公开(公告)号：US09124239B2

公开(公告)日：2015-09-01

申请号：US13521239

申请日：2011-12-14

申请人： Hideaki Nakayama ,  Atsushi Takano ,  Mitsuhiro Furukawa

发明人： Hideaki Nakayama ,  Atsushi Takano ,  Mitsuhiro Furukawa

IPC分类号： H03H9/72 ,  H03H9/25 ,  H03H9/05 ,  H03H9/10 ,  H03H9/00 ,  H03H9/145

CPC分类号： H03H9/725 ,  H01F38/14 ,  H03H9/0057 ,  H03H9/0547 ,  H03H9/0576 ,  H03H9/059 ,  H03H9/1071 ,  H03H9/12 ,  H03H9/14588 ,  H03H9/64

摘要： An elastic wave device includes a piezoelectric substrate, an IDT electrode disposed on the piezoelectric substrate, a wiring electrode disposed on the piezoelectric substrate and connected to the IDT electrode, a first insulator disposed on the piezoelectric substrate to seal the IDT electrode and the wiring electrode, a resin layer provided on the first insulator, an inductor electrode disposed on the resin layer, a second insulator disposed on the resin layer to cover the inductor electrode, a terminal electrode disposed on the second insulator, and a connecting electrode passing through the first insulator, the second insulator, and the resin layer to electrically connect the wiring electrode, the terminal electrode, and the inductor electrode. The first insulator includes a resin and filler dispersed in the resin. A density of filler in the resin layer is smaller than an average density of the filler in the first insulator. This elastic wave device has excellent characteristics of the inductor while reducing variations of the characteristics.

摘要翻译： 弹性波装置包括压电基片，设置在压电基片上的IDT电极，布置在压电基片上并与IDT电极连接的布线电极，设置在压电基片上以密封IDT电极和布线电极的第一绝缘体 设置在第一绝缘体上的树脂层，设置在树脂层上的电感器电极，设置在树脂层上以覆盖电感器电极的第二绝缘体，设置在第二绝缘体上的端子电极和穿过第一绝缘体的连接电极 绝缘体，第二绝缘体和树脂层，以电连接布线电极，端子电极和电感器电极。 第一绝缘体包括分散在树脂中的树脂和填料。 树脂层中填料的密度小于第一绝缘体中填料的平均密度。 该弹性波器件具有优异的电感特性，同时降低了特性的变化。

公开(公告)号：US09099981B2

公开(公告)日：2015-08-04

申请号：US13511508

申请日：2011-01-20

申请人： Mitsuhiro Furukawa ,  Tetsuhiro Korechika ,  Shinji Harada

发明人： Mitsuhiro Furukawa ,  Tetsuhiro Korechika ,  Shinji Harada

IPC分类号： H03H9/145 ,  H03H9/64 ,  H03H9/02

CPC分类号： H03H9/02992 ,  H03H9/02937

摘要： An acoustic wave device includes a piezoelectric substrate, a first wiring disposed on an upper surface of the piezoelectric substrate, an organic insulator covering at least a portion of the first wiring, a second wiring disposed on a first portion of the upper surface of the organic insulator, and an inorganic insulator covering at least a second portion of an upper surface of the organic insulator. The second portion of the upper surface of the organic insulator faces an oscillation space across the inorganic insulator. The acoustic wave device has preferable high-frequency characteristics and high long-term reliability.

摘要翻译： 声波装置包括压电基板，设置在压电基板的上表面上的第一布线，覆盖第一布线的至少一部分的有机绝缘体，布置在有机层的上表面的第一部分上的第二布线 绝缘体和覆盖有机绝缘体的上表面的至少第二部分的无机绝缘体。 有机绝缘体的上表面的第二部分面向横跨无机绝缘体的振荡空间。 声波装置具有优选的高频特性和高的长期可靠性。

