公开(公告)号：US20090100468A1

公开(公告)日：2009-04-16

申请号：US11870406

申请日：2007-10-10

Applicant: Shmuel Shaffer ,  Mukul Jain ,  Labhesh Patel ,  Sanjeev Kumar ,  Sravan Vadlakonda ,  Arthur Gerald Howarth ,  Ashish P. Chotai ,  Aseem Asthana ,  Rajneesh Kumar ,  Shantanu Sarkar

Inventor： Shmuel Shaffer ,  Mukul Jain ,  Labhesh Patel ,  Sanjeev Kumar ,  Sravan Vadlakonda ,  Arthur Gerald Howarth ,  Ashish P. Chotai ,  Aseem Asthana ,  Rajneesh Kumar ,  Shantanu Sarkar

IPC: H04N5/445 ,  G08B21/00

CPC classification number: H04N7/163 ,  H04N21/4147 ,  H04N21/4333 ,  H04N21/4334 ,  H04N21/44004 ,  H04N21/44008 ,  H04N21/458 ,  H04N21/8456

Abstract: In one embodiment, a Media Analysis and Delivery System obtains a set of media delivery rules, wherein the set of media delivery rules includes one or more triggers, each of the triggers identifying a topic of interest. The Media Analysis and Delivery System examines a media stream for at least one of the one or more triggers in accordance with the set of media delivery rules. The Media Analysis and Delivery System provides at least a portion of the media stream in response to at least one of the triggers in accordance with at least one of the set of media delivery rules.

Abstract translation: 在一个实施例中，媒体分析和传送系统获得一组媒体递送规则，其中该组媒体递送规则包括一个或多个触发，每个触发器识别感兴趣的主题。 媒体分析和传送系统根据媒体传送规则集来检查一个或多个触发器中的至少一个的媒体流。 媒体分析和传送系统根据所述一组媒体传送规则中的至少一个响应于至少一个触发器提供媒体流的至少一部分。

公开(公告)号：US07468951B2

公开(公告)日：2008-12-23

申请号：US11049793

申请日：2005-02-02

Applicant: Lu Qian ,  Bretton Douglas ,  David Sheldon Stephenson ,  Sandeep Jay Shetty ,  Rajneesh Kumar ,  Wenfeng Huang

Inventor： Lu Qian ,  Bretton Douglas ,  David Sheldon Stephenson ,  Sandeep Jay Shetty ,  Rajneesh Kumar ,  Wenfeng Huang

IPC: H04L12/26 ,  H04L12/28 ,  H04L12/50 ,  H04Q7/00 ,  H04J3/16

CPC classification number: H04L47/283 ,  H04L47/14 ,  H04L47/15 ,  H04L47/70 ,  H04L47/801 ,  H04L47/822 ,  H04L47/824 ,  H04W24/00 ,  H04W28/10 ,  H04W48/06 ,  H04W74/004 ,  H04W76/10

Abstract: A method for evaluating number of additional admissible calls for use in call admission control includes tracking a percentage of channel busy time and transmission time of downlink and uplink voice packets, receiving a call admission request, and calculating the number of admissible calls. The number of admissible calls is calculated based on a channel bandwidth requirement determined from the percentage of channel busy time and a voice packet queuing requirement determined from the transmission time of downlink and uplink voice packets. The call admission request is approved if the number of admissible calls is greater than one and rejected if the number of admissible calls is less than one.

