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公开(公告)号：US09833806B2
公开(公告)日：2017-12-05
申请号：US14976434
申请日：2015-12-21
Applicant: STMicroelectronics, Inc. , STMICROELECTRONICS S.R.L. , STMicroelectronics International N.V.
Inventor： Simon Dodd , Joe Scheffelin , Dave Hunt , Matt Giere , Dana Gruenbacher , Faiz Sherman
CPC classification number: B05B17/0607 , B05B17/0638 , B05B17/0684 , B41J2/14016 , B41J2/14024 , B41J2/14056 , B41J2/14072 , B41J2/1433 , B41J2/1601 , B41J2/1632 , B41J2/175 , B41J2/17526 , B41J2/1753 , B41J2002/14338 , B41J2002/14491 , H05K1/0212 , H05K1/111 , H05K1/181 , Y10T29/49119
Abstract: The present disclosure is directed to a microfluidic die that includes a plurality of heaters above a substrate, a plurality of chambers and nozzles above the heaters, a plurality of first contacts coupled to the heaters, and a plurality of second contacts coupled to the heaters. The plurality of second contacts are coupled to each other and coupled to ground. The die includes a plurality of contact pads, a first signal line coupled to the plurality of second contacts and to a first one of the plurality of contact pads, and a plurality of second signal lines, each second signal line being coupled to one of the plurality of first contacts, groups of the second signal lines being coupled together to drive a group of the plurality of heaters with a single signal, each group of the second signal lines being coupled to a remaining one of the plurality of contact pads.
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公开(公告)号：US09358567B2
公开(公告)日：2016-06-07
申请号：US14310886
申请日：2014-06-20
Applicant: STMicroelectronics, Inc.
Inventor： Simon Dodd , Joe Scheffelin , Dave Hunt , Matt Giere , Dana Gruenbacher , Faiz Sherman
CPC classification number: B05B17/0607 , B05B17/0638 , B05B17/0684 , B41J2/14016 , B41J2/14024 , B41J2/14056 , B41J2/14072 , B41J2/1433 , B41J2/1601 , B41J2/1632 , B41J2/175 , B41J2/17526 , B41J2/1753 , B41J2002/14338 , B41J2002/14491 , H05K1/0212 , H05K1/111 , H05K1/181 , Y10T29/49119
Abstract: The present disclosure is directed to a microfluidic die that includes a plurality of heaters above a substrate, a plurality of chambers and nozzles above the heaters, a plurality of first contacts coupled to the heaters, and a plurality of second contacts coupled to the heaters. The plurality of second contacts are coupled to each other and coupled to ground. The die includes a plurality of contact pads, a first signal line coupled to the plurality of second contacts and to a first one of the plurality of contact pads, and a plurality of second signal lines, each second signal line being coupled to one of the plurality of first contacts, groups of the second signal lines being coupled together to drive a group of the plurality of heaters with a single signal, each group of the second signal lines being coupled to a remaining one of the plurality of contact pads.
Abstract translation: 本公开涉及一种微流体管芯，其包括在基底上方的多个加热器，加热器上方的多个腔室和喷嘴，联接到加热器的多个第一触头以及耦合到加热器的多个第二触点。 多个第二触点彼此耦合并耦合到地。 芯片包括多个接触焊盘，耦合到多个第二触点和多个接触焊盘中的第一触点的第一信号线以及多个第二信号线，每个第二信号线耦合到 多个第一触点，第二信号线的组被耦合在一起以用单个信号驱动一组多个加热器，每组第二信号线耦合到多个接触垫中的剩余的一个。
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公开(公告)号：US10759168B2
公开(公告)日：2020-09-01
申请号：US16357077
申请日：2019-03-18
Applicant: STMICROELECTRONICS, INC. , STMICROELECTRONICS INTERNATIONAL N.V. , STMICROELECTRONICS S.R.L.
Inventor： Simon Dodd , David S. Hunt , Joseph Edward Scheffelin , Dana Gruenbacher , Stefan H. Hollinger , Uwe Schober , Peter Janouch
Abstract: The present disclosure provides supports for microfluidic die that allow for nozzles of the microfluidic die to be on a different plane or face a different direction from electrical contacts on the same support. This includes a rigid support having electrical contacts on a different side of the rigid support with respect to a direction of ejection of the nozzles, and a semi-flexible support or semi-rigid support that allow the electrical contacts to be moved with respect to a direction of ejection of the nozzles. The semi-flexible and semi-rigid supports allow the die to be up to and beyond a 90 degree angle with respect to a plane of the electrical contacts. The different supports allow for a variety of positions of the microfluidic die with respect to a position of the electrical contacts.
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公开(公告)号：US10543504B2
公开(公告)日：2020-01-28
申请号：US15636491
申请日：2017-06-28
Applicant: STMicroelectronics, Inc. , STMICROELECTRONICS S.R.L. , STMicroelectronics International N.V.
