna, an insert made of low-loss material, and a mold, wherein the mold directly contacts and surrounds at least a portion of the insert, wherein the antenna is formed of conductive material disposed at least in part on a surface of the insert.
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公开(公告)号：US20170086295A1
公开(公告)日：2017-03-23
申请号：US14859320
申请日：2015-09-20
Applicant: QUALCOMM Incorporated
Inventor： Mete ERTURK , Farsheed MAHMOUDI , James Thomas DOYLE , Ravindra Vaman SHENOY , Jitae KIM
Abstract: An integrated circuit device, such as a system-on-a-chip (SOC) device that includes an integrated or embedded voltage regulator, comprises an integrated capacitor and an integrated inductor having a magnetic core that can be fabricated in the same process as the capacitive structure of the integrated capacitor.
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Patent Agency Ranking
16.发明申请公开(公告)号：US20160163443A1
公开(公告)日：2016-06-09
申请号：US14743623
申请日：2015-06-18
Applicant: QUALCOMM Incorporated
Inventor： Mete ERTURK , Ravindra Vaman SHENOY , Kwan-yu LAI , Jitae KIM , Donald William KIDWELL JR. , Jon Bradley LASITER , James Thomas DOYLE , Omar James BCHIR
CPC classification number: H01F27/2804 , H01F1/14708 , H01F5/00 , H01F17/0033 , H01F27/24 , H01F41/02 , H01F41/046 , H01F41/14 , H01F2017/002 , H01F2017/0066 , H01F2027/2809 , H01L23/49822 , H01L23/642 , H01L23/645 , H01L24/16 , H01L2224/16227 , H01L2924/14 , H01L2924/15192 , H01L2924/15311 , H01L2924/19041 , H05K1/111 , H05K1/165 , H05K1/182 , H05K2201/10166 , H01L2924/0002 , H01L2924/00
Abstract: An inductor can include a first substrate, a magnetic piece, and a conductor. The first substrate can be formed within a second substrate. The magnetic piece can be connected to a first side of the first substrate. The conductor can be formed within the second substrate, on the second substrate, or both. The conductor can have an input and an output. The conductor can be configured to surround the first substrate without being in contact with the first substrate and without being in contact with the magnetic piece.
Abstract translation: 电感器可以包括第一衬底，磁片和导体。 第一基板可以形成在第二基板内。 磁片可以连接到第一衬底的第一侧。 导体可以形成在第二基板内，第二基板上，或两者上。 导体可以具有输入和输出。 导体可以被配置为围绕第一基板而不与第一基板接触并且不与磁片接触。
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公开(公告)号：US20220279137A1
公开(公告)日：2022-09-01
申请号：US17188360
申请日：2021-03-01
Applicant: QUALCOMM Incorporated
Inventor： Jon LASITER , Ravindra Vaman SHENOY , Ravishankar SIVALINGAM , Russell GRUHLKE , Donald William KIDWELL , Khurshid Syed ALAM , Kebin LI
IPC: H04N5/33 , H01L27/146
Abstract: An image sensor device includes two or more image sensor arrays (or two or more regions of an image sensor array) and a low-power processor in a same package for capturing two or more images of an object, such as an eye of a user, using light in two or more wavelength bands, such as visible band, near-infrared band, and short-wave infrared band. The image sensor device includes one or more lens assemblies and/or a beam splitter for forming an image of the object on each of the two or more image sensor arrays. The image sensor device also includes one or more filters configured to select light from multiple wavelength bands for imaging by the respective image sensor arrays.
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公开(公告)号：US20220030148A1
公开(公告)日：2022-01-27
申请号：US16937397
申请日：2020-07-23
Applicant: QUALCOMM Incorporated
Inventor： Russell GRUHLKE , Ravindra Vaman SHENOY , Jon LASITER , Donald William KIDWELL , Khurshid Syed ALAM , Kebin LI
Abstract: An image sensor including a planar sensor array, a lens configured to form an optical image on the planar sensor array and characterized by a locus of focal points on a curved surface, and a cover glass with multiple thickness levels or multiple cover glasses of different sizes. The one or more cover glasses are configured to shift the locus of focal points for large field angles, such that there are multiple intersections between the planar sensor array and the locus of focal points for a large FOV, and thus multiple zones with best focus on the planar sensor array.
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公开(公告)号：US20210384292A1
公开(公告)日：2021-12-09
申请号：US17408273
申请日：2021-08-20
Applicant: QUALCOMM Incorporated
Inventor： Karim ARABI , Ravindra Vaman SHENOY , Evgeni Petrovich GOUSEV , Mete ERTURK
IPC: H01L49/02 , H01L23/64 , H01L23/498
Abstract: A voltage regulator having a coil inductor is integrated or embedded in a system-on-chip (SOC) device. The coil inductor is fabricated on an inductor wafer with through vias, and the inductor wafer is joined with an SOC wafer for integration with the SOC device.
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公开(公告)号：US20210175636A1
公开(公告)日：2021-06-10
申请号：US16704405
申请日：2019-12-05
Applicant: QUALCOMM Incorporated
Inventor： Jon LASITER , Donald William KIDWELL, JR. , Ravindra Vaman SHENOY , Mohammad Ali TASSOUDJI , Jeremy Darren DUNWORTH , Vladimir Aparin , Yu-Chin OU , Seong Heon JEONG
Abstract: An antenna system includes: a ground conductor; a substrate; a pair of planar dipole conductors disposed such that at least a portion of the substrate is disposed between the ground conductor and the pair of dipole conductors; a pair of energy couplers each electrically connected to a respective one of the pair of dipole conductors; and a pair of isolated lobes including electrically-conductive material. The pair of isolated lobes are electrically separate from the pair of dipole conductors and the pair of energy couplers, and disposed between the pair of dipole conductors and the ground conductor.
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