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    Electro-diffusion enhanced bio-molecule charge detection using electrostatic interaction
    11.
    发明授权
    Electro-diffusion enhanced bio-molecule charge detection using electrostatic interaction 有权
    电扩散增强生物分子电荷检测使用静电相互作用

    公开(公告)号：US08864969B2

    公开(公告)日：2014-10-21

    申请号：US12822971

    申请日：2010-06-24

    Applicant: Yang Liu ,  Robert W. Dutton ,  Roger T. Howe

    Inventor： Yang Liu ,  Robert W. Dutton ,  Roger T. Howe

    IPC: G01N33/487

    CPC classification number: G01N33/48721 ,  C12Q1/68 ,  G01N27/04 ,  G01N27/4145 ,  G01N27/44791 ,  G01N33/68

    Abstract: According to one aspect, the disclosure is directed to an example embodiment in which a circuit-based arrangement includes a circuit-based substrate securing a channel, with an effective width that is not limited by the Debye screening length, along a surface of the substrate. A pair of reservoirs are included in or on the substrate and configured for containing and presenting a sample having bio-molecules for delivery in the channel. A pair of electrodes electrically couple a charge in the sample to enhance ionic current flow therein (e.g., to overcome the electrolyte screening), and a sense electrode is located along the channel for sensing a characteristic of the biological sample by using the electrostatic interaction between the enhanced ionic current flow of the sample and the sense electrode. Actual detection occurs by using a charge-signal processing circuit to process the sensed charge signal and, therefrom, provide an output indicative of a signature for the bio-molecules delivered in the channel.

    Abstract translation: 根据一个方面，本发明涉及一个示例性实施例，其中基于电路的布置包括沿着基板的表面固定通道的电路基板，具有不受德拜屏蔽长度限制的有效宽度 。 一对储存器包含在基底中或基底上，并且被配置为容纳和呈现具有用于在通道中递送的生物分子的样品。 一对电极将样品中的电荷电耦合以增强其中的离子电流（例如，以克服电解质屏蔽），并且感测电极沿着通道定位，以通过使用 样品和感测电极的增强的离子电流流动。 通过使用电荷信号处理电路来处理所感测的电荷信号，从而提供指示在通道中递送的生物分子的签名的输出，发生实际检测。

    MEMS coupler and method to form the same
    12.
    发明授权
    MEMS coupler and method to form the same 有权
    MEMS耦合器和方法形成相同

    公开(公告)号：US08716815B2

    公开(公告)日：2014-05-06

    申请号：US12927312

    申请日：2010-11-10

    Applicant: Emmanuel P. Quevy ,  Roger T. Howe

    Inventor： Emmanuel P. Quevy ,  Roger T. Howe

    IPC: H01L27/14

    CPC classification number: B81C1/00039 ,  B81B2201/0271

    Abstract: A MEMS coupler and a method to form a MEMS structure having such a coupler are described. In an embodiment, a MEMS structure comprises a member and a substrate. A coupler extends through a portion of the member and connects the member with the substrate. The member is comprised of a first material and the coupler is comprised of a second material. In one embodiment, the first and second materials are substantially the same. In one embodiment, the second material is conductive and is different than the first material. In another embodiment, a method for fabricating a MEMS structure comprises first forming a member above a substrate. A coupler comprised of a conductive material is then formed to connect the member with the substrate.

    Abstract translation: 描述了MEMS耦合器和形成具有这种耦合器的MEMS结构的方法。 在一个实施例中，MEMS结构包括构件和衬底。 耦合器延伸穿过构件的一部分并将构件与衬底连接。 该构件由第一材料构成，并且该耦合器由第二材料构成。 在一个实施例中，第一和第二材料基本相同。 在一个实施例中，第二材料是导电的并且不同于第一材料。 在另一个实施例中，一种用于制造MEMS结构的方法包括首先在衬底上形成构件。 然后形成由导电材料构成的耦合器，以将该构件与衬底连接。

    Method of making a sub-ground plane for a micromachined device
    15.
    发明授权
    Method of making a sub-ground plane for a micromachined device 失效
    制造微加工装置的亚接地平面的方法

    公开(公告)号：US5879963A

    公开(公告)日：1999-03-09

    申请号：US820248

    申请日：1997-03-18

    Applicant: Roger T. Howe ,  Richard S. Payne ,  Stephen F. Bart

    Inventor： Roger T. Howe ,  Richard S. Payne ,  Stephen F. Bart

    IPC: B81B7/00 ,  G01P15/08 ,  H05K3/34

    CPC classification number: B81B7/0006 ,  G01P15/0802 ,  Y10S428/901 ,  Y10T428/24917 ,  Y10T428/24926

    Abstract: A method and apparatus for providing a sub-ground plane for a micromachined device. The sub-ground plane is formed in or on the substrate. Above the sub-ground plane is a dielectric and then a discontinuous conductive layer used for interconnects for parts of the micromachined device. A movable microstructure is suspended above the interconnect layer. A conductive layer can be suspended above the movable microstructure. In one embodiment, the sub-ground plane is diffused into the substrate or a well in the substrate, and is of an opposite type from the type of silicon into which it is diffused. Alternatively, the sub-ground plane is formed from a conductive layer, deposited over the substrate before the layer used for interconnects.

