公开(公告)号：US20160197194A1

公开(公告)日：2016-07-07

申请号：US15071700

申请日：2016-03-16

Applicant: Semiconductor Energy Laboratory Co., Ltd.

Inventor： Kenichi OKAZAKI ,  Toshinari SASAKI ,  Shuhei YOKOYAMA ,  Takashi HAMOCHI

IPC: H01L29/786 ,  H01L29/49 ,  H01L29/24

CPC classification number: H01L29/7869 ,  H01L21/02112 ,  H01L21/02274 ,  H01L21/385 ,  H01L23/3171 ,  H01L29/045 ,  H01L29/24 ,  H01L29/45 ,  H01L29/4908 ,  H01L29/4966 ,  H01L29/66742 ,  H01L29/66969 ,  H01L29/78606 ,  H01L29/78648 ,  H01L29/78696

Abstract: In a semiconductor device including a transistor including an oxide semiconductor film and a protective film over the transistor, an oxide insulating film containing oxygen in excess of the stoichiometric composition is formed as the protective film under the following conditions: a substrate placed in a treatment chamber evacuated to a vacuum level is held at a temperature higher than or equal to 180° C. and lower than or equal to 260° C.; a source gas is introduced into the treatment chamber so that the pressure in the treatment chamber is set to be higher than or equal to 100 Pa and lower than or equal to 250 Pa; and a high-frequency power higher than or equal to 0.17 W/cm2 and lower than or equal to 0.5 W/cm2 is supplied to an electrode provided in the treatment chamber.

公开(公告)号：US20150380566A1

公开(公告)日：2015-12-31

申请号：US14822995

申请日：2015-08-11

Applicant: Semiconductor Energy Laboratory Co., Ltd.

Inventor： Shunichi ITO ,  Toshinari SASAKI ,  Miyuki HOSOBA ,  Junichiro SAKATA

IPC: H01L29/786 ,  G09G3/20

CPC classification number: H01L27/1225 ,  G09G3/20 ,  H01L27/1248 ,  H01L27/1259 ,  H01L29/247 ,  H01L29/45 ,  H01L29/66969 ,  H01L29/78618 ,  H01L29/7869 ,  H01L29/78693 ,  H01L29/78696

Abstract: An object is to control composition and a defect of an oxide semiconductor, another object is to increase a field effect mobility of a thin film transistor and to obtain a sufficient on-off ratio with a reduced off current. A solution is to employ an oxide semiconductor whose composition is represented by InMO3(ZnO)m, where M is one or a plurality of elements selected from Ga, Fe, Ni, Mn, Co, and Al, and m is preferably a non-integer number of greater than 0 and less than 1. The concentration of Zn is lower than the concentrations of In and M. The oxide semiconductor has an amorphous structure. Oxide and nitride layers can be provided to prevent pollution and degradation of the oxide semiconductor.

Abstract translation: 目的是控制氧化物半导体的组成和缺陷，另一个目的是增加薄膜晶体管的场效应迁移率，并获得具有减小的截止电流的足够的开 - 关比。 解决方案是使用其组成由InMO 3（ZnO）m表示的氧化物半导体，其中M是选自Ga，Fe，Ni，Mn，Co和Al中的一种或多种元素，m优选为非 - 整数大于0且小于1. Zn的浓度低于In和M的浓度。氧化物半导体具有无定形结构。 可以提供氧化物和氮化物层以防止氧化物半导体的污染和劣化。

公开(公告)号：US20150179776A1

公开(公告)日：2015-06-25

申请号：US14629575

申请日：2015-02-24

Applicant: Semiconductor Energy Laboratory Co., Ltd.

Inventor： Atsuo ISOBE ,  Toshinari SASAKI ,  Shinya SASAGAWA ,  Akihiro ISHIZUKA

IPC: H01L29/66 ,  H01L29/786

CPC classification number: H01L29/66969 ,  H01L21/02554 ,  H01L21/02565 ,  H01L21/02667 ,  H01L27/0688 ,  H01L27/1225 ,  H01L29/42384 ,  H01L29/78603 ,  H01L29/78642 ,  H01L29/7869 ,  H01L29/78696

Abstract: An insulating layer is provided with a projecting structural body, and a channel formation region of an oxide semiconductor layer is provided in contact with the projecting structural body, whereby the channel formation region is extended in a three dimensional direction (a direction perpendicular to a substrate). Thus, it is possible to miniaturize a transistor and to extend an effective channel length of the transistor. Further, an upper end corner portion of the projecting structural body, where a top surface and a side surface of the projecting structural body intersect with each other, is curved, and the oxide semiconductor layer is formed to include a crystal having a c-axis perpendicular to the curved surface.

