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公开(公告)号：US20180147815A1
公开(公告)日：2018-05-31
申请号：US15576909
申请日：2016-06-01
Inventor： Kayo HASHIZUME , Yoshio OKA , Takashi KASUGA , Jinjoo PARK , Hiroshi UEDA
IPC: B32B15/088 , H05K3/00 , H05K3/38 , H05K1/02 , B32B27/34
Abstract: A substrate for a printed circuit board according to an embodiment of the present invention includes a resin film and a metal layer stacked on at least one of surfaces of the resin film. An average diffusion depth of a main metal of the metal layer in the resin film is 100 nm or less after a weather resistance test in which the substrate is held at 150° C. for seven days. The average diffusion depth is preferably 80 nm or less before the weather resistance test.
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公开(公告)号：US20170347464A1
公开(公告)日：2017-11-30
申请号：US15536809
申请日：2015-12-21
Inventor： Kayo HASHIZUME , Yoshio OKA , Takashi KASUGA , Jinjoo PARK , Kousuke MIURA , Hiroshi UEDA
CPC classification number: H05K1/092 , B32B15/08 , B32B15/088 , H05K1/0298 , H05K1/03 , H05K1/05 , H05K1/09 , H05K3/1283 , H05K3/182 , H05K3/24 , H05K3/38 , H05K3/381 , H05K2201/0154 , H05K2203/025 , H05K2203/095
Abstract: An object is to provide a substrate for a printed wiring board that has good circuit formability while maintaining adhesion strength between a conductive layer (2) and a base film (1). The substrate includes a base film having an insulating property (1) and a conductive layer (2) formed on at least one surface of the base film (1). The maximum height Sz, which is defined in ISO25178, of the surface of the base film (1) is 0.05 μm or more and less than 0.9 μm.
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13.发明申请公开(公告)号：US20170347449A1
公开(公告)日：2017-11-30
申请号：US15536954
申请日：2015-12-18
Inventor： Motohiko SUGIURA , Takashi KASUGA , Yoshio OKA , Shigeaki UEMURA , Jinjoo PARK , Hiroshi UEDA , Kousuke MIURA
CPC classification number: H05K1/097 , B82Y30/00 , B82Y40/00 , H05K1/0298 , H05K1/03 , H05K1/05 , H05K1/09 , H05K3/24 , H05K3/38 , H05K3/388 , H05K2201/0209 , H05K2201/0257 , H05K2201/0266 , H05K2201/0269
Abstract: A substrate for a printed circuit board according to an embodiment of the present invention includes a base film having an insulating property, and a metal layer formed on at least one surface side of the base film. In the substrate for a printed circuit board, a plurality of fine particles are disposed between the base film and the metal layer, and the fine particles are formed of a metal the same as a main metal of the metal layer or formed of a metal compound of the main metal. The fine particles preferably have an average particle size of 0.1 nm or more and 20 nm or less. The fine particles are preferably formed of a metal oxide or a metal hydroxide. The fine particles are preferably present between the base film and the metal layer so as to form a layer. The metal layer preferably includes a metal grain layer formed by firing metal nanoparticles.
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14.发明申请公开(公告)号：US20170127516A1
公开(公告)日：2017-05-04
申请号：US15127165
申请日：2015-03-19
Inventor： Takashi KASUGA , Yoshio OKA , Shigeyoshi NAKAYAMA , Jinjoo PARK , Sumito UEHARA , Kousuke MIURA , Hiroshi UEDA
CPC classification number: H05K1/092 , H05K1/05 , H05K3/022 , H05K3/108 , H05K3/38 , H05K3/384 , H05K2201/0154 , H05K2201/0257 , H05K2203/0709 , H05K2203/072
Abstract: A substrate for a printed circuit board includes a base film having an insulating property; a first conductive layer formed on at least one of surfaces of the base film by application of a conductive ink containing metal particles; and a second conductive layer formed, by plating, on a surface of the first conductive layer, the surface being on a side opposite to the base film, wherein a region near an interface between the base film and the first conductive layer contains a metal oxide species based on a metal of the metal particles and a metal hydroxide species based on the metal of the metal particles, the metal oxide species in the region near the interface between the base film and the first conductive layer has a mass per unit area of 0.1 μg/cm2 or more and 10 μg/cm2 or less, and a mass ratio of the metal oxide species to the metal hydroxide species is 0.1 or more.
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公开(公告)号：US20250031299A1
公开(公告)日：2025-01-23
申请号：US18711599
申请日：2022-11-22
Inventor： Shun IGARASHI , Ichiro KUWAYAMA , Suguru YAMAGISHI , Hiroshi UEDA , Satoshi KIYA
Abstract: A printed wiring board includes: a first insulating layer having a first main surface and a second main surface opposite to the first main surface; a first wire pattern, a second wire pattern, and a first ground pattern that are disposed on the second main surface and extend along a first direction in a plan view; a second ground pattern disposed on the first main surface; an adhesive layer disposed on the second main surface so as to cover the first wire pattern, the second wire pattern, and the first ground pattern; a second insulating layer disposed on the adhesive layer and having a third main surface facing the adhesive layer and a fourth main surface opposite to the third main surface; a third ground pattern disposed on the fourth main surface; and a first conductor layer and a second conductor layer.
