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公开(公告)号：US20210193373A1
公开(公告)日：2021-06-24
申请号：US16911128
申请日：2020-06-24
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Kwi Jong Lee , Jung Min Kim , Young Seuck Yoo , Sung Jin Huh , Jin Hyuck Yang , Tae Hyun Kim
Abstract: A coil component includes a support substrate and a coil portion disposed on the support substrate, a body in which the support substrate and the coil portion are embedded, first and second lead portions extending from the coil portion and respectively exposed to a surface of the body, a surface insulating layer disposed on the surface of the body and having openings respectively exposing the first and second lead portions, and first and second external electrodes disposed on the surface insulating layer and connected to the first and second lead portions exposed through the openings. Each of the first and second external electrodes includes a first metal layer formed of a metal and in direct contact with the first and second lead portions.
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12.发明授权公开(公告)号：US10679955B2
公开(公告)日：2020-06-09
申请号：US15788189
申请日：2017-10-19
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Tae Hyun Kim , Thomas A. Kim , Kyu Bum Han
IPC: H01L23/367 , H01L23/13 , H01L23/498 , H01L23/00 , H01L23/538 , H01L25/10 , H01L23/552 , H01L25/03
Abstract: A semiconductor package includes a substrate portion including a core layer having a device accommodating portion formed therein, and a buildup layer stacked on each of opposing sides of the core layer; an electronic device disposed in the device accommodating portion; and heat dissipating conductors disposed in the buildup layer to externally emit heat generated by the electronic device.
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公开(公告)号：US20190057924A1
公开(公告)日：2019-02-21
申请号：US15832807
申请日：2017-12-06
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Tae Hyun Kim , Jung Hyun Lim , Seung Goo Jang , Eun Kyoung Kim , Se Min Jin
IPC: H01L23/367 , H01L23/31 , H01L23/00
Abstract: A semiconductor package includes a substrate including an antenna; a heating element disposed on a first surface of the substrate and connected to the antenna; a heat radiating part coupled to the heating element; and a signal transfer part disposed on the first surface of the substrate and configured to electrically connect the substrate to a main substrate. The heat radiating part may include a heat transfer part connected to the heating element and heat radiating terminals connecting the heat transfer part and the main substrate to each other.
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公开(公告)号：US09105601B2
公开(公告)日：2015-08-11
申请号：US14106107
申请日：2013-12-13
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Tae Hyun Kim , Do Jae Yoo , Bum Seok Suh
IPC: H01L23/40 , H01L23/492 , H01L23/64 , H01L23/373 , H01L23/433 , H01L23/495 , H01L23/498 , H01L23/053 , H01L23/31
CPC classification number: H01L23/3735 , H01L23/053 , H01L23/3121 , H01L23/4334 , H01L23/49531 , H01L23/49575 , H01L23/49811 , H01L2224/32225 , H01L2224/48091 , H01L2224/48137 , H01L2224/48227 , H01L2224/48247 , H01L2224/73265 , H01L2924/13034 , H01L2924/1305 , H01L2924/13055 , H01L2924/13091 , H01L2924/181 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
Abstract: Disclosed herein is a power module package including: a substrate including a metal layer, a first insulation layer formed on the metal layer, a first circuit pattern formed on the first insulation layer and including a first pad and a second pad spaced apart from the first pad, a second insulation layer formed on the first insulation layer to cover the first circuit pattern, and a second circuit pattern formed on the second insulation layer and including a third pad formed on a location corresponding to the first pad and a fourth pad spaced apart from the third pad; a semiconductor chip mounted on the second circuit pattern; one end being electrically connected to the semiconductor chip, and another end protruding from the outside, wherein the first pad and the third pad, and the second pad and the fourth pad have different polarities.
Abstract translation: 本文公开了一种功率模块封装，包括：基板，包括金属层，形成在金属层上的第一绝缘层，形成在第一绝缘层上的第一电路图案，并且包括第一焊盘和与第一绝缘层间隔开的第二焊盘 衬垫，形成在第一绝缘层上以覆盖第一电路图案的第二绝缘层和形成在第二绝缘层上的第二电路图案，并且包括形成在与第一焊盘相对应的位置上的第三焊盘和间隔开的第四焊盘 从第三垫; 安装在第二电路图案上的半导体芯片; 一端电连接到半导体芯片，另一端从外部突出，其中第一焊盘和第三焊盘以及第二焊盘和第四焊盘具有不同的极性。
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公开(公告)号：US20140183717A1
公开(公告)日：2014-07-03
申请号：US14043549
申请日：2013-10-01
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Tae Hyun Kim , Bum Seok Suh , Joon Hyung Cho , Si Joong Yang
IPC: H01L23/34
CPC classification number: H01L23/3735 , H01L23/3736 , H01L2023/4056 , H01L2224/0603 , H01L2224/48095 , H01L2224/48137 , H01L2224/48139 , H01L2224/49113 , H01L2224/49175 , H01L2924/13034 , H01L2924/1305 , H01L2924/13055 , H01L2924/13091 , H01L2924/00014 , H01L2924/00 , H01L2224/49111
Abstract: Disclosed herein is a semiconductor module package, including: a first module including a first heat radiation substrate and one or more first semiconductor elements and having a first N terminal and a first P terminal formed at one end thereof; a second module including a second heat radiation substrate and one or more second semiconductor elements, having a second N terminal and a second P terminal formed at one end thereof, and disposed so as to face the first module; and a first output terminal formed by electrically connecting the first module to the second module.
