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11.发明申请公开(公告)号：US20180015547A1
公开(公告)日：2018-01-18
申请号：US15546093
申请日：2016-01-26
Inventor： Issei OKADA , Yoshio OKA , Takashi KASUGA , Yasuhiro OKUDA , Jinjoo PARK , Kousuke MIURA , Hiroshi UEDA
CPC classification number: B22F9/24 , B05D3/0254 , B22F1/00 , B22F7/04 , B22F2301/10 , B22F2304/05 , C22C9/00 , H01B1/00 , H01B1/22 , H01B5/00 , H01B5/14 , H01B13/00 , H05K1/092
Abstract: An object of the present invention is to provide a metal powder and an ink with which a sintered body having good flexibility can be formed, and a sintered body having good flexibility. A metal powder according to an embodiment of the present invention has a mean particle size D50BET of 1 nm or more and 200 nm or less as calculated by a BET method, a mean crystallite size DCryst of 20 nm or less as determined by an X-ray analysis, and a ratio (DCryst/D50BET) of the mean crystallite size DCryst to the mean particle size D50BET of less than 0.4.
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12.发明申请公开(公告)号：US20170135206A1
公开(公告)日：2017-05-11
申请号：US15319997
申请日：2015-06-24
Applicant: SUMITOMO ELECTRIC PRINTED CIRCUITS, INC.
Inventor： Hiroshi UEDA , Kousuke MIURA
Abstract: A printed circuit board according to an embodiment of the present invention includes a base film having an insulating property, and a conductive pattern formed on at least one of surfaces of the base film, wherein at least a portion of the conductive pattern includes a core body, and a shrink layer formed by plating on an outer surface of the core body. The portion of the conductive pattern preferably has a striped configuration or a spiral configuration. The portion of the conductive pattern preferably has an average circuit gap width of 30 μm or less. The portion of the conductive pattern preferably has an average aspect ratio of 0.5 or more. The plating is preferably electroplating or electroless plating.
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公开(公告)号：US20220240388A1
公开(公告)日：2022-07-28
申请号：US17658710
申请日：2022-04-11
Inventor： Junichi MOTOMURA , Koji NITTA , Shoichiro SAKAI , Kenji TAKAHASHI , Maki IKEBE , Kousuke MIURA , Masahiro ITOH
Abstract: A printed wiring board production method that forms a base film and a conductive pattern on the base film by an additive method or a subtractive method, includes a plating process that electroplates the conductive pattern on a surface of the base film, wherein the plating process includes a shield plate arranging process that arranges a shield plate between an anode and a printed wiring board substrate that forms a cathode, and a substrate arranging process that arranges the printed wiring board substrate in a plating tank, and wherein a distance between the shield plate and the printed wiring board substrate is 50 mm or greater and 150 mm or less.
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公开(公告)号：US20200037434A1
公开(公告)日：2020-01-30
申请号：US16474727
申请日：2017-12-21
Applicant: SUMITOMO ELECTRIC PRINTED CIRCUITS, INC.
Inventor： Hiroshi UEDA , Kousuke MIURA , Kou NOGUCHI
IPC: H05K1/02
Abstract: A flexible printed circuit board according to an embodiment of the present invention includes an insulative base film; and a conductive pattern provided on at least one surface of the base film and including a wiring line including a bent portion having an angle of greater than or equal to 60° or a branched portion having an angle of greater than or equal to 60° in plan view. The wiring line is provided with a relaxation structure that relaxes stress concentration at the bent portion or the branched portion. The relaxation structure is structured such that the wiring line constitutes a wide wiring line or a dense wiring line group in a region in which a distance from the bent portion or the branched portion is less than or equal to 5 times a minimum width of the wiring line. The wide wiring line has a wiring line width that is greater than or equal to twice the minimum width of the wiring line. A ratio of a wiring line width to a wiring line interval of the dense wiring line group is greater than or equal to 1.5, and a total width of the dense wiring line group is greater than or equal to twice the minimum width of the wiring line.
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公开(公告)号：US20190008035A1
公开(公告)日：2019-01-03
申请号：US15752383
申请日：2016-08-01
Inventor： Kohei OKAMOTO , Kousuke MIURA , Hiroshi UEDA , Takashi KASUGA , Kazuhiro MIYATA
Abstract: A printed circuit board according to an embodiment of the present invention includes a base film containing, as a main component, a polyimide and a conductive pattern disposed on at least one surface of the base film. The conductive pattern includes a copper particle bond layer which is fixed to the base film. An external transmittance for a wavelength of 500 nm in a conductive pattern non-formed region of the base film is 70% or less of an internal transmittance for a wavelength of 500 nm in a middle layer portion of the base film.