公开(公告)号：US20120279795A1

公开(公告)日：2012-11-08

申请号：US13511508

申请日：2011-01-20

申请人： Mitsuhiro Furukawa ,  Tetsuhiro Korechika ,  Shinji Harada

发明人： Mitsuhiro Furukawa ,  Tetsuhiro Korechika ,  Shinji Harada

IPC分类号： G08B3/02

CPC分类号： H03H9/02992 ,  H03H9/02937

摘要： An acoustic wave device includes a piezoelectric substrate, a first wiring disposed on an upper surface of the piezoelectric substrate, an organic insulator covering at least a portion of the first wiring, a second wiring disposed on a first portion of the upper surface of the organic insulator, and an inorganic insulator covering at least a second portion of an upper surface of the organic insulator. The second portion of the upper surface of the organic insulator faces an oscillation space across the inorganic insulator. The acoustic wave device has preferable high-frequency characteristics and high long-term reliability.

摘要翻译： 声波装置包括压电基板，设置在压电基板的上表面上的第一布线，覆盖第一布线的至少一部分的有机绝缘体，布置在有机层的上表面的第一部分上的第二布线 绝缘体和覆盖有机绝缘体的上表面的至少第二部分的无机绝缘体。 有机绝缘体的上表面的第二部分面向横跨无机绝缘体的振荡空间。 声波装置具有优选的高频特性和高的长期可靠性。

公开(公告)号：US20110084573A1

公开(公告)日：2011-04-14

申请号：US12903326

申请日：2010-10-13

申请人： Toru YAMAJI ,  Tetsuhiro Korechika ,  Koji Kawakita ,  Eiji Kawamoto ,  Mitsuhiro Furukawa ,  Kozo Murakami

发明人： Toru YAMAJI ,  Tetsuhiro Korechika ,  Koji Kawakita ,  Eiji Kawamoto ,  Mitsuhiro Furukawa ,  Kozo Murakami

IPC分类号： H01L41/047 ,  H01L41/053

CPC分类号： H03H9/132 ,  H03H9/059 ,  H03H9/1092

摘要： An elastic wave device has the following elements: a piezoelectric substrate; an inter-digital transducer (IDT) electrode disposed on the piezoelectric substrate; internal electrodes disposed above the piezoelectric substrate and electrically connected to the IDT electrode; side walls disposed above the internal electrodes surrounding the IDT electrode; a cover disposed above the side walls so as to cover a space above the IDT electrode; an electrode base layer disposed on the internal electrodes outside the side walls; and connection electrodes disposed on the electrode base layer. Each connection electrode has a first connection electrode disposed on the electrode base layer, and a second connection electrode disposed on the first connection electrode. The horizontal sectional shape of the second connection electrode is non-circular.

摘要翻译： 弹性波器件具有以下元件：压电基片; 配置在所述压电基板上的数字式换能器（IDT）电极; 内部电极设置在压电基板上并电连接到IDT电极; 设置在围绕IDT电极的内部电极上方的侧壁; 设置在所述侧壁上方以覆盖所述IDT电极上方的空间的盖; 设置在侧壁外侧的内部电极上的电极基层; 以及设置在电极基底层上的连接电极。 每个连接电极具有设置在电极基底层上的第一连接电极和设置在第一连接电极上的第二连接电极。 第二连接电极的水平截面形状是非圆形的。

公开(公告)号：US07030539B2

公开(公告)日：2006-04-18

申请号：US10432499

申请日：2002-09-26

申请人： Mitsuhiro Furukawa ,  Kiyoharu Yamashita ,  Kazushi Nishida ,  Hiroshi Kurotake

发明人： Mitsuhiro Furukawa ,  Kiyoharu Yamashita ,  Kazushi Nishida ,  Hiroshi Kurotake

IPC分类号： H03H9/25 ,  H01L41/04

CPC分类号： H03H9/02921 ,  H03H3/08 ,  H03H9/14538

摘要： In a surface acoustic wave device, a common portion and a strip portion of a reflector electrode are partially cut off to increase a space between the electrodes. The increase of the space between the electrodes reduces the influence of the amount of charges and the influence of an unbalance between the amounts of charges in etching of a metallic film, thereby preventing the electrodes from having a curved shape in section. Consequently, the surface acoustic wave device has a reduced propagation loss.