Abstract translation: 这里公开了一种半导体模块封装，包括：第一模块，包括第一散热基板和一个或多个第一半导体元件，并且具有在其一端形成的第一N端子和第一P端子; 第二模块，包括第二散热基板和一个或多个第二半导体元件，具有形成在其一端的第二N端子和第二P端子，并且被设置为面对第一模块; 以及通过将第一模块电连接到第二模块而形成的第一输出端子。
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Patent Agency Ranking
公开(公告)号：US20140146487A1
公开(公告)日：2014-05-29
申请号：US14091228
申请日：2013-11-26
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Young Ho Sohn , Eun Jung Jo , Jae Hyun Lim , Tae Hyun Kim
CPC classification number: H01R13/17 , H01L24/72 , H01L2924/13034 , H01L2924/1305 , H01L2924/13055 , H01L2924/13091 , H01L2924/15787 , H01R12/714 , H01R12/73 , H01R13/08 , H01L2924/00
Abstract: Disclosed herein is a contact pin including: a deformation part elastically deformed; connection parts coupled to both ends of the deformation part; and contact parts coupled to the connection parts coupled to both ends of the deformation part, respectively, and having one end coupled to the connection part and the other end.
Abstract translation: 这里公开了一种接触销，包括：变形部弹性变形; 耦合到变形部分的两端的连接部分; 以及分别联接到连接部分的接合部分，所述连接部分分别连接到变形部分的两端，并且其一端联接到连接部分和另一端。
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公开(公告)号：US11688546B2
公开(公告)日：2023-06-27
申请号：US16911128
申请日：2020-06-24
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Kwi Jong Lee , Jung Min Kim , Young Seuck Yoo , Sung Jin Huh , Jin Hyuck Yang , Tae Hyun Kim
CPC classification number: H01F27/292 , H01F17/0013 , H01F17/04 , H01F27/32 , H01F2017/048
Abstract: A coil component includes a support substrate and a coil portion disposed on the support substrate, a body in which the support substrate and the coil portion are embedded, first and second lead portions extending from the coil portion and respectively exposed to a surface of the body, a surface insulating layer disposed on the surface of the body and having openings respectively exposing the first and second lead portions, and first and second external electrodes disposed on the surface insulating layer and connected to the first and second lead portions exposed through the openings. Each of the first and second external electrodes includes a first metal layer formed of a metal and in direct contact with the first and second lead portions.
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公开(公告)号：US11437295B2
公开(公告)日：2022-09-06
申请号：US16823791
申请日：2020-03-19
Applicant: Samsung Electro-Mechanics Co., Ltd.
Inventor： Tae Hyun Kim , Jung Hyun Lim , Seung Goo Jang , Eun Kyoung Kim , Se Min Jin
IPC: H01L23/367 , H01L23/31 , H01L23/433 , H01L23/498 , H01L23/538 , H01L23/00 , H01L23/66
Abstract: A semiconductor package includes a substrate including an antenna; a heating element disposed on a first surface of the substrate and connected to the antenna; a heat radiating part coupled to the heating element; and a signal transfer part disposed on the first surface of the substrate and configured to electrically connect the substrate to a main substrate. The heat radiating part may include a heat transfer part connected to the heating element and heat radiating terminals connecting the heat transfer part and the main substrate to each other.
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公开(公告)号：US20140167242A1
公开(公告)日：2014-06-19
申请号：US14103574
申请日：2013-12-11
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Tae Hyun Kim , Kwang Soo Kim , Sun Woo Yun , Young Ki Lee , Do Jae Yoo
IPC: H01L23/02
CPC classification number: H01L23/053 , H01L23/3735 , H01L24/73 , H01L2224/32225 , H01L2224/48137 , H01L2224/48227 , H01L2224/48247 , H01L2224/73265 , H01L2924/13034 , H01L2924/1305 , H01L2924/13055 , H01L2924/13091 , H01L2924/19107 , H01L2924/00012 , H01L2924/00 , H01L2924/00014
Abstract: Disclosed herein is a power module package including: a first module configured of a first substrate having one surface and the other surface, a first semiconductor chip mounted on one surface of the first substrate, and a first sealing member formed to cover the first semiconductor chip mounted on one surface of the first substrate from both sides in a thickness direction of the first substrate and expose the other surface of the first substrate; and a case enclosing the first module.
Abstract translation: 本文公开了一种功率模块封装，包括：第一模块，其由具有一个表面和另一个表面的第一衬底构成，安装在第一衬底的一个表面上的第一半导体芯片和形成为覆盖第一半导体芯片的第一密封构件 在第一基板的厚度方向上从两侧安装在第一基板的一个表面上，并露出第一基板的另一个表面; 以及包围第一模块的壳体。
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公开(公告)号：US20140167237A1
公开(公告)日：2014-06-19
申请号：US13950205
申请日：2013-07-24
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Do Jae Yoo , Tae Hyun Kim , Kwang Soo Kim , Joon Seok Chae
IPC: H01L23/495 , H01L23/48
CPC classification number: H01L24/73 , H01L23/053 , H01L23/24 , H01L23/3735 , H01L23/49811 , H01L2224/48091 , H01L2224/48137 , H01L2224/73265 , H01L2924/13034 , H01L2924/1305 , H01L2924/13055 , H01L2924/13091 , H01L2924/15787 , H01L2924/181 , H01L2924/00014 , H01L2924/00
Abstract: Disclosed herein is a power module package, including: a substrate; semiconductor chips mounted on one surface of the substrate; external connection terminals connected to one surface of the substrate; and a connecting member having one end contacting the semiconductor chips and the other end contacting the external connection terminals and electrically and mechanically connecting between the semiconductor chips and the external connection terminals.
Abstract translation: 本文公开了一种功率模块封装，包括：基板; 安装在基板的一个表面上的半导体芯片; 连接到基板的一个表面的外部连接端子; 以及连接构件，其一端接触半导体芯片，另一端接触外部连接端子，并且在半导体芯片和外部连接端子之间电气和机械连接。
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