公开(公告)号：US20250014841A1

公开(公告)日：2025-01-09

申请号：US18752130

申请日：2024-06-24

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Boum Seock Kim ,  Chin Mo Kim ,  Kang Wook Bong ,  Jin Young Kim ,  Seong Jun Park ,  Sung Yong An ,  Joung Hee Cho ,  Yu Jin Ham

IPC: H01G11/76 ,  H01G11/78

Abstract: A tantalum capacitor includes a tantalum body including a tantalum element, a conductive polymer layer disposed on the tantalum element, and a tantalum wire penetrating through at least a portion of each of the tantalum element and the conductive polymer layer in a first direction, a molded unit surrounding the tantalum body and, an anode lead frame exposed to one surface of the molded unit and connected to the tantalum wire, a cathode lead frame spaced apart from the anode lead frame and exposed to the one surface of the molded unit, and a first coating layer disposed in at least a portion of a region between the molded unit and the anode lead frame and a region between the molded unit and the cathode lead frame.

公开(公告)号：US20140080940A1

公开(公告)日：2014-03-20

申请号：US13732519

申请日：2013-01-02

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Sa Yong Lee ,  Jin Young Kim ,  Keun Yong Lee

IPC: C09D163/00

CPC classification number: C09D163/00 ,  C08G59/4021 ,  C08L63/00 ,  H01B3/185 ,  H01B3/40 ,  H05K1/0373 ,  H05K3/022 ,  H05K3/4676 ,  H05K2201/0209 ,  H05K2201/0251 ,  H05K2201/0257 ,  H05K2203/178 ,  C08L1/02 ,  C08L77/00

Abstract: Disclosed herein are a resin composition for insulation, and an insulating film, a prepreg, and a printed circuit board, manufactured using the same, the resin composition including: a cellulose nanoparticle or a cellulose nanofiber; a liquid crystalline oligomer or a soluble liquid crystalline thermohardenable oligomer; an epoxy resin; and an inorganic filler, so that the resin composition, the insulating film, and the prepreg can have a low coefficient of thermal expansion, a high glass transition temperature, and high rigidity.

Abstract translation: 本发明公开了一种绝缘用树脂组合物，使用其制造的绝缘膜，预浸料坯和印刷电路板，所述树脂组合物包括：纤维素纳米颗粒或纤维素纳米纤维; 液晶低聚物或可溶性液晶可热硬化低聚物; 环氧树脂; 和无机填料，使得树脂组合物，绝缘膜和预浸料坯可以具有低热膨胀系数，高玻璃化转变温度和高刚性。

公开(公告)号：US20150147542A1

公开(公告)日：2015-05-28

申请号：US14334956

申请日：2014-07-18

Applicant: Samsung Electro-Mechanics Co., Ltd.

Inventor： Jin Seok MOON ,  Dae Hui Jo ,  Seong Hyun Yoo ,  Hyun Jun Lee ,  Jin Young Kim ,  Geum Hee Yun

IPC: H05K1/03 ,  C08L63/00

CPC classification number: C08L63/00 ,  C08G59/24 ,  C08G59/3218 ,  H05K1/0326 ,  H05K1/0353 ,  H05K3/022 ,  H05K2201/0141 ,  Y10T428/24917 ,  Y10T428/31529

Abstract: A resin composition for a printed circuit board and a printed circuit board formed of the same. The resin composition for a printed circuit board may have: a liquid crystal oligomer including a structural unit of the Chemical Formula 1 and a structural unit of the Chemical Formula 2 and including a functional group of the Chemical Formula E on at least one end; and an ether-type naphthalene-based epoxy resin of Chemical Formula N. According to an exemplary embodiment, even though a printed circuit board becomes light, thin, and miniaturized, electric, thermal, and mechanical stability of the printed circuit board may be secured.