Inventor： Simon Dodd , Joe Scheffelin , Dave Hunt , Matt Giere , Dana Gruenbacher , Faiz Sherman
Abstract: A microfluidic die is disclosed that includes a plurality of heaters above a substrate, a plurality of chambers and nozzles above the heaters, a plurality of first contacts coupled to the heaters, and a plurality of second contacts coupled to the heaters. The plurality of second contacts are coupled to each other and coupled to ground. The die includes a plurality of contact pads, a first signal line coupled to the plurality of second contacts and to a first one of the plurality of contact pads, and a plurality of second signal lines, each second signal line being coupled to one of the plurality of first contacts, groups of the second signal lines being coupled together to drive a group of the plurality of heaters with a single signal, each group of the second signal lines being coupled to a remaining one of the plurality of contact pads.
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公开(公告)号：US10272684B2
公开(公告)日：2019-04-30
申请号：US15253601
申请日：2016-08-31
Applicant: STMICROELECTRONICS, INC. , STMICROELECTRONICS INTERNATIONAL N.V. , STMICROELECTRONICS S.R.L.
Inventor： Simon Dodd , David S. Hunt , Joseph Edward Scheffelin , Dana Gruenbacher , Stefan H. Hollinger , Uwe Schober , Peter Janouch
Abstract: The present disclosure provides supports for microfluidic die that allow for nozzles of the microfluidic die to be on a different plane or face a different direction from electrical contacts on the same support. This includes a rigid support having electrical contacts on a different side of the rigid support with respect to a direction of ejection of the nozzles, and a semi-flexible support or semi-rigid support that allow the electrical contacts to be moved with respect to a direction of ejection of the nozzles. The semi-flexible and semi-rigid supports allow the die to be up to and beyond a 90 degree angle with respect to a plane of the electrical contacts. The different supports allow for a variety of positions of the microfluidic die with respect to a position of the electrical contacts.
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Patent Agency Ranking
公开(公告)号：US10264667B2
公开(公告)日：2019-04-16
申请号：US14310601
申请日：2014-06-20
Applicant: STMicroelectronics, Inc. , STMicroelectronics S.R.L. , STMicroelectronics International N.V.
Inventor： Simon Dodd , Joe Scheffelin , Dave Hunt , Steve Bush , Faiz Sherman
Abstract: The present disclosure is directed to a system that is configured to eject fluid vertically away from a thermal microfluidic die for use with scented oils or other fluids. The die is coupled to a rigid planar support board that separates the die from a reservoir of the fluid. The support board includes an opening that is lined with an inert liner that protects an interior surface of the support board from the fluid. The support board includes contact to an external power supply and contacts to the die on a first surface. The die is coupled to this first surface such that the second surface remains free of electrical connections.
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公开(公告)号：US09357635B2
公开(公告)日：2016-05-31
申请号：US14981056
申请日：2015-12-28
Applicant: STMicroelectronics, Inc. , STMicroelectronics S.r.l. , STMicroelectronics Asia Pacific Pte Ltd
Inventor： Simon Dodd , Joe Scheffelin , Dana Gruenbacher , Roberto Brioschi , Teck Khim Neo , Dave Hunt , Faiz Sherman
IPC: B41J2/14 , B41J2/175 , B05B1/14 , B32B38/04 , B32B38/14 , B32B37/00 , H05K1/02 , H05K1/09 , H05K3/30
CPC classification number: B41J2/1623 , B05B1/14 , B05B11/0054 , B05B15/40 , B41J2/14024 , B41J2/14145 , B41J2/1433 , B41J2/162 , H01L24/27 , H01L24/29 , H01L24/32 , H01L24/48 , H01L24/83 , H01L24/85 , H01L24/97 , H01L41/1132 , H01L2224/2732 , H01L2224/29011 , H01L2224/29013 , H01L2224/2919 , H01L2224/32225 , H01L2224/48096 , H01L2224/48097 , H01L2224/48106 , H01L2224/48227 , H01L2224/73265 , H01L2224/83192 , H01L2224/838 , H01L2224/83862 , H01L2224/83874 , H01L2224/92247 , H01L2224/97 , H01L2924/00014 , H01L2924/19106 , H05K1/0272 , H05K1/09 , H05K1/181 , H05K3/305 , H05K2201/10083 , H05K2201/10515 , H05K2201/10545 , Y02P70/613 , Y10T156/1089 , H01L2224/83 , H01L2224/85 , H01L2224/45099 , H01L2924/00
Abstract: Embodiments are directed to microfluidic refill cartridges and methods of assembling same. The microfluidic refill cartridges include a microfluidic delivery member that includes a filter for filtering fluid passed therethrough. The filter may be configured to block particles above a threshold size to prevent blockage in the nozzles. For instances, particles having a dimension that is larger than the diameter of the nozzles can block or reduce fluid flow through the nozzle.