Abstract translation: 绝缘层设置有突出的结构体，并且设置与突出结构体接触的氧化物半导体层的沟道形成区域，由此沟道形成区域沿三维方向（垂直于衬底的方向）延伸 ）。 因此，可以使晶体管小型化并且延长晶体管的有效沟道长度。 此外，突出结构体的顶表面和侧表面彼此相交的突出结构体的上端角部弯曲，并且氧化物半导体层形成为包括具有c轴的晶体 垂直于曲面。

公开(公告)号：US20150171195A1

公开(公告)日：2015-06-18

申请号：US14576400

申请日：2014-12-19

Applicant: Semiconductor Energy Laboratory Co., Ltd.

Inventor： Atsuo ISOBE ,  Toshinari SASAKI ,  Shinya SASAGAWA ,  Akihiro ISHIZUKA

IPC: H01L29/66 ,  H01L21/477 ,  H01L29/24 ,  H01L21/02 ,  H01L29/786 ,  H01L29/04

CPC classification number: H01L29/66969 ,  H01L21/02565 ,  H01L21/0262 ,  H01L21/477 ,  H01L27/1156 ,  H01L27/1225 ,  H01L29/045 ,  H01L29/24 ,  H01L29/7869

Abstract: A semiconductor device having a transistor including an oxide semiconductor film is disclosed. In the semiconductor device, the oxide semiconductor film is provided along a trench formed in an insulating layer. The trench includes a lower end corner portion and an upper end corner portion having a curved shape with a curvature radius of longer than or equal to 20 nm and shorter than or equal to 60 nm, and the oxide semiconductor film is provided in contact with a bottom surface, the lower end corner portion, the upper end corner portion, and an inner wall surface of the trench. The oxide semiconductor film includes a crystal having a c-axis substantially perpendicular to a surface at least over the upper end corner portion.

Abstract translation: 公开了一种具有包括氧化物半导体膜的晶体管的半导体器件。 在半导体装置中，沿着形成在绝缘层中的沟槽设置氧化物半导体膜。 沟槽包括具有曲率半径大于或等于20nm且小于或等于60nm的弯曲形状的下端拐角部分和上端拐角部分，并且氧化物半导体膜设置成与 底面，下端角部，上端角部和沟槽的内壁面。 氧化物半导体膜包括至少在上端角部上方具有基本上垂直于表面的c轴的晶体。

公开(公告)号：US20150060849A1

公开(公告)日：2015-03-05

申请号：US14483671

申请日：2014-09-11

Applicant: Semiconductor Energy Laboratory Co., Ltd.

Inventor： Shunpei YAMAZAKI ,  Atsuo ISOBE ,  Toshinari SASAKI

IPC: H01L29/786

CPC classification number: H01L29/7869 ,  H01L27/1218 ,  H01L27/1225

Abstract: To provide a transistor which includes an oxide semiconductor and is capable of operating at high speed or a highly reliable semiconductor device including the transistor, a transistor in which an oxide semiconductor layer including a pair of low-resistance regions and a channel formation region is provided over an electrode layer, which is embedded in a base insulating layer and whose upper surface is at least partly exposed from the base insulating layer, and a wiring layer provided above the oxide semiconductor layer is electrically connected to the electrode layer or a part of a low-resistance region of the oxide semiconductor layer, which overlaps with the electrode layer.

Abstract translation: 为了提供包括氧化物半导体并且能够高速运行的晶体管或包括晶体管的高度可靠的半导体器件，提供了包括一对低电阻区域和沟道形成区域的氧化物半导体层的晶体管 在基底绝缘层上嵌入并且其上表面至少部分地从基底绝缘层露出的电极层上，并且设置在氧化物半导体层上方的布线层电连接到电极层或电极层的一部分 氧化物半导体层的低电阻区域与电极层重叠。

公开(公告)号：US20150053975A1

公开(公告)日：2015-02-26

申请号：US14501965

申请日：2014-09-30

Applicant: Semiconductor Energy Laboratory Co., Ltd.