Abstract translation: 一种用于印刷电路板的树脂组合物和由其形成的印刷电路板。 用于印刷电路板的树脂组合物可以具有：在至少一端包含化学式1的结构单元和化学式2的结构单元并且包含化学式E的官能团的液晶低聚物; 和化学式N的醚型萘系环氧树脂。根据示例性实施方式，即使印刷电路板变薄，薄且小型化，也可以确保印刷电路板的电，热和机械稳定性 。

公开(公告)号：US20140076198A1

公开(公告)日：2014-03-20

申请号：US13735741

申请日：2013-01-07

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Jin Young Kim ,  Sa Yong Lee ,  Geum Hee Yun ,  Keun Yong Lee

IPC: C09D163/00

CPC classification number: C09D163/00 ,  C08G59/4021 ,  C08J5/24 ,  C08J2363/00 ,  C08L63/00 ,  C08L5/08 ,  C08L77/00

Abstract: Disclosed herein are an epoxy resin composition for insulation, and an insulating film, a prepreg, and a printed circuit board, manufactured using the same, the epoxy resin composition including: a chitin nanoparticle or a chitin nanofiber; a liquid crystal oligomer or a soluble liquid crystal thermosetting oligomer; an epoxy resin; and an inorganic filler, so that the epoxy resin composition, the insulating film, and the prepreg can have a low coefficient of thermal expansion, a high glass transition temperature, and high rigidity.

Abstract translation: 本发明公开了一种用于绝缘的环氧树脂组合物和使用其制备的绝缘膜，预浸料和印刷电路板，所述环氧树脂组合物包括：几丁质纳米颗粒或几丁质纳米纤维; 液晶低聚物或可溶性液晶热固性低聚物; 环氧树脂; 和无机填料，使得环氧树脂组合物，绝缘膜和预浸料坯可以具有低热膨胀系数，高玻璃化转变温度和高刚性。

公开(公告)号：US20140146004A1

公开(公告)日：2014-05-29

申请号：US13835753

申请日：2013-03-15

Applicant: SAMSUNG ELECTRO-MECHANICS CO. LTD.

Inventor： Jae Hyuk JANG ,  Dong Hyeok Choi ,  Jin Young Kim ,  Yong Il Kwon ,  No Il Park ,  Hak Kwan Kim

IPC: G06F3/046

CPC classification number: G06F3/046 ,  G06F1/1643 ,  G06F1/1684 ,  G06F1/1698 ,  G06F3/0416

Abstract: There is provided an input device including a display panel having a first region for displaying an image, a touch panel attached to the display panel and detecting a touch input, and a digitizer module attached to the display panel and detecting an electromagnetic type digitizer input, wherein the digitizer module includes a plurality of circuit units formed in a second region corresponding to an edge of the first region, and at least a portion of the plurality of circuit units operates as a circuit unit for wireless communications.

Abstract translation: 提供了一种输入装置，包括具有用于显示图像的第一区域的显示面板，附接到显示面板的触摸面板和检测触摸输入;以及附接到显示面板并检测电磁型数字转换器输入的数字转换器模块， 其中所述数字转换器模块包括形成在对应于所述第一区域的边缘的第二区域中的多个电路单元，并且所述多个电路单元的至少一部分用作无线通信的电路单元。

公开(公告)号：US20150114693A1

公开(公告)日：2015-04-30

申请号：US14195665

申请日：2014-03-03

Applicant: Samsung Electro-Mechanics Co., Ltd.

Inventor： Jin Seok Moon ,  Geum Hee Yun ,  Dae Hui Jo ,  Seong Hyun Yoo ,  Hyun Jun Lee ,  Jin Young Kim ,  Keung Jin Sohn

IPC: C08L63/00 ,  H05K1/03 ,  H05K1/02 ,  C08L65/02

CPC classification number: C08L63/00 ,  C08G59/245 ,  C08G59/3218 ,  C08G73/0655 ,  C08K3/34 ,  C08L79/04 ,  C08L79/085 ,  H05K1/0271 ,  H05K1/0373 ,  H05K2201/068

Abstract: Disclosed herein are an insulating resin composition for a printed circuit board, and an insulating film, a prepreg, a copper clad laminate, or a printed circuit board manufactured by using the same. More specifically, the insulating resin composition contains an eucryptite inorganic filler having a negative coefficient of thermal expansion, such that a glass transition temperature and a coefficient of thermal expansion may be improved, and warpage of the insulating film, the prepreg, the copper clad laminate, or the printed circuit board manufactured by using the insulating resin composition for a printed circuit board may be minimized.