Abstract translation: 实施例涉及微流体补充盒及其组装方法。 微流体补充盒包括微流体递送构件，其包括用于过滤通过其中的流体的过滤器。 过滤器可以被配置为阻挡高于阈值尺寸的颗粒以防止喷嘴中的堵塞。 例如，具有大于喷嘴直径的尺寸的颗粒可阻挡或减少通过喷嘴的流体流动。
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公开(公告)号：US20160107446A1
公开(公告)日：2016-04-21
申请号：US14981056
申请日：2015-12-28
Applicant: STMicroelectronics, Inc. , STMicroelectronics S.r.l. , STMicroelectronics Asia Pacific Pte Ltd
Inventor： Simon Dodd , Joe Scheffelin , Dana Gruenbacher , Roberto Brioschi , Teck Khim Neo , Dave Hunt , Faiz Sherman
IPC: B41J2/16
CPC classification number: B41J2/1623 , B05B1/14 , B05B11/0054 , B05B15/40 , B41J2/14024 , B41J2/14145 , B41J2/1433 , B41J2/162 , H01L24/27 , H01L24/29 , H01L24/32 , H01L24/48 , H01L24/83 , H01L24/85 , H01L24/97 , H01L41/1132 , H01L2224/2732 , H01L2224/29011 , H01L2224/29013 , H01L2224/2919 , H01L2224/32225 , H01L2224/48096 , H01L2224/48097 , H01L2224/48106 , H01L2224/48227 , H01L2224/73265 , H01L2224/83192 , H01L2224/838 , H01L2224/83862 , H01L2224/83874 , H01L2224/92247 , H01L2224/97 , H01L2924/00014 , H01L2924/19106 , H05K1/0272 , H05K1/09 , H05K1/181 , H05K3/305 , H05K2201/10083 , H05K2201/10515 , H05K2201/10545 , Y02P70/613 , Y10T156/1089 , H01L2224/83 , H01L2224/85 , H01L2224/45099 , H01L2924/00
Abstract: Embodiments are directed to microfluidic refill cartridges and methods of assembling same. The microfluidic refill cartridges include a microfluidic delivery member that includes a filter for filtering fluid passed therethrough. The filter may be configured to block particles above a threshold size to prevent blockage in the nozzles. For instances, particles having a dimension that is larger than the diameter of the nozzles can block or reduce fluid flow through the nozzle.
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公开(公告)号：US20160107443A1
公开(公告)日：2016-04-21
申请号：US14976434
申请日：2015-12-21
Applicant: STMicroelectronics, Inc. , STMICROELECTRONICS S.R.L. , STMicroelectronics International N.V.
Inventor： Simon Dodd , Joe Scheffelin , Dave Hunt , Matt Giere , Dana GRUENBACHER , Faiz SHERMAN
IPC: B41J2/14
CPC classification number: B05B17/0607 , B05B17/0638 , B05B17/0684 , B41J2/14016 , B41J2/14024 , B41J2/14056 , B41J2/14072 , B41J2/1433 , B41J2/1601 , B41J2/1632 , B41J2/175 , B41J2/17526 , B41J2/1753 , B41J2002/14338 , B41J2002/14491 , H05K1/0212 , H05K1/111 , H05K1/181 , Y10T29/49119
Abstract: The present disclosure is directed to a microfluidic die that includes a plurality of heaters above a substrate, a plurality of chambers and nozzles above the heaters, a plurality of first contacts coupled to the heaters, and a plurality of second contacts coupled to the heaters. The plurality of second contacts are coupled to each other and coupled to ground. The die includes a plurality of contact pads, a first signal line coupled to the plurality of second contacts and to a first one of the plurality of contact pads, and a plurality of second signal lines, each second signal line being coupled to one of the plurality of first contacts, groups of the second signal lines being coupled together to drive a group of the plurality of heaters with a single signal, each group of the second signal lines being coupled to a remaining one of the plurality of contact pads.
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公开(公告)号：US20160101429A1
公开(公告)日：2016-04-14
申请号：US14975200
申请日：2015-12-18
Applicant: STMicroelectronics, Inc.
Inventor： Simon Dodd , Joseph Edward Scheffelin , Dave S. Hunt , Timothy James HOEKSTRA , Faiz SHERMAN , Stephan Gary Bush
CPC classification number: A61L9/03 , A61L2/00 , A61L9/00 , B05B17/0684
Abstract: One or more embodiments are directed to a microfluidic delivery system that dispenses a fluid. The microfluidic delivery system may be provided in a variety of orientations. In one embodiment, the microfluidic delivery system is vertical so that fluid being expelled opposes gravity. In another embodiment, the microfluidic delivery system is orientated sideways so that fluid being expelled has a horizontal component. In yet another embodiment, the microfluidic delivery system faces downward.
Abstract translation: 一个或多个实施方案涉及分配流体的微流体递送系统。 微流体递送系统可以以各种方向提供。 在一个实施例中，微流体输送系统是垂直的，使得被排出的流体与重力相反。 在另一个实施方案中，微流体递送系统侧向定向，使得被排出的流体具有水平分量。 在另一个实施方案中，微流体递送系统面向下。
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