Inventor： Yuta ENDO ,  Toshinari SASAKI ,  Kosei NODA ,  Mizuho SATO ,  Mitsuhiro ICHIJO ,  Toshiya ENDO

IPC: H01L29/786 ,  H01L29/51 ,  H01L29/24

CPC classification number: H01L29/7869 ,  H01L29/24 ,  H01L29/4908 ,  H01L29/513 ,  H01L29/517 ,  H01L29/518 ,  H01L29/66969 ,  H01L29/78603 ,  H01L29/78606

Abstract: In a transistor having a top-gate structure in which a gate electrode layer overlaps with an oxide semiconductor layer which faints a channel region with a gate insulating layer interposed therebetween, when a large amount of hydrogen is contained in the insulating layer, hydrogen is diffused into the oxide semiconductor layer because the insulating layer is in contact with the oxide semiconductor layer; thus, electric characteristics of the transistor are degraded. An object is to provide a semiconductor device having favorable electric characteristics. An insulating layer in which the concentration of hydrogen is less than 6×1020 atoms/cm3 is used for the insulating layer being in contact with oxide semiconductor layer which forms the channel region. Using the insulating layer, diffusion of hydrogen can be prevented and a semiconductor device having favorable electric characteristics can be provided.

Abstract translation: 在具有栅极结构的晶体管中，栅电极层与其间插入有栅极绝缘层的沟道区域的氧化物半导体层重叠，当绝缘层中含有大量的氢时，氢扩散 由于绝缘层与氧化物半导体层接触，所以进入氧化物半导体层; 因此，晶体管的电特性降低。 本发明的目的是提供一种具有良好电特性的半导体器件。 与形成沟道区域的氧化物半导体层接触的绝缘层使用其氢浓度小于6×1020原子/ cm3的绝缘层。 使用绝缘层，可以防止氢的扩散，并且可以提供具有良好电特性的半导体器件。

公开(公告)号：US20140209901A1

公开(公告)日：2014-07-31

申请号：US14228663

申请日：2014-03-28

Applicant: Semiconductor Energy Laboratory Co., Ltd.

Inventor： Junichiro SAKATA ,  Toshinari SASAKI ,  Miyuki HOSOBA

IPC: H01L29/786

CPC classification number: H01L27/1225 ,  H01L21/02554 ,  H01L21/02565 ,  H01L21/02631 ,  H01L27/1218 ,  H01L27/124 ,  H01L27/127 ,  H01L29/24 ,  H01L29/66969 ,  H01L29/78633 ,  H01L29/78645 ,  H01L29/78648 ,  H01L29/78654 ,  H01L29/7869 ,  H01L29/78696

Abstract: An object is to provide a display device which operates stably with use of a transistor having stable electric characteristics. In manufacture of a display device using transistors in which an oxide semiconductor layer is used for a channel formation region, a gate electrode is further provided over at least a transistor which is applied to a driver circuit. In manufacture of a transistor in which an oxide semiconductor layer is used for a channel formation region, the oxide semiconductor layer is subjected to heat treatment so as to be dehydrated or dehydrogenated; thus, impurities such as moisture existing in an interface between the oxide semiconductor layer and the gate insulating layer provided below and in contact with the oxide semiconductor layer and an interface between the oxide semiconductor layer and a protective insulating layer provided on and in contact with the oxide semiconductor layer can be reduced.

Abstract translation: 目的在于提供一种利用具有稳定电特性的晶体管稳定工作的显示装置。 在使用其中使用氧化物半导体层作为沟道形成区域的晶体管的显示装置的制造中，栅电极进一步设置在至少施加到驱动电路的晶体管上。 在将氧化物半导体层用于沟道形成区域的晶体管的制造中，对氧化物半导体层进行热处理以脱水或脱氢; 因此，存在于氧化物半导体层和栅极绝缘层之间的界面处的杂质，其存在于氧化物半导体层下方并与氧化物半导体层接触，以及氧化物半导体层与设置在该氧化物半导体层上的与保护绝缘层接触的界面 可以减少氧化物半导体层。

公开(公告)号：US20140113687A1

公开(公告)日：2014-04-24

申请号：US14139892

申请日：2013-12-24

Applicant: Semiconductor Energy Laboratory Co., Ltd.

