公开(公告)号：US20200343641A1

公开(公告)日：2020-10-29

申请号：US16928289

申请日：2020-07-14

Applicant: Siliconware Precision Industries Co., Ltd.

Inventor： Han-Hung Chen ,  Chun-Yi Huang ,  Chang-Fu Lin ,  Rung-Jeng Lin ,  Kuo-Hua Yu

IPC: H01Q9/04 ,  H05K1/14 ,  H05K1/18 ,  H05K1/11 ,  H05K1/02 ,  H01Q1/22 ,  H05K3/36

Abstract: An electronic package and a method for fabricating the same are provided. A resist layer and a support are formed on a first substrate having a first antenna installation area. A second substrate having a second antenna installation area is laminated on the resist layer and the support. The resist layer is then removed. The support keeps the first substrate apart from the second substrate at a distance to ensure that the antenna transmission between the first antenna installation area and the second antenna installation area can function normally.

公开(公告)号：US10763237B2

公开(公告)日：2020-09-01

申请号：US16691477

申请日：2019-11-21

Applicant: Siliconware Precision Industries Co., Ltd.

Inventor： Yu-Min Lo ,  Chee-Key Chung ,  Chang-Fu Lin ,  Kuo-Hua Yu ,  Hsiang-Hua Huang

IPC: H01L21/44 ,  H01L21/48 ,  H01L21/50 ,  H01L23/00

Abstract: The present disclosure provides a method for manufacturing an electronic package, with an electronic component bonded to a carrier structure by means of solder tips formed on conductive bumps, wherein the solder tips do not require a reflow process to be in contact with the carrier structure, thereby allowing the conductive bumps to have an adequate amount of solder tips formed thereon and thus precluding problems such as cracking and collapsing of the solder tips.

公开(公告)号：US20180130774A1

公开(公告)日：2018-05-10

申请号：US15434824

申请日：2017-02-16

Applicant: Siliconware Precision Industries Co., Ltd.

Inventor： Chang-Fu Lin ,  Chin-Tsai Yao ,  Kuo-Hua Yu ,  Fu-Tang Huang

IPC: H01L25/065 ,  H01L23/31

Abstract: A package stack structure is provided, including a first substrate, a second substrate stacked on the first substrate, and an encapsulant formed between the first substrate and the second substrate. A through hole is formed to penetrate the second substrate and allow the encapsulant to be filled therein, thereby increasing the contact area and hence strengthening the bonding between the encapsulant and the second substrate.

公开(公告)号：US11984379B2

公开(公告)日：2024-05-14

申请号：US17370207

申请日：2021-07-08

Applicant: SILICONWARE PRECISION INDUSTRIES CO., LTD.

Inventor： Yu-Lung Huang ,  Chih-Ming Huang ,  Kuo-Hua Yu ,  Chang-Fu Lin

IPC: H01L23/367 ,  H01L21/48 ,  H01L23/373 ,  H01L23/42 ,  H01L23/00

CPC classification number: H01L23/3675 ,  H01L21/4871 ,  H01L23/3736 ,  H01L23/42 ,  H01L24/73 ,  H01L2224/73204

Abstract: Provided is an electronic package, in which a heat dissipating body is formed on an electronic device and is combined with a heat sink so that the electronic device, the heat dissipating body and the heat sink form a receiving space, and a heat dissipating material is formed in the receiving space and in contact with the heat sink and the electronic device, where a fluid regulating space is formed between the heat dissipating material and the heat dissipating body and is used as a volume regulating space for the heat dissipating material during thermal expansion and contraction.

公开(公告)号：US20220399245A1

公开(公告)日：2022-12-15

申请号：US17370207

申请日：2021-07-08

Applicant: SILICONWARE PRECISION INDUSTRIES CO., LTD.

Inventor： Yu-Lung Huang ,  Chih-Ming Huang ,  Kuo-Hua Yu ,  Chang-Fu Lin

IPC: H01L23/367 ,  H01L23/373 ,  H01L23/42 ,  H01L21/48

Abstract: Provided is an electronic package, in which a heat dissipating body is formed on an electronic device and is combined with a heat sink so that the electronic device, the heat dissipating body and the heat sink form a receiving space, and a heat dissipating material is formed in the receiving space and in contact with the heat sink and the electronic device, where a fluid regulating space is formed between the heat dissipating material and the heat dissipating body and is used as a volume regulating space for the heat dissipating material during thermal expansion and contraction.

公开(公告)号：US20200043908A1

公开(公告)日：2020-02-06

申请号：US16164416

申请日：2018-10-18

Applicant: Siliconware Precision Industries Co., Ltd.

Inventor： Chee-Key Chung ,  Chang-Fu Lin ,  Han-Hung Chen ,  Jen-Chieh Hsiao ,  Rung-Jeng Lin ,  Kuo-Hua Yu ,  Hong-Da Chang

IPC: H01L25/00 ,  H01L23/538 ,  H01L21/48 ,  H01L25/10 ,  H01L21/683 ,  H01L21/56 ,  H01L23/00

Abstract: A package stacked structure and a method for fabricating the same are provided. The method includes providing a wiring structure disposed with a carrier and a carrier structure provided with an electronic component. The wiring structure is bonded to the carrier structure via a plurality of conductive elements. An encapsulating layer is formed between the wiring structure and the carrier structure and encapsulates the conductive elements and the electronic component. The carrier is then removed. With the arrangement of the carrier, the structural strength of the wiring structure is improved, and warpage of the wiring structure is prevented before stacking the wiring structure onto the carrier structure.