摘要翻译： 在声表面波装置中，反射器电极的公共部分和带状部分被部分切断以增加电极之间的空间。 电极之间的空间的增加减少了金属膜的蚀刻中的电荷量的影响和电荷量之间的不平衡的影响，从而防止电极具有弯曲形状的截面。 因此，表面声波装置的传播损失减小。

公开(公告)号：US20050035830A1

公开(公告)日：2005-02-17

申请号：US10629633

申请日：2003-07-30

申请人： Muneko Tomioka ,  Kiyoharu Yamashita ,  Mitsuhiro Furukawa

发明人： Muneko Tomioka ,  Kiyoharu Yamashita ,  Mitsuhiro Furukawa

IPC分类号： H03H3/08 ,  H03H9/02 ,  H03H9/145 ,  H03H9/25 ,  H03H9/64

CPC分类号： H03H9/02992 ,  H03H3/08 ,  H03H9/02921 ,  Y10T29/42 ,  Y10T29/49005 ,  Y10T29/49007 ,  Y10T29/49128 ,  Y10T29/49144 ,  Y10T29/49156 ,  Y10T29/49794 ,  Y10T29/49798

摘要： A SAW element of the present invention includes a plurality of inter-digital transducer (IDT) electrodes on a piezoelectric substrate, grating reflector electrodes disposed on the sides of the IDT electrodes, and a plurality of pad electrodes led from the IDT electrodes and the grating reflector electrodes. A plurality of the pad electrodes includes isolated pad electrodes not directly opposed to the outer periphery of the SAW element, and adjacent pad electrodes directly opposed to the outer periphery thereof A connecting electrode between the isolated pad electrode and the adjacent pad electrode is removed by etching at least before dicing in order to prevent discharge from occurring due to pyroelectricity, and to prevent the electrodes from being damaged.

摘要翻译： 本发明的SAW元件包括在压电基板上的多个数字间换能器（IDT）电极，设置在IDT电极的侧面的光栅反射器电极和从IDT电极和光栅引出的多个焊盘电极 反射器电极。 多个焊盘电极包括不直接与SAW元件的外周直接相对的隔离焊盘电极和与其外周直接相对的相邻焊盘电极。隔离焊盘电极和相邻焊盘电极之间的连接电极通过蚀刻去除 至少在切割之前为了防止由于热电从而发生放电，并且防止电极被损坏。

公开(公告)号：US08564171B2

公开(公告)日：2013-10-22

申请号：US13248148

申请日：2011-09-29

申请人： Toru Yamaji ,  Mitsuhiro Furukawa ,  Koji Kawakita ,  Eiji Kawamoto

发明人： Toru Yamaji ,  Mitsuhiro Furukawa ,  Koji Kawakita ,  Eiji Kawamoto

IPC分类号： H03H9/25

CPC分类号： H03H9/1092

摘要： An acoustic wave element includes a piezoelectric substrate, an IDT electrode, a sidewall, a lid, and an adhesive layer. The IDT electrode is provided on the piezoelectric substrate. The sidewall is provided around the IDT electrode above the piezoelectric substrate. The lid is provided above the sidewall so as to cover a space above the IDT electrode. The adhesive layer is made of an adhesive provided between the lid and the sidewall. The top surface of the sidewall has a groove. The groove is filled with an adhesive, which reduces the protrusion amount of the adhesive.

摘要翻译： 声波元件包括压电基片，IDT电极，侧壁，盖子和粘合剂层。 IDT电极设置在压电基片上。 侧壁设置在压电基板上方的IDT电极周围。 盖子设置在侧壁上方以覆盖IDT电极上方的空间。 粘合剂层由设置在盖和侧壁之间的粘合剂制成。 侧壁的顶面具有凹槽。 凹槽填充有粘合剂，这降低了粘合剂的突出量。