Inventor： Junichiro SAKATA ,  Takashi SHIMAZU ,  Hiroki OHARA ,  Toshinari SASAKI ,  Shunpei YAMAZAKI

IPC: H01L29/786 ,  H04M1/02

CPC classification number: H01L29/78696 ,  C23C14/086 ,  H01L21/02554 ,  H01L21/02565 ,  H01L21/02573 ,  H01L21/02592 ,  H01L21/02631 ,  H01L27/1225 ,  H01L29/7869 ,  H01L29/78693 ,  H04M1/0266

Abstract: A semiconductor device including a thin film transistor which includes an oxide semiconductor layer and has high electric characteristics and reliability. Film deposition is performed using an oxide semiconductor target containing an insulator (an insulating oxide, an insulating nitride, silicon oxynitride, aluminum oxynitride, or the like), typically SiO2, so that the semiconductor device in which the Si-element concentration in the thickness direction of the oxide semiconductor layer has a gradient which increases in accordance with an increase in a distance from a gate electrode is realized.

Abstract translation: 一种包括具有氧化物半导体层并具有高电特性和可靠性的薄膜晶体管的半导体器件。 通常使用包含绝缘体（绝缘氧化物，绝缘氮化物，氮氧化硅，氮氧化铝等）（通常为SiO 2）的氧化物半导体靶进行膜沉积，使得其中Si元素浓度在厚度 氧化物半导体层的方向具有根据与栅电极的距离的增加而增加的梯度。

公开(公告)号：US20140011320A1

公开(公告)日：2014-01-09

申请号：US14022392

申请日：2013-09-10

Applicant: Semiconductor Energy Laboratory Co., Ltd.

Inventor： Toshinari SASAKI ,  Junichiro SAKATA ,  Hiroki OHARA ,  Shunpei YAMAZAKI

IPC: H01L29/66

CPC classification number: H01L21/02664 ,  H01L21/02565 ,  H01L27/1225 ,  H01L29/66765 ,  H01L29/66969 ,  H01L29/78618 ,  H01L29/7869 ,  H01L29/78696

Abstract: An object is to provide a high reliable semiconductor device including a thin film transistor having stable electric characteristics. In a method for manufacturing a semiconductor device including a thin film transistor in which an oxide semiconductor film is used for a semiconductor layer including a channel formation region, heat treatment (which is for dehydration or dehydrogenation) is performed so as to improve the purity of the oxide semiconductor film and reduce impurities such as moisture. Besides impurities such as moisture existing in the oxide semiconductor film, heat treatment causes reduction of impurities such as moisture existing in the gate insulating layer and those in interfaces between the oxide semiconductor film and films which are provided over and below the oxide semiconductor film and are in contact with the oxide semiconductor film.

公开(公告)号：US20140011319A1

公开(公告)日：2014-01-09

申请号：US14013383

申请日：2013-08-29

Applicant: Semiconductor Energy Laboratory Co., Ltd.

Inventor： Yuta ENDO ,  Toshinari SASAKI ,  Kosei NODA ,  Mizuho SATO

IPC: H01L29/66

CPC classification number: H01L21/02554 ,  H01L21/02488 ,  H01L21/02664 ,  H01L27/1225 ,  H01L29/4908 ,  H01L29/66969 ,  H01L29/78606 ,  H01L29/7869

Abstract: An insulating layer containing a silicon peroxide radical is used as an insulating layer in contact with an oxide semiconductor layer for forming a channel. Oxygen is released from the insulating layer, whereby oxygen deficiency in the oxide semiconductor layer and an interface state between the insulating layer and the oxide semiconductor layer can be reduced. Accordingly, a semiconductor device where reliability is high and variation in electric characteristics is small can be manufactured.

Abstract translation: 使用含有硅氧化物自由基的绝缘层作为与用于形成沟道的氧化物半导体层接触的绝缘层。 氧从绝缘层释放，由此可以减少氧化物半导体层中的氧缺乏和绝缘层与氧化物半导体层之间的界面状态。 因此，可以制造可靠性高，电特性变化小的半导体装置。