Abstract translation: 一种用于评估在呼叫接纳控制中使用的附加允许呼叫的数量的方法包括：跟踪下行链路和上行语音分组的频道繁忙时间和传输时间的百分比，接收呼叫许可请求，以及计算可接受呼叫的数量。 根据从通道占线时间的百分比确定的信道带宽要求和根据下行链路和上行语音数据包的发送时间确定的语音数据包排队要求，计算允许呼叫的数量。 如果可接受电话的数量大于1，通话准入请求将被批准，如果允许的呼叫数少于1，则拒绝通话。

公开(公告)号：US20080226049A1

公开(公告)日：2008-09-18

申请号：US11685771

申请日：2007-03-14

Applicant: Rajneesh Kumar ,  Sravan Vadlakonda ,  Ashish Chotai ,  Aseem Asthana ,  Shmuel Shaffer

Inventor： Rajneesh Kumar ,  Sravan Vadlakonda ,  Ashish Chotai ,  Aseem Asthana ,  Shmuel Shaffer

IPC: H04M3/56

CPC classification number: H04M3/42187 ,  H04M3/42374 ,  H04M3/568 ,  H04M2242/30

Abstract: In one embodiment, a method includes identifying a plurality of locations associated with a conference system that has a conference server and a mixer, and prioritizing the locations by assigning a first priority to at least a first location and assigning a second priority to a second location. The second priority is lower than the first priority. The method also includes processing received media streams such that media streams received from endpoints associated with the first location are processed as having a higher priority than media streams received from endpoints associated with the second location.

Abstract translation: 在一个实施例中，一种方法包括识别与具有会议服务器和混合器的会议系统相关联的多个位置，以及通过将至少第一位置分配第一优先级并将第二优先级分配给第二位置来对所述位置进行优先级排序 。 第二优先级低于第一优先级。 该方法还包括处理接收到的媒体流，使得从与第一位置相关联的端点接收的媒体流被处理为具有比从与第二位置相关联的端点接收的媒体流更高的优先级。

公开(公告)号：US20070258393A1

公开(公告)日：2007-11-08

申请号：US11429751

申请日：2006-05-08

Applicant: Nancy Cam-Winget ,  Rajneesh Kumar ,  Prasad Jogalekar

Inventor： Nancy Cam-Winget ,  Rajneesh Kumar ,  Prasad Jogalekar

IPC: H04B7/00

CPC classification number: H04W8/005 ,  G01S5/02 ,  H04B17/318 ,  H04B17/382

Abstract: In one embodiment, a system and method for optimizing a neighbor AP list for a wireless station. The list is optimized based on the current location of the wireless station and the direction of motion. Neighbor APs that are not near the wireless station and/or not in the direction of motion are pruned for the neighbor AP list.

Abstract translation: 在一个实施例中，一种用于优化无线站的相邻AP列表的系统和方法。 该列表是基于无线站的当前位置和运动方向进行优化的。 不邻近无线站和/或不在运动方向的邻居AP被修剪用于邻居AP列表。

公开(公告)号：US20070076671A1

公开(公告)日：2007-04-05

申请号：US11240002

申请日：2005-09-30

Applicant: Nancy Winget ,  Rajneesh Kumar

Inventor： Nancy Winget ,  Rajneesh Kumar

IPC: H04Q7/24

CPC classification number: H04W28/26 ,  H04L63/08 ,  H04L63/0892 ,  H04L63/10 ,  H04L67/1002 ,  H04L67/1008 ,  H04W12/0602 ,  H04W12/08 ,  H04W36/0016

Abstract: A method and system for network infrastructure driven context setup to facilitate roaming for a client coupled to the network. The method includes generating an optimized list of the client's neighbors. The list is suitably generated either statically or dynamically based on any number of parameters managed by the network element to ensure an optimal set of AP candidates are provided. At least one access point is selected from the optimized list. A pre-allocation of resources is initiated with the at least one access point prior to the client roaming

Abstract translation: 一种用于网络基础设施驱动的上下文设置的方法和系统，以便于耦合到网络的客户端的漫游。 该方法包括生成客户端邻居的优化列表。 基于由网络元件管理的任何数量的参数来静态地或动态地适当地生成列表，以确保提供AP候选的最佳集合。 从优化列表中选择至少一个接入点。 在客户端漫游之前，利用至少一个接入点发起资源的预先分配