    Abstract translation: 一种用于提供微加工装置的子接地平面的方法和装置。 子接地平面形成在基底中或基底上。 在子接地平面之上是电介质，然后是用于微加工装置的部件的互连的不连续导电层。 可移动微结构悬浮在互连层上方。 导电层可以悬浮在可移动微结构的上方。 在一个实施例中，子接地平面扩散到衬底或衬底中的阱中，并且与其被扩散的硅的类型相反。 或者，子接地平面由导电层形成，在用于互连的层之前沉积在衬底上。

    Conductive plane beneath suspended microstructure
    16.
    发明授权
    Conductive plane beneath suspended microstructure 失效
    悬浮微结构下面的导电平面

    公开(公告)号：US5640039A

    公开(公告)日：1997-06-17

    申请号：US347702

    申请日：1994-12-01

    Applicant: Kevin Hin-Leung Chau ,  Roger T. Howe ,  Richard S. Payne ,  Yang Zhao ,  Theresa A. Core ,  Steven J. Sherman

    Inventor： Kevin Hin-Leung Chau ,  Roger T. Howe ,  Richard S. Payne ,  Yang Zhao ,  Theresa A. Core ,  Steven J. Sherman

    IPC: G01P15/08 ,  G01P15/125 ,  H01L29/82

    CPC classification number: G01P15/125 ,  G01P15/0802 ,  G01P2015/0814

    Abstract: A method and apparatus for providing a conductive plane beneath a suspended microstructure. A conductive region is diffused into a substrate. A dielectric layer is added, covering the substrate, and then removed from a portion of the conductive region. A spacer layer is deposited over the dielectric and exposed conductive region. A polysilicon layer is deposited over the spacer layer, and formed into the shape of the suspended microstructure. After removal of the spacer layer, the suspended microstructure is left free to move above an exposed conductive plane. The conductive plane is driven to the same potential as the microstructure.

    Abstract translation: 一种用于在悬浮微结构下方提供导电平面的方法和装置。 导电区域扩散到衬底中。 添加介电层，覆盖基板，然后从导电区域的一部分去除。 间隔层沉积在电介质和暴露的导电区域上。 多晶硅层沉积在间隔层上，并形成悬浮微结构的形状。 在去除间隔层之后，使悬浮的微结构自由地在暴露的导电平面上移动。 导电平面被驱动到与微结构相同的电位。

    Microelectromechanical signal processors
    18.
    发明授权
    Microelectromechanical signal processors 失效
    微机电信号处理器

    公开(公告)号：US5455547A

    公开(公告)日：1995-10-03

    申请号：US332981

    申请日：1994-10-31

    Applicant: Liwei Lin ,  Clark T.-C. Nguyen ,  Roger T. Howe ,  Albert P. Pisano

    Inventor： Liwei Lin ,  Clark T.-C. Nguyen ,  Roger T. Howe ,  Albert P. Pisano

    IPC: H03H9/46 ,  H03H9/00

    CPC classification number: H03H9/02275 ,  H03H9/02377 ,  H03H9/46 ,  H03H9/462

    Abstract: A micromechanical filter having planar components, and manufacturable using very large scale integrated circuit microfabrication techniques. The input and output transducers are interdigitated comb electrodes. The mechanical coupling between the input and output transducers includes planar flexures, displacement of the electrodes producing bending of the elements of the flexures. By sealing micromechanical filters in a vacuum and providing on-board circuitry, high signal-to-noise ratios and quality factors are achievable. Construction of a real-time spectrum analyzer using many micromechanical resonators, provides a device with high accuracy and a short sample time.

    Abstract translation: 具有平面部件的微机械滤波器，并且可使用非常大规模的集成电路微加工技术制造。 输入和输出换能器是叉指梳状电极。 输入和输出换能器之间的机械耦合包括平面弯曲，电极的位移产生弯曲元件的弯曲。 通过在真空中密封微机械滤波器并提供板上电路，可以实现高信噪比和质量因素。 构建使用许多微机械谐振器的实时频谱分析仪，为设备提供高精度和短的采样时间。

    Planar microshells for vacuum encapsulated devices and damascene method of manufacture
    20.
    发明授权
    Planar microshells for vacuum encapsulated devices and damascene method of manufacture 有权
    用于真空封装装置的平面微壳和大马士革制造方法

    公开(公告)号：US08313970B2

    公开(公告)日：2012-11-20

    申请号：US13017892

    申请日：2011-01-31

    Applicant: Emmanuel P. Quevy ,  Pezhman Monadgemi ,  Roger T. Howe

    Inventor： Emmanuel P. Quevy ,  Pezhman Monadgemi ,  Roger T. Howe

    IPC: H01L21/00

    CPC classification number: B81C1/00293 ,  B81B7/02 ,  B81C1/00246 ,  B81C2203/0136 ,  B81C2203/0145 ,  B81C2203/0721 ,  B81C2203/0735 ,  B81C2203/0771

    Abstract: Low temperature, multi-layered, planar microshells for encapsulation of devices such as MEMS and microelectronics. The microshells include a planar perforated pre-sealing layer, below which a non-planar sacrificial layer is accessed, and a sealing layer to close the perforation in the pre-sealing layer after the sacrificial material is removed. In an embodiment, the pre-sealing layer has perforations formed with a damascene process to be self-aligned to the chamber below the microshell. The sealing layer may include a nonhermetic layer to physically occlude the perforation and a hermetic layer over the nonhermetic occluding layer to seal the perforation. In a particular embodiment, the hermetic layer is a metal which is electrically coupled to a conductive layer adjacent to the microshell to electrically ground the microshell.

    Abstract translation: 用于MEMS和微电子等器件封装的低温多层平面微型壳体。 微壳包括平面穿孔的预密封层，在其下面接近非平面牺牲层，以及密封层，用于在去除牺牲材料之后封闭预密封层中的穿孔。 在一个实施例中，预密封层具有形成有镶嵌工艺的穿孔，以与微壳下方的腔室自对准。 密封层可以包括非密封层，以物理地封闭穿孔，并且在非密封闭塞层上方具有密封层以密封穿孔。 在特定实施例中，密封层是金属，其电耦合到与微壳相邻的导电层，以电微接地微壳。

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