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公开(公告)号:US20170162674A1
公开(公告)日:2017-06-08
申请号:US15355781
申请日:2016-11-18
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Jin Bum KIM , Kang Hun MOON , Choeun LEE , Kyung Yub JEON , Sujin JUNG , Haegeon JUNG , Yang XU
IPC: H01L29/66 , H01L21/306 , H01L21/02 , H01L29/08
CPC classification number: H01L29/66795 , H01L21/02381 , H01L21/0243 , H01L21/02433 , H01L21/02532 , H01L21/30604 , H01L29/0847 , H01L29/66545 , H01L29/66636 , H01L29/7848
Abstract: A method of fabricating a semiconductor device is disclosed. The method includes forming an active pattern protruding orthogonally from a substrate; forming a preliminary gate structure on the active pattern to cross the active pattern; etching the active pattern to form preliminary recess regions at both sides of the preliminary gate structure, wherein each of the preliminary recess regions is formed to define a delta region in an upper portion of the active pattern; forming a sacrificial layer on inner side surfaces and a bottom surface of the active pattern exposed by each of the preliminary recess regions; etching the delta regions and the sacrificial layer to form recess regions having a ‘U’-shaped section; and forming source/drain regions in the recess regions.
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公开(公告)号:US20230395668A1
公开(公告)日:2023-12-07
申请号:US18296329
申请日:2023-04-05
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Su Jin JUNG , Jin Bum KIM , In Gyu JANG
IPC: H01L29/417 , H01L29/06 , H01L29/775 , H01L29/786 , H01L29/66 , H01L29/423
CPC classification number: H01L29/41733 , H01L29/0653 , H01L29/775 , H01L29/78696 , H01L29/66553 , H01L29/0673 , H01L29/42392
Abstract: A semiconductor device includes a substrate; an active pattern disposed on the substrate and extending in a first direction; a plurality of gate structures, wherein the plurality of gate structures is disposed on the active pattern and arranged in the first direction, wherein each of the plurality of gate structures includes a gate electrode and a gate insulating film, and wherein the gate electrode extends in a second direction; a source/drain pattern disposed between adjacent gate structures of the plurality of gate structures; a source/drain contact connected to the source/drain pattern; and a contact silicide film disposed between the source/drain pattern and the source/drain contact, wherein the contact silicide film includes a bowl region that wraps a lower portion of the source/drain contact, and a protruding region that protrudes from the bowl region of the contact silicide film.
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公开(公告)号:US20210098626A1
公开(公告)日:2021-04-01
申请号:US16910819
申请日:2020-06-24
Applicant: Samsung Electronics Co., Ltd.
Inventor: Jin Bum KIM , Gyeom KIM , Da Hye KIM , Jae Mun KIM , Il Gyou SHIN , Seung Hun LEE , Kyung In CHOI
IPC: H01L29/78 , H01L29/06 , H01L29/423 , H01L29/786 , H01L21/02 , H01L29/66
Abstract: Example semiconductor devices and methods for fabricating a semiconductor device are disclosed. An example device may include a substrate, a first semiconductor pattern spaced apart from the substrate, a first antioxidant pattern extending along a bottom surface of the first semiconductor pattern and spaced apart from the substrate, and a field insulating film on the substrate. The insulating film may cover at least a part of a side wall of the first semiconductor pattern. The first antioxidant pattern may include a first semiconductor material film doped with a first impurity.
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公开(公告)号:US20190198639A1
公开(公告)日:2019-06-27
申请号:US16037922
申请日:2018-07-17
Inventor: Jin Bum KIM , MunHyeon KIM , Hyoung Sub KIM , Tae Jin PARK , Kwan Heum LEE , Chang Woo NOH , Maria TOLEDANO LU QUE , Hong Bae PARK , Si Hyung LEE , Sung Man WHANG
IPC: H01L29/66 , H01L29/78 , H01L29/423 , H01L29/786
CPC classification number: H01L29/66545 , H01L29/42392 , H01L29/6656 , H01L29/66636 , H01L29/66795 , H01L29/7848 , H01L29/78696
Abstract: A semiconductor device includes a substrate, a gate electrode on the substrate, a gate spacer on a sidewall of the gate electrode, an active pattern penetrating the gate electrode and the gate spacer, and an epitaxial pattern contacting the active pattern and the gate spacer. The gate electrode extends in a first direction. The gate spacer includes a semiconductor material layer. The active pattern extends in a second direction crossing the first direction.