公开(公告)号：US09763140B2

公开(公告)日：2017-09-12

申请号：US12917846

申请日：2010-11-02

Applicant: Michael McBride ,  Subhasri Dhesikan ,  Neil Diener ,  David Stephenson ,  Rajneesh Kumar

Inventor： Michael McBride ,  Subhasri Dhesikan ,  Neil Diener ,  David Stephenson ,  Rajneesh Kumar

IPC: H04W28/24 ,  H04W28/26

CPC classification number: H04W28/24 ,  H04W28/26

Abstract: Described in an example embodiment is an end-to-end admission control system that allows any rich media application to secure admission control in an environment where there are mixed wireless and wired segments in the network. In particular embodiments, the system includes the integration of Add Traffic Stream (ADDTS) and Resource Reservation Protocol (RSVP) admission control mechanisms, the mapping of parameters between these two mechanisms, the admission control policies, and failure handling for the end-to-end resource control.

公开(公告)号：US08444043B1

公开(公告)日：2013-05-21

申请号：US13362228

申请日：2012-01-31

Applicant: William E. Bernier ,  Marcus E. Interrante ,  Rajneesh Kumar ,  Chenzhou Lian ,  Janak G. Patel ,  Peter Slota, Jr.

Inventor： William E. Bernier ,  Marcus E. Interrante ,  Rajneesh Kumar ,  Chenzhou Lian ,  Janak G. Patel ,  Peter Slota, Jr.

IPC: B23K31/00 ,  B23K31/02

CPC classification number: H01L23/49816 ,  B23K1/0016 ,  B23K1/008 ,  B23K1/203 ,  B23K3/0623 ,  B23K2101/42 ,  H01L23/13 ,  H01L24/13 ,  H01L24/16 ,  H01L24/75 ,  H01L24/81 ,  H01L25/0652 ,  H01L25/0657 ,  H01L2224/13111 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/75101 ,  H01L2224/75252 ,  H01L2224/755 ,  H01L2224/75501 ,  H01L2224/81005 ,  H01L2224/81191 ,  H01L2224/81192 ,  H01L2224/81204 ,  H01L2224/81815 ,  H01L2225/06513 ,  H01L2924/10253 ,  H01L2924/1305 ,  H01L2924/15787 ,  H01L2924/351 ,  H01L2924/3511 ,  H01L2924/01047 ,  H01L2924/00012 ,  H01L2924/00014 ,  H01L2924/00

Abstract: An array of solder balls is attached to solder pads of one of a first substrate and a second substrate. After aligning the array of solder balls relative to solder pads of the other of the first substrate and the second substrate, a thermal-mass-increasing fixture is placed on a surface of the second substrate to form an assembly of the first substrate, the second substrate, and the array of the solder balls therebetween, and the thermal-mass-increasing fixture. The thermal-mass-increasing fixture is in physical contact with at least a surface of a periphery of the second substrate. The thermal-mass-increasing fixture reduces the cool-down rate of peripheral solder balls after a reflow step, thereby increasing time for deformation of peripheral solder balls during the cool-down and reducing the mechanical stress on the solder balls after the cool-down.

Abstract translation: 一组焊球附着到第一衬底和第二衬底之一的焊盘上。 在相对于第一基板和第二基板中的另一个的焊盘对准焊球的阵列之后，将热质量增加的夹具放置在第二基板的表面上以形成第一基板的组件，第二基板 基板以及它们之间的焊球的阵列，以及热质量增加夹具。 热质量增加夹具与第二基板的周边的至少一个表面物理接触。 热质量增加夹具降低了回流步骤后外围焊球的冷却速率，从而增加了冷却期间外围焊球变形的时间，并降低了冷却后焊锡球上的机械应力 。