公开(公告)号：US10522500B2

公开(公告)日：2019-12-31

申请号：US15980255

申请日：2018-05-15

Applicant: Siliconware Precision Industries Co., Ltd.

Inventor： Yu-Min Lo ,  Chee-Key Chung ,  Chang-Fu Lin ,  Kuo-Hua Yu ,  Hsiang-Hua Huang

IPC: H01L21/44 ,  H01L21/48 ,  H01L21/50 ,  H01L23/00

Abstract: The present disclosure provides a method for manufacturing an electronic package, with an electronic component bonded to a carrier structure by means of solder tips formed on conductive bumps, wherein the solder tips do not require a reflow process to be in contact with the carrier structure, thereby allowing the conductive bumps to have an adequate amount of solder tips formed thereon and thus precluding problems such as cracking and collapsing of the solder tips.

公开(公告)号：US20180061810A1

公开(公告)日：2018-03-01

申请号：US15372638

申请日：2016-12-08

Applicant: Siliconware Precision Industries Co., Ltd.

Inventor： Chang-Fu Lin ,  Chin-Tsai Yao ,  Kuo-Hua Yu ,  Fu-Tang Huang

IPC: H01L25/065 ,  H01L23/00 ,  H01L23/31 ,  H01L25/00 ,  H01L21/56

CPC classification number: H01L25/0657 ,  H01L21/563 ,  H01L23/3128 ,  H01L23/49811 ,  H01L23/5385 ,  H01L23/5389 ,  H01L24/09 ,  H01L24/16 ,  H01L24/17 ,  H01L24/32 ,  H01L24/33 ,  H01L24/48 ,  H01L24/73 ,  H01L24/81 ,  H01L24/92 ,  H01L25/105 ,  H01L25/50 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/13541 ,  H01L2224/16013 ,  H01L2224/16237 ,  H01L2224/1703 ,  H01L2224/17055 ,  H01L2224/17132 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2224/92225 ,  H01L2224/97 ,  H01L2225/0651 ,  H01L2225/06517 ,  H01L2225/0652 ,  H01L2225/06572 ,  H01L2225/06589 ,  H01L2225/1023 ,  H01L2225/1041 ,  H01L2225/1058 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/3512 ,  H01L2224/81 ,  H01L2224/83 ,  H01L2924/00012 ,  H01L2924/00014 ,  H01L2924/00

Abstract: An electronic package is provided, which includes: a first substrate; a first electronic component disposed on the first substrate; a second substrate stacked on the first substrate through a plurality of first conductive elements and a plurality of second conductive elements and bonded to the first electronic component through a bonding layer; and a first encapsulant formed between the first substrate and the second substrate. The first conductive elements are different in structure from the second conductive elements so as to prevent a mold flow of the first encapsulant from generating an upward pushing force during a molding process and hence avoid cracking of the second substrate. The present disclosure further provides a method for fabricating the electronic package.

公开(公告)号：US12132003B2

公开(公告)日：2024-10-29

申请号：US17568913

申请日：2022-01-05

Applicant: SILICONWARE PRECISION INDUSTRIES CO., LTD.

Inventor： You-Chen Lin ,  Yu-Min Lo ,  Kuo-Hua Yu ,  Jun-Hao Feng

IPC: H01L23/538 ,  H01L21/48 ,  H01L23/48 ,  H01L25/065

CPC classification number: H01L23/5383 ,  H01L21/4857 ,  H01L21/486 ,  H01L23/5381 ,  H01L23/481 ,  H01L25/0655

Abstract: An electronic package is provided and includes a protection layer formed on the electronic structure having a plurality of conductors to cover the plurality of conductors, a dielectric layer having a plurality of grooves to enable the electronic structure to be bonded onto one side of the dielectric layer with the protection layer thereon such that each of the plurality of conductors is correspondingly accommodated in each of the plurality of grooves, and a plurality of conductive components disposed on another side of the dielectric layer. Accordingly, the design of the grooves is used to correspond to the high and low surfaces of the electronic structure such that the problem of poor manufacturing process can be avoided.

公开(公告)号：US20230223316A1

公开(公告)日：2023-07-13

申请号：US17956566

申请日：2022-09-29

Applicant: SILICONWARE PRECISION INDUSTRIES CO., LTD.

Inventor： Tai-Shin Renn ,  Kuo-Hua Yu ,  Yu-Min Lo ,  Wei-Shen Hung

IPC: H01L23/367 ,  H01L23/00 ,  H01L21/48 ,  H01L25/10 ,  H01L21/56 ,  H01L23/498

CPC classification number: H01L23/3677 ,  H01L24/16 ,  H01L24/32 ,  H01L24/73 ,  H01L21/4853 ,  H01L25/105 ,  H01L21/568 ,  H01L21/4882 ,  H01L23/49816 ,  H01L23/49838 ,  H01L23/49833 ,  H01L2924/3511 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2225/1094 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204

Abstract: An electronic package is provided, in which an electronic element is disposed on an upper side of a circuit structure, a package layer covers the electronic element, and an action structure is embedded in the package layer, so that the action structure is exposed from a surface of the package layer, and then a bonding element is disposed on a lower side of the circuit structure and corresponding to the position of the action structure, so as to form a thermal conduction between the bonding element and the action structure. Therefore, a laser can transfer heat energy to the bonding element via the action structure, so that a solder material on the bonding element can be reflowed.