Abstract:
A dryer for drying various types of products such as food products and pet food. The dryer includes a frame structure, a conveyor disposed in the dryer, and a heating unit for supplying heat to the dryer. A plurality of relatively lightweight hygienic panels, including doors, is secured to the frame structure and form a part of the exterior of the dryer. The hygienic panels provide access to the interior of the dryer for cleaning and maintenance. Each hygienic panel is sealed so that moisture and air cannot enter the interior of the panel. Disposed inside each hygienic panel is a honeycomb panel and an insulating structure. The hygienic panel provides rigidity and strength to the hygienic panel and at the same time enables the panel to be of a relatively light weight construction.
Abstract:
An integrated circuit comprising (i) a plurality of portions, each portion including test control circuitry; and (ii) at least one test input arranged to receive test signals, the circuit having a test mode in which one or more of the plurality of portions are testable, wherein the circuit has a reset mode which has priority over the test mode.
Abstract:
An integrated circuit comprising (i) a plurality of portions, each portion including test control circuitry; and (ii) at least one test input arranged to receive test signals, the circuit having a test mode in which one or more of the plurality of portions are testable, wherein the circuit has a reset mode which has priority over the test mode.
Abstract:
An integrated circuit comprising: at least one test input for receiving test data; test control circuitry between the at least one test input and circuitry to be tested; wherein the test data is clocked in on a rising clock edge and a falling clock edge.
Abstract:
A micro electro-mechanical sensor is provided. The micro electro-mechanical sensor includes a substrate, and a conducting plane disposed on the substrate. A conducting via is disposed on the substrate, such as adjacent to the conducting plane. A plurality of ribbon conductors are disposed over the conducting plane and electrically connected to the conducting via, such that the plurality of ribbon conductors form a transducer array in combination with the conducting plane, such as through capacitive coupling that changes in response to changes in the physical shape of the plurality of ribbons.
Abstract:
A method for routing signals comprising: supplying to an input of a routing block having multiple outputs an information signal comprising a first edge and a second edge on a single line, the first and second edges being separated by a time period which represents information conveyed by the signal, and one of the first and second edges providing timing information; controlling the routing block to select one of said multiple outputs; and transferring the signal to said selected one of said multiple outputs.
Abstract:
Method and apparatus for transferring data. The apparatus preferably includes a first volatile memory block, a second volatile memory block coupled to a non-volatile circular buffer, and a controller configured to direct first data to the first volatile memory block for subsequent transfer to a downstream block, such as a data storage array. The controller is further configured to direct second data to the second volatile memory block for subsequent transfer to the non-volatile circular buffer. Preferably, the second volatile memory block forms a portion of a non-volatile random access memory (NVRAM) and the circular buffer is formed from a flash memory device. An intelligence block preferably controls said subsequent transfer of the second data from the second volatile memory block to the circular buffer. The second data are preferably transferred from the circular buffer to the downstream block in conjunction with the transfer of the first data.
Abstract:
According to an exemplary embodiment, a wafer level package includes a device wafer including at least one device wafer contact pad and a device, and where the at least one device wafer contact pad is electrically connected to the device. The wafer level package includes a first polymer layer situated over the device wafer. The wafer level package includes at least one passive component situated over the first polymer layer and having a first terminal and a second terminal. The first terminal of the at least one passive component is electrically connected to the at least one device wafer contact pad. The wafer level package includes a second polymer layer situated over the at least one passive component. The wafer level package includes at least one polymer layer contact pad situated over the second polymer layer and electrically connected to the second terminal of the at least one passive component.
Abstract:
An electronic device having first circuitry operating in a first clock environment and second circuitry operating in a second clock environment, the first circuitry being arranged to generate a soft reset signal for resetting the second circuitry, the integrated circuit further including: a soft reset hold circuit clocked in the first clock environment connected to receive the soft reset signal and to generate an output reset signal in an asserted state; and a synchronizer clocked in the second clock environment connected to receive the output reset signal and to generate a retimed reset signal in an asserted state after a predetermined period, wherein the retimed reset signal is fed back to the soft reset hold circuit to cause the output reset signal to adopt a deasserted state at the end of said predetermined period.
Abstract:
An integrated circuit including test circuitry, the test circuitry including a counter for counting clock signals and having an output for providing a control signal. The counter being arranged to have an internal state, and the counter being arranged to change the control signal on the internal state of counter reaching a predetermined value.