公开(公告)号：US07764007B2

公开(公告)日：2010-07-27

申请号：US11817171

申请日：2006-03-07

申请人： Mitsuhiro Furukawa ,  Atsushi Takano

发明人： Mitsuhiro Furukawa ,  Atsushi Takano

IPC分类号： H01L41/047

CPC分类号： H01L24/11 ,  H01L24/05 ,  H01L24/13 ,  H01L2224/0345 ,  H01L2224/0361 ,  H01L2224/03622 ,  H01L2224/0401 ,  H01L2224/05568 ,  H01L2224/05624 ,  H01L2224/11472 ,  H01L2224/13023 ,  H01L2224/13084 ,  H01L2224/13124 ,  H01L2224/13144 ,  H01L2224/13155 ,  H01L2224/13166 ,  H01L2924/00013 ,  H01L2924/0002 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01022 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01058 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/00014 ,  H01L2224/13099 ,  H01L2224/13599 ,  H01L2224/05599 ,  H01L2224/05099 ,  H01L2224/29099 ,  H01L2224/29599 ,  H01L2224/05552

摘要： An under bump metal film formed on a substrate includes a diffusion-resistant barrier layer made of a platinum group metal film, and an aluminum-based stress relaxation layer formed under the diffusion-resistant barrier layer.

摘要翻译： 形成在基板上的凸块状金属膜包括由铂族金属膜构成的扩散阻挡层和形成在扩散阻挡层下方的铝系应力缓和层。

公开(公告)号：US07622684B2

公开(公告)日：2009-11-24

申请号：US11719160

申请日：2006-10-30

申请人： Atsushi Takano ,  Mitsuhiro Furukawa

发明人： Atsushi Takano ,  Mitsuhiro Furukawa

IPC分类号： H01L23/48 ,  H01L23/28

CPC分类号： H03H9/1085 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/181 ,  H01L2924/19105 ,  H03H3/08 ,  H03H9/0576 ,  H03H9/059 ,  H03H9/6483 ,  H03H9/725 ,  H01L2924/00014 ,  H01L2924/00012

摘要： An electronic component package comprises: an electronic component where device elements are mounted inside cavities formed between a component substrate and a component cover that covers the component substrate; and a mounting substrate. The component cover is placed on the mounting substrate, and the electronic component is mounted on the mounting substrate and molded by a resin. At least one of a ground electrode and a dummy electrode is provided on a surface of the component cover, the surface being placed on the mounting substrate. At least one of the ground electrode and the dummy electrode is provided in a position opposed to at least part of the cavities.

摘要翻译： 电子部件封装包括：电子部件，其中将器件元件安装在形成在部件基板和覆盖部件基板的部件盖之间的空腔内; 和安装基板。 组件盖放置在安装基板上，电子部件安装在安装基板上并用树脂模制。 接地电极和虚拟电极中的至少一个设置在部件盖的表面上，该表面被放置在安装基板上。 接地电极和虚拟电极中的至少一个设置在与至少一部分空腔相对的位置。

公开(公告)号：US20090021109A1

公开(公告)日：2009-01-22

申请号：US11817171

申请日：2006-03-07

申请人： Mitsuhiro Furukawa ,  Atsushi Takano

发明人： Mitsuhiro Furukawa ,  Atsushi Takano

IPC分类号： H01L41/00 ,  H01L23/48 ,  H01L21/44

CPC分类号： H01L24/11 ,  H01L24/05 ,  H01L24/13 ,  H01L2224/0345 ,  H01L2224/0361 ,  H01L2224/03622 ,  H01L2224/0401 ,  H01L2224/05568 ,  H01L2224/05624 ,  H01L2224/11472 ,  H01L2224/13023 ,  H01L2224/13084 ,  H01L2224/13124 ,  H01L2224/13144 ,  H01L2224/13155 ,  H01L2224/13166 ,  H01L2924/00013 ,  H01L2924/0002 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01022 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01058 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/00014 ,  H01L2224/13099 ,  H01L2224/13599 ,  H01L2224/05599 ,  H01L2224/05099 ,  H01L2224/29099 ,  H01L2224/29599 ,  H01L2224/05552

摘要： An under bump metal film formed on a substrate includes a diffusion-resistant barrier layer made of a platinum group metal film, and an aluminum-based stress relaxation layer formed under the diffusion-resistant barrier layer.

摘要翻译： 形成在基板上的凸块状金属膜包括由铂族金属膜构成的扩散阻挡层和形成在扩散阻挡层下方的铝系应力缓和层。