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Patent Agency Ranking
公开(公告)号：US20170347459A1
公开(公告)日：2017-11-30
申请号：US15536851
申请日：2015-12-21
Inventor： Kazuhiro MIYATA , Issei OKADA , Takashi KASUGA , Yoshio OKA , Yasuhiro OKUDA , Jinjoo PARK , Hiroshi UEDA , Kousuke MIURA
CPC classification number: H05K1/092 , C09D11/52 , H05K1/03 , H05K1/0346 , H05K1/09 , H05K1/097 , H05K3/022 , H05K3/064 , H05K3/102 , H05K3/1208 , H05K3/245 , H05K3/246 , H05K2201/0154 , H05K2201/0347 , H05K2203/072 , H05K2203/1131 , H05K2203/1157
Abstract: A substrate for a printed circuit board according to an embodiment of the present invention includes a base film having an insulating property, and a conductive layer formed on at least one of surfaces of the base film. In the substrate for a printed circuit board, at least the conductive layer contains titanium in a dispersed manner. The conductive layer preferably contains copper or a copper alloy as a main component. A mass ratio of titanium in the conductive layer is preferably 10 ppm or more and 1,000 ppm or less. The conductive layer is preferably formed by application and heating of a conductive ink containing metal particles. The conductive ink preferably contains titanium or a titanium ion. The metal particles are preferably obtained by a titanium redox process including reducing metal ions using trivalent titanium ions as a reducing agent in an aqueous solution by an action of the reducing agent.
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17.发明申请公开(公告)号：US20170099732A1
公开(公告)日：2017-04-06
申请号：US15127203
申请日：2015-03-26
Inventor： Takashi KASUGA , Yoshio OKA , Jinjoo PARK , Sumito UEHARA , Kousuke MIURA , Hiroshi UEDA
CPC classification number: H05K1/097 , H05K1/092 , H05K3/12 , H05K3/246 , H05K3/4069 , H05K2201/032
Abstract: A substrate for a printed circuit board according to the present invention includes a base film having an insulating property and including at least one opening; a first conductive layer that is formed on both surfaces of the base film by applying and heat-treating a conductive ink containing metal particles, and that fills the at least one opening; and a second conductive layer formed, by plating, on at least one of surfaces of the first conductive layer. The metal particles preferably have a mean particle size of 1 nm or more and 500 nm or less.
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公开(公告)号：US20200045814A1
公开(公告)日：2020-02-06
申请号：US16341137
申请日：2017-10-05
Applicant: SUMITOMO ELECTRIC PRINTED CIRCUITS, INC.
Inventor： Kohei OKAMOTO , Yoshihito YAMAGUCHI , Kousuke MIURA , Hiroshi UEDA , Atsushi KIMURA
Abstract: A printed circuit board according to an embodiment of the present invention includes a base film having an insulating property, a conductive pattern that is stacked on at least one surface side of the base film and that includes a plurality of wiring portions arranged adjacent to one another, and an insulating layer that covers outer surfaces of the base film and the conductive pattern. The plurality of wiring portions have an average spacing of 1 μm or more and 20 μm or less and an average height of 30 μm or more and 120 μm or less. A filling area ratio of the insulating layer between the plurality of wiring portions adjacent to one another in sectional view is 95% or more.
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公开(公告)号：US20200022262A1
公开(公告)日：2020-01-16
申请号：US16495217
申请日：2017-12-22
Inventor： Kohei OKAMOTO , Kousuke MIURA , Hiroshi UEDA , Shoichiro SAKAI , Maki IKEBE
Abstract: A printed wiring board includes a base film having insulation properties and a conductive pattern including multiple wiring portions laminated so as to run on at least one surface of the base film, wherein each wiring portion includes a first conductive portion and a second conductive portion coating an outer surface of the first conductive portion, wherein an average width of each wiring portion is 10 μm or greater to 50 μm or smaller, and an average thickness of the second conductive portion is 1 μm or greater to smaller than 8.5 μm. A method for manufacturing a printed wiring board includes a first conductive portion forming step of forming a first conductive portion forming each wiring portion by plating an opening of the resist pattern on the conductive foundation layer, a conductive foundation layer removing step, and a second conductive portion coating step.
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20.发明申请公开(公告)号：US20170327630A1
公开(公告)日：2017-11-16
申请号：US15520135
申请日：2015-10-13
Applicant: SUMITOMO ELECTRIC PRINTED CIRCUITS, INC.
Inventor： Satoshi KIYA , Sumito UEHARA , Kousuke MIURA
CPC classification number: C08G59/30 , B32B27/30 , B32B27/38 , C08J7/12 , C08J7/123 , C08J7/16 , C08J2327/12 , C09J163/00 , H05K3/1208 , H05K3/26 , H05K3/281 , H05K3/285 , H05K3/38 , H05K3/381 , H05K3/386 , H05K2201/0129 , H05K2201/015
Abstract: A resin film containing a fluororesin as a main component has, on at least one surface thereof, a pre-treated surface having a content ratio of oxygen atoms or nitrogen atoms of 0.2 atomic percent or more. A coverlay includes the resin film and an adhesive layer laminated on the pre-treated surface. A substrate for a printed wiring board includes the resin film and a conductive layer laminated on the pre-treated surface. A printed wiring board includes an insulating base layer, a conductive pattern laminated on at least one surface of the base layer, and the coverlay for a printed wiring board, the coverlay being laminated on the conductive pattern.
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