Abstract translation: 本文公开了用于印刷电路板的绝缘树脂组合物，以及使用该绝缘树脂的绝缘膜，预浸料，覆铜层压板或印刷电路板。 更具体地说，绝缘树脂组合物含有具有负热膨胀系数的堇青石无机填料，可以提高玻璃化转变温度和热膨胀系数，并且绝缘膜，预浸料，覆铜层压板的翘曲 或通过使用印刷电路板用绝缘树脂组合物制造的印刷电路板可以最小化。

公开(公告)号：US20150065608A1

公开(公告)日：2015-03-05

申请号：US14249239

申请日：2014-04-09

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Geum Hee Yun ,  Jin Seok Moon ,  Dae Hui Jo ,  Seong Hyun Yoo ,  Hyun Jun Lee ,  Jin Young Kim

IPC: H05K1/03 ,  C08L63/00

CPC classification number: H05K1/0366 ,  C08L63/00 ,  C08L2203/20 ,  C08L2205/03 ,  H05K1/0271 ,  H05K1/0326 ,  H05K1/0346 ,  H05K1/0373 ,  H05K2201/0141 ,  H05K2201/0145 ,  C08L79/08 ,  C08L101/00

Abstract: Disclosed herein are an insulating resin composition for a printed circuit board and products manufactured by using the same, and more particularly, an insulating resin composition for a printed circuit board including an amino triazine novolac curing agent having an amino group and a hydroxyl group to have improved coefficient of thermal expansion and glass transition temperature properties, and improved acid resistant property that discoloration of the product is not generated, and an insulating film and a prepreg as products manufactured by using the same.

Abstract translation: 本发明公开了一种用于印刷电路板的绝缘树脂组合物和使用该绝缘树脂组合物的产品，更具体地，涉及具有氨基和羟基的氨基三嗪酚醛清漆固化剂的印刷电路板用绝缘树脂组合物， 改善的热膨胀系数和玻璃化转变温度性能，以及不产生产品变色的耐酸性能，以及作为通过使用该产品制造的产品的绝缘膜和预浸料。

公开(公告)号：US20240212918A1

公开(公告)日：2024-06-27

申请号：US18377630

申请日：2023-10-06

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Jin Young Kim ,  Ki Young Yoo ,  Boum Seock Kim

IPC: H01F27/28 ,  H01F27/29

CPC classification number: H01F27/2828 ,  H01F27/292

Abstract: A coil component includes: a body; a coil buried in the body; an external electrode disposed on one surface of the body; and a lead-out portion connecting an end of the coil to the external electrode, wherein the lead-out portion and the end of the coil form an interface.

公开(公告)号：US20230170133A1

公开(公告)日：2023-06-01

申请号：US17978652

申请日：2022-11-01

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Yu Jung Park ,  Jin Young Kim ,  Hyeon Jin Jang

IPC: H01F27/29 ,  H01F27/32 ,  H01F41/04

CPC classification number: H01F27/29 ,  H01F27/323 ,  H01F41/04

Abstract: A coil component includes a body including a first surface and a plurality of side surfaces respectively connected to the first surface, a substrate disposed in the body, a coil portion disposed in the body, a lead-out portion disposed in the body and connected to the coil portion, and a dummy portion spaced apart from the lead-out portion. The body includes four corners, at each of which two adjacent side surfaces of the first to fourth side surfaces are in contact with each other, and the dummy portion includes first to fourth dummy patterns respectively disposed outside the coil portion and extending toward the four corners of the body.

公开(公告)号：US11538618B2

公开(公告)日：2022-12-27

申请号：US16554285

申请日：2019-08-28

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Jin Young Kim ,  Jong Min Lee

IPC: H01F27/28 ,  H01F27/29

Abstract: A coil component includes a body; an insulating substrate embedded in the body; and a coil portion disposed on at least one surface of the insulating substrate. The insulating substrate is inclined with respect to one surface of the body, in a cross-section of the body in a width-thickness direction.