公开(公告)号：US09088068B2

公开(公告)日：2015-07-21

申请号：US13888964

申请日：2013-05-07

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Dong Hyeok Choi ,  Jin Young Kim ,  Chang Ryul Jung ,  Ji Man Ryu ,  Sung Yong An

IPC: H01Q7/08 ,  H01Q7/06 ,  H01F3/02 ,  H01F38/14

CPC classification number: H01Q7/06 ,  H01F3/02 ,  H01F38/14

Abstract: There is provided a magnetic composite sheet including: a magnetic layer including first and second magnetic pieces having different sizes; and a cover film formed on one surface or both surfaces of the magnetic layer, wherein, in a cross-section of the magnetic composite sheet taken in a direction parallel to a direction in which the magnetic layer and the cover film are laminated, when a length of the first magnetic piece in a vertical direction is a and a length thereof in a horizontal direction is b, and a length of the second magnetic piece in the vertical direction is a′ and a length thereof in the horizontal direction is b′, b/a is greater than b′/a′(b/a>b′/a′).

Abstract translation: 提供一种磁性复合片材，其包括：包括具有不同尺寸的第一和第二磁性片的磁性层; 以及形成在所述磁性层的一个表面或两个表面上的覆盖膜，其中，在所述磁性复合片材的沿与所述磁性层和所述覆盖膜层叠的方向平行的方向上截取的截面中，当 第一磁性体在垂直方向上的长度为a，水平方向的长度为b，第二磁性体在垂直方向上的长度为a'，水平方向的长度为b' b / a大于b'/ a'（b / a> b'/ a'）。

公开(公告)号：US09035738B2

公开(公告)日：2015-05-19

申请号：US13842187

申请日：2013-03-15

Applicant: Samsung Electro-Mechanics Co., Ltd.

Inventor： Sa Yong Lee ,  Jin Young Kim ,  Keun Yong Lee ,  Geum Hee Yun ,  Moon Soo Park

IPC: H01F5/00 ,  H01F27/28 ,  H01F17/00 ,  H01F41/04 ,  H01F17/04

CPC classification number: H01F17/0013 ,  H01F41/041 ,  H01F41/046 ,  H01F2017/048 ,  Y10T29/4902

Abstract: Disclosed herein is a multilayer inductor, manufactured by stacking laminates each including: a substrate having internal electrode coil patterns formed thereon; and a magnetic substance filling the substrate on which the internal electrode coil patterns are formed, wherein the substrate is formed by using a composition including a magnetic material, so that, when the substrate is placed in the middle of the electrode circuit patterns at the time of manufacturing a power inductor, the substrate can be utilized as a gap material, and thus the thickness of an inductor chip can be minimized, and, in addition, the magnetic material is included in the substrate forming composition, thereby improving magnetic characteristics, and the liquid crystal oligomer and the nanoclay are added to the composition, to thereby increase insulating property between magnetic metals, thereby raising inductance, and thus dimensional stability and physical hardness of the structure can be secured.

Abstract translation: 本文公开了一种层叠电感器，其通过层叠层叠体制造，每个层叠体包括：其上形成有内部电极线圈图案的基板; 以及填充形成有内部电极线圈图案的基板的磁性物质，其中通过使用包括磁性材料的组合物形成基板，使得当基板被放置在电极电路图案的中间时 制造功率电感器时，可以将衬底用作间隙材料，从而可以使电感器芯片的厚度最小化，并且另外，磁性材料被包括在基板形成组合物中，从而改善磁特性，以及 将液晶低聚物和纳米粘土添加到组合物中，从而提高磁性金属之间的绝缘性，从而提高电感，从而可以确保结构的尺寸稳定性和物理硬度。

公开(公告)号：US20150057393A1

公开(公告)日：2015-02-26

申请号：US14095864

申请日：2013-12-03

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Jin Seok Moon ,  Hyun Jun Lee ,  Seong Hyun Yoo ,  Jin Young Kim ,  Geum Hee Yun

IPC: H05K1/03 ,  H05K3/00

CPC classification number: H05K1/0373 ,  H05K1/0353 ,  H05K3/4602 ,  H05K3/4676 ,  H05K2201/0141 ,  H05K2201/0191 ,  H05K2201/0209 ,  H05K2201/09627

Abstract: Disclosed herein are an insulating resin composition for a printed circuit board and products manufactured by using the same, and more particularly, an insulating resin composition for a printed circuit board including a 4-functional naphthalene-based epoxy resin and having improved coefficient of thermal expansion and glass transition temperature properties, and a prepreg and a printed circuit board as products manufactured by using the same.

Abstract translation: 本发明公开了一种用于印刷电路板的绝缘树脂组合物和使用该绝缘树脂组合物的产品，更具体地说，涉及一种用于印刷电路板的绝缘树脂组合物，该印刷电路板包括4-官能的萘基环氧树脂并具有改善的热膨胀系数 和玻璃化转变温度性质，以及作为通过使用它们制造的产品的预浸料和印刷电路板。

公开(公告)号：US20150027763A1

公开(公告)日：2015-01-29

申请号：US14143681

申请日：2013-12-30

Applicant: Samsung Electro-Mechanics Co., Ltd.

Inventor： Jin Ho HONG ,  Geum Hee Yun ,  Dae Hui Jo ,  Sa Yong Lee ,  Jin Young Kim ,  Keun Yong Lee

IPC: H05K1/03 ,  H05K1/02 ,  C09C1/40

CPC classification number: H05K1/0373 ,  C01P2004/61 ,  C01P2004/62 ,  C01P2004/64 ,  C01P2004/80 ,  C01P2006/22 ,  C09C1/405 ,  C09C3/063 ,  C09C3/12 ,  H05K1/036 ,  H05K1/0366 ,  H05K3/4676 ,  H05K2201/0191 ,  H05K2201/0195 ,  H05K2201/0209 ,  H05K2201/0227 ,  H05K2201/0239 ,  H05K2201/068

Abstract: An inorganic filler has a negative coefficient of thermal expansion, and a shell thereon that decreases diffusion of ions contained in the inorganic filler to outside of the shell and organic filler.

Abstract translation: 无机填料具有负的热膨胀系数和其上的壳，其使包含在无机填料中的离子的扩散减少到壳外部和有机填料。

公开(公告)号：US20140154479A1

公开(公告)日：2014-06-05

申请号：US13845032

申请日：2013-03-17

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Geum Hee Yun ,  Jin Ho Hong ,  Sa Yong Lee ,  Jin Young Kim ,  Keun Yong Lee

IPC: H05K1/03 ,  H01B3/40

CPC classification number: H05K1/0373 ,  H01B3/40 ,  H05K2201/0141 ,  H05K2201/0162 ,  H05K2201/0209 ,  H05K2201/0239 ,  Y10T428/24802

Abstract: Disclosed herein is a resin composition for a printed circuit board, including: a liquid crystalline oligomer; an epoxy resin; and an inorganic filler which is a reaction product of silica, silane having a vinyl group and an alkoxy group, and vinyl or hydroxyl terminated silicone oil. The resin composition has a low thermal expansion coefficient, excellent heat resistance and a high glass transition temperature.

Abstract translation: 本发明公开了一种用于印刷电路板的树脂组合物，包括：液晶低聚物; 环氧树脂; 和作为二氧化硅，具有乙烯基和烷氧基的硅烷和乙烯基或羟基封端的硅油的反应产物的无机填料。 树脂组合物的热膨胀系数低，耐热性优异，玻璃化转变温度高。