公开(公告)号：US08381966B2

公开(公告)日：2013-02-26

申请号：US13036086

申请日：2011-02-28

Applicant: Rajneesh Kumar ,  Jae-Woong Nah ,  Eric D. Perfecto

Inventor： Rajneesh Kumar ,  Jae-Woong Nah ,  Eric D. Perfecto

IPC: B23K31/02 ,  H01L21/44

CPC classification number: B23K1/0016

Abstract: A first substrate mounted to a bonder head and a second substrate mounted to a base plate are held at different elevated temperatures at the time of bonding that provide a substantially matched thermal expansion between the second substrate and the first substrate relative to room temperature. Further, the temperature of the solder material portions and the second substrate is raised at least up to the melting temperature after contact. The distance between the first substrate and the second substrate can be modulated to enhance the integrity of solder joints. Once the distance is at an optimum, the bonder head is detached, and the bonded structure is allowed to cool to form a bonded flip chip structure. Alternately, the bonder head can control the cooling rate of solder joints by being attached to the chip during cooling step.

Abstract translation: 安装到接合头的第一衬底和安装到基板的第二衬底在接合时被保持在不同的升高的温度，从而相对于室温在第二衬底和第一衬底之间提供基本匹配的热膨胀。 此外，焊接材料部分和第二基板的温度至少升高到接触后的熔融温度。 第一基板和第二基板之间的距离可被调制以增强焊点的完整性。 一旦该距离处于最佳状态，就将分离头拆下，并使粘结结构冷却以形成结合的倒装芯片结构。 或者，焊接头可以在冷却步骤期间通过附接到芯片来控制焊点的冷却速度。

公开(公告)号：US08165021B2

公开(公告)日：2012-04-24

申请号：US11899935

申请日：2007-09-05

Applicant: Prasad Prabhakar Jogalekar ,  Arnold Mark Bilstad ,  Rajneesh Kumar

Inventor： Prasad Prabhakar Jogalekar ,  Arnold Mark Bilstad ,  Rajneesh Kumar

IPC: G01R31/08 ,  G06F11/00 ,  G08C15/00 ,  H04J1/16 ,  H04J3/14 ,  H04L1/00 ,  H04L12/26 ,  H04L12/28 ,  H04L12/56

CPC classification number: H04L47/824 ,  H04L47/10 ,  H04L47/70 ,  H04L47/805 ,  H04L47/822

Abstract: In one embodiment, a network device receives a request from a client in association with a connection, where the request indicates an amount of one or more resources that is requested to support the connection. The network device determines whether the amount of the resources is available. The network device may then allocate a level of the resources to the connection according to whether the amount of the resources is available.

Abstract translation: 在一个实施例中，网络设备从连接中接收来自客户端的请求，其中请求指示被请求支持连接的一个或多个资源的量。 网络设备确定资源的数量是否可用。 然后，网络设备可以根据资源的数量是否可用来向该连接分配一个资源级别。

公开(公告)号：US08129230B2

公开(公告)日：2012-03-06

申请号：US12538965

申请日：2009-08-11

Applicant: Michael A. Gaynes ,  Rajneesh Kumar ,  Thomas E. Lombardi ,  Steve Ostrander

Inventor： Michael A. Gaynes ,  Rajneesh Kumar ,  Thomas E. Lombardi ,  Steve Ostrander

IPC: H01L21/00

CPC classification number: H01L21/563 ,  H01L23/562 ,  H01L24/32 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2924/01019 ,  H01L2924/09701 ,  H01L2924/00 ,  H01L2924/3512

Abstract: A method of fabricating a chip package is provided. The chip package includes a laminate, a chip and conductive elements interposed between the chip and the laminate by which signals are transmitted among the chip and the laminate. The method includes dispensing a first underfill in a space defined between opposing faces of the chip and the laminate and dispensing a second underfill at least at a portion of an edge of the chip, the second underfill including a high aspect ratio material.

Abstract translation: 提供一种制造芯片封装的方法。 芯片封装包括层叠体，芯片和介于芯片和层压体之间的导电元件，信号在芯片和层压体之间传输。 该方法包括将第一底部填充物分配到在芯片的相对面和层压体之间限定的空间中，并且至少在芯片边缘的一部分处分配第二底部填充物，第二底部填充物包括高纵横比材料。