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Patent Agency Ranking
公开(公告)号：US20250016909A1
公开(公告)日：2025-01-09
申请号：US18711596
申请日：2022-11-22
Inventor： Shun IGARASHI , Ichiro KUWAYAMA , Suguru YAMAGISHI , Hiroshi UEDA , Satoshi KIYA
Abstract: A printed wiring board includes: a first insulating layer having a first main surface and a second main surface opposite to the first main surface; a first wire pattern, a second wire pattern and a first ground pattern disposed on the second main surface and extending along a first direction in a plan view; a second ground pattern disposed on the first main surface; an adhesive layer disposed on the second main surface so as to cover the first wire pattern, the second wire pattern and the first ground pattern; a second insulating layer disposed on the adhesive layer and having a third main surface facing the adhesive layer side and a fourth main surface opposite to the third main surface; a third ground pattern disposed on the fourth main surface; and a first conductor layer.
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公开(公告)号：US20200045814A1
公开(公告)日：2020-02-06
申请号：US16341137
申请日：2017-10-05
Applicant: SUMITOMO ELECTRIC PRINTED CIRCUITS, INC.
Inventor： Kohei OKAMOTO , Yoshihito YAMAGUCHI , Kousuke MIURA , Hiroshi UEDA , Atsushi KIMURA
Abstract: A printed circuit board according to an embodiment of the present invention includes a base film having an insulating property, a conductive pattern that is stacked on at least one surface side of the base film and that includes a plurality of wiring portions arranged adjacent to one another, and an insulating layer that covers outer surfaces of the base film and the conductive pattern. The plurality of wiring portions have an average spacing of 1 μm or more and 20 μm or less and an average height of 30 μm or more and 120 μm or less. A filling area ratio of the insulating layer between the plurality of wiring portions adjacent to one another in sectional view is 95% or more.
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公开(公告)号：US20200022262A1
公开(公告)日：2020-01-16
申请号：US16495217
申请日：2017-12-22
Inventor： Kohei OKAMOTO , Kousuke MIURA , Hiroshi UEDA , Shoichiro SAKAI , Maki IKEBE
Abstract: A printed wiring board includes a base film having insulation properties and a conductive pattern including multiple wiring portions laminated so as to run on at least one surface of the base film, wherein each wiring portion includes a first conductive portion and a second conductive portion coating an outer surface of the first conductive portion, wherein an average width of each wiring portion is 10 μm or greater to 50 μm or smaller, and an average thickness of the second conductive portion is 1 μm or greater to smaller than 8.5 μm. A method for manufacturing a printed wiring board includes a first conductive portion forming step of forming a first conductive portion forming each wiring portion by plating an opening of the resist pattern on the conductive foundation layer, a conductive foundation layer removing step, and a second conductive portion coating step.
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19.发明申请公开(公告)号：US20170290150A1
公开(公告)日：2017-10-05
申请号：US15505619
申请日：2015-09-08
Inventor： Takashi KASUGA , Yoshio OKA , Shigeaki UEMURA , Shigeyoshi NAKAYAMA , Jinjoo PARK , Sumito UEHARA , Hiroshi UEDA , Kousuke MIURA
CPC classification number: H05K1/092 , B22F1/0018 , B22F1/0059 , B22F3/16 , B22F7/064 , B22F2998/10 , B22F2999/00 , C09D11/037 , C09D11/10 , C09D11/52 , C23C18/1653 , C23C18/1692 , C23C18/1879 , C23C18/2033 , C23C18/208 , C23C18/2086 , C23C18/30 , C23C18/31 , C23C18/32 , C23C18/405 , C23C18/42 , H05K1/097 , H05K3/02 , H05K3/022 , H05K3/108 , H05K3/18 , H05K3/381 , H05K3/4661 , H05K2201/032 , H05K2203/0703 , H05K2203/1105 , C22C1/0425 , B22F7/08 , B22F1/0074 , C23C18/00 , B22F2003/248 , C25D7/00
Abstract: The substrate for a printed circuit board according to an embodiment of the present invention includes a base film having insulating properties, and a metal layer stacked on at least one surface of the base film, in which the base film includes a portion where a transition metal in group 10 of the periodic table is present. The transition metal in group 10 is preferably nickel or palladium. The portion where the transition metal in group 10 is present preferably includes a region having an average thickness of 500 nm and extending from an interface with the metal layer.
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公开(公告)号：US20210392754A1
公开(公告)日：2021-12-16
申请号：US17446333
申请日：2021-08-30
Inventor： Kohei OKAMOTO , Kousuke MIURA , Hiroshi UEDA , Shoichiro SAKAI , Maki IKEBE
Abstract: A printed wiring board according to as aspect of the present invention includes a base film having insulation properties and a conductive pattern including multiple wiring portions laminated, the conductive pattern running on at least one surface of the base film, wherein each wiring portion includes a first conductive portion and a second conductive portion coating an outer surface of the first conductive portion, wherein an average width of each wiring portion is 10 μm or greater to 50 μm or smaller, and an average thickness of the second conductive portion is 1 μm or greater to smaller than 8.5 μm.
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