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公开(公告)号:US20180130886A1
公开(公告)日:2018-05-10
申请号:US15685255
申请日:2017-08-24
Applicant: Samsung Electronics Co., Ltd.
Inventor: Jin Bum KIM , Gyeom KIM , Seok Hoon KIM , Tae Jin PARK , Jeong Ho YOO , Cho Eun LEE , Hyun Jung LEE , Sun Jung KIM , Dong Suk SHIN
IPC: H01L29/417 , H01L27/092 , H01L29/51 , H01L29/423 , H01L21/02 , H01L21/3205
CPC classification number: H01L29/41725 , H01L21/02425 , H01L21/32053 , H01L21/823814 , H01L21/823821 , H01L27/0924 , H01L29/42356 , H01L29/517 , H01L2924/0002
Abstract: A semiconductor device includes: a substrate having an active region; a gate structure disposed in the active region; source/drain regions respectively formed within portions of the active region disposed on both sides of the gate structure; a metal silicide layer disposed on a surface of each of the source/drain regions; and contact plugs disposed on the source/drain regions and electrically connected to the source/drain regions through the metal silicide layer, respectively. The metal silicide layer is formed so as to have a monocrystalline structure.
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公开(公告)号:US20220123145A1
公开(公告)日:2022-04-21
申请号:US17565650
申请日:2021-12-30
Applicant: Samsung Electronics Co., Ltd.
Inventor: Jin Bum KIM , Gyeom KIM , Da Hye KIM , Jae Mun KIM , Il Gyou SHIN , Seung Hun LEE , Kyung In CHOI
IPC: H01L29/78 , H01L29/06 , H01L29/423 , H01L29/786 , H01L29/66 , H01L21/02
Abstract: Example semiconductor devices and methods for fabricating a semiconductor device are disclosed. An example device may include a substrate, a first semiconductor pattern spaced apart from the substrate, a first antioxidant pattern extending along a bottom surface of the first semiconductor pattern and spaced apart from the substrate, and a field insulating film on the substrate. The insulating film may cover at least a part of a side wall of the first semiconductor pattern. The first antioxidant pattern may include a first semiconductor material film doped with a first impurity.
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公开(公告)号:US20190267494A1
公开(公告)日:2019-08-29
申请号:US16254842
申请日:2019-01-23
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Jin Bum KIM , Hyoung Sub KIM , Seong Heum CHOI , Jin Yong KIM , Tae Jin PARK , Seung Hun LEE
IPC: H01L29/786 , H01L29/06 , H01L29/423 , H01L21/02 , H01L21/30 , H01L29/66
Abstract: A semiconductor device includes a gate electrode extending in a first direction on a substrate, a first active pattern extending in a second direction intersecting the first direction on the substrate to penetrate the gate electrode, the first active pattern including germanium, an epitaxial pattern on a side wall of the gate electrode, a first semiconductor oxide layer between the first active pattern and the gate electrode, and including a first semiconductor material, and a second semiconductor oxide layer between the gate electrode and the epitaxial pattern, and including a second semiconductor material. A concentration of germanium of the first semiconductor material may be less than a concentration of germanium of the first active pattern, and the concentration of germanium of the first semiconductor material may be different from a concentration of germanium of the second semiconductor material.
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公开(公告)号:US20190058051A1
公开(公告)日:2019-02-21
申请号:US15896277
申请日:2018-02-14
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Jin Bum KIM , Tae Jin PARK , Jong Min LEE , Seok Hoon KIM , Dong Chan SUH , Jeong Ho YOO , Ha Kyu SEONG , Dong Suk SHIN
Abstract: A semiconductor device and a method of manufacturing a semiconductor device, the semiconductor device including a channel pattern on a substrate, the channel pattern extending in a first direction; a gate pattern on the substrate, the gate pattern extending in a second direction crossing the first direction and surrounding the channel pattern; and an interface layer between the channel pattern and the gate pattern, the interface layer being formed on at least one surface of an upper surface and a lower surface of the channel pattern.
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