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    Disk having an electric connecting element and compensator plates
    12.
    发明授权
    Disk having an electric connecting element and compensator plates 有权
    磁盘具有电连接元件和补偿板

    公开(公告)号：US09572200B2

    公开(公告)日：2017-02-14

    申请号：US14439652

    申请日：2013-07-18

    Applicant: SAINT-GOBAIN GLASS FRANCE

    Inventor： Mitja Rateiczak ,  Bernhard Reul ,  Klaus Schmalbuch

    IPC: B60L1/02 ,  H05B3/84 ,  H05B3/06

    CPC classification number: H05B3/84 ,  H05B3/06 ,  H05B2203/016

    Abstract: A disk with at least one connecting element having compensator plates, including; a substrate having an electrically conductive structure on at least one partial region of the substrate, at least one compensator plate on at least one partial region of the conductive structure, at least one electric connecting element on at least one partial region of the at least one compensator plate, a lead-free soldering mass which connects the compensator plate via at least one contact surface including; one partial region of the electrically conductive structure, wherein the difference of the thermal expansion coefficient of the substrate and the compensator plate is less than 5×10−6/° C. and wherein the connecting element comprises copper.

    Abstract translation: 具有至少一个具有补偿板的连接元件的盘，包括： 衬底，其在所述衬底的至少一个部分区域上具有导电结构，在所述导电结构的至少一个部分区域上的至少一个补偿板，所述至少一个的至少一个部分区域上的至少一个电连接元件 补偿板，通过至少一个接触表面连接补偿板的无铅焊料，包括： 所述导电结构的一个部分区域，其中所述基板和所述补偿板的热膨胀系数的差小于5×10 -6 /℃，并且其中所述连接元件包括铜。

    Pane having an electrical connection element
    16.
    发明授权
    Pane having an electrical connection element 有权
    叶片具有电连接元件

    公开(公告)号：US09484651B2

    公开(公告)日：2016-11-01

    申请号：US14421993

    申请日：2013-07-24

    Applicant: SAINT-GOBAIN GLASS FRANCE

    Inventor： Mitja Rateiczak ,  Bernhard Reul ,  Klaus Schmalbuch

    IPC: H05B3/08 ,  H01R13/02 ,  H01R43/02 ,  B23K1/00 ,  B23K1/20

    CPC classification number: H01R13/02 ,  B23K1/0008 ,  B23K1/0016 ,  B23K1/20 ,  B23K35/26 ,  H01R43/02 ,  H01R43/0235 ,  H05B3/06 ,  H05B3/84 ,  Y10T29/49169

    Abstract: A pane having a connection element, having; a substrate having an electrically conductive structure on at least a subregion of the substrate, the electrical connection element on at least a subregion of the electrically conductive structure, and a lead-free soldering compound which connects the electrical connection element to the electrically conductive structure in at least a subregion, wherein the lead-free soldering compound contains 58 to 62% by weight indium, 35 to 38% by weight tin, 1 to 3.5% by weight silver and 0.5 to 2% by weight copper.

    Abstract translation: 具有连接元件的窗格，具有： 在所述基板的至少一个子区域上具有导电结构的基板，所述导电结构的至少一个子区域上的所述电连接元件以及将所述电连接元件连接到所述导电结构的无铅焊接化合物 至少一个子区域，其中无铅焊料化合物含有58至62重量％的铟，35至38重量％的锡，1至3.5重量％的银和0.5至2重量％的铜。

    DISK HAVING AN ELECTRIC CONNECTING ELEMENT AND COMPENSATOR PLATES
    17.
    发明申请
    DISK HAVING AN ELECTRIC CONNECTING ELEMENT AND COMPENSATOR PLATES 有权
    具有电气连接元件和补偿板的磁盘

    公开(公告)号：US20150296569A1

    公开(公告)日：2015-10-15

    申请号：US14439652

    申请日：2013-07-18

    Applicant: SAINT-GOBAIN GLASS FRANCE

    Inventor： Mitja Rateiczak ,  Bernhard Reul ,  Klaus Schmalbuch

    IPC: H05B3/84

    CPC classification number: H05B3/84 ,  H05B3/06 ,  H05B2203/016

    Abstract: A disk with at least one connecting element having compensator plates, including: a substrate having an electrically conductive structure on at least one partial region of the substrate, at least one compensator plate on at least one partial region of the conductive structure, at least one electric connecting element on at least one partial region of the at least one compensator plate, a lead-free soldering mass which connects the compensator plate via at least one contact surface including: one partial region of the electrically conductive structure, wherein the difference of the thermal expansion coefficient of the substrate and the compensator plate is less than 5×10−6/° C. and wherein the connecting element comprises copper.

    Abstract translation: 具有至少一个具有补偿板的连接元件的盘包括：在所述基底的至少一个部分区域上具有导电结构的基底，在所述导电结构的至少一个部分区域上的至少一个补偿板，至少一个 所述至少一个补偿板的至少一个部分区域上的电连接元件，经由至少一个接触表面连接所述补偿板的无铅焊接质量块，所述至少一个接触表面包括：所述导电结构的一个部分区域， 基板和补偿板的热膨胀系数小于5×10 -6 /℃，连接元件包括铜。

    Electrical contact composites and method for producing electrical contact composites
    19.
    发明授权
    Electrical contact composites and method for producing electrical contact composites 有权

    公开(公告)号：US10770806B2

    公开(公告)日：2020-09-08

    申请号：US15799767

    申请日：2017-10-31

    Applicant: SAINT-GOBAIN GLASS FRANCE

    Inventor： Mitja Rateiczak ,  Bernhard Reul

    IPC: B32B17/10 ,  H01R4/58 ,  H05B3/84 ,  C23C24/04 ,  C23C4/06 ,  H01R4/04

    Abstract: An electrical contact composite is described. The electrical contact composite has a substrate and an electrically conductive coating applied to the substrate, which coating is connected to an electrode. A metal contact element is connected to the electrode, which contact element is used to connect the conductive coating to a current/voltage source. Furthermore, at least one sprayed layer produced by means of a thermal spraying method, in particular gas dynamic cold spray, and is provided with at least one metal and/or metal alloy, the sprayed layer being arranged between the conductive coating and the contact element. The sprayed layer has a coefficient of thermal expansion that is between the coefficients of thermal expansion of the carrier and of the contact element. The sprayed layer can also be used as the electrode for the conductive coating.

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