公开(公告)号：US07442257B2

公开(公告)日：2008-10-28

申请号：US11455736

申请日：2006-06-20

申请人： Seiji Katsuoka ,  Masahiko Sekimoto ,  Toshio Yokoyama ,  Teruyuki Watanabe ,  Takahiro Ogawa ,  Kenichi Kobayashi ,  Mitsuru Miyazaki ,  Yasuyuki Motoshima ,  Akira Owatari ,  Naoki Dai

发明人： Seiji Katsuoka ,  Masahiko Sekimoto ,  Toshio Yokoyama ,  Teruyuki Watanabe ,  Takahiro Ogawa ,  Kenichi Kobayashi ,  Mitsuru Miyazaki ,  Yasuyuki Motoshima ,  Akira Owatari ,  Naoki Dai

IPC分类号： B05C13/00

CPC分类号： H01L21/67161 ,  C23C18/1628 ,  C23C18/1893 ,  C25D7/123 ,  C25D17/001 ,  C25D17/08 ,  H01L21/67051 ,  H01L21/67126 ,  H01L21/67173 ,  H01L21/6719 ,  H01L21/67196 ,  H01L21/6723 ,  H01L21/67742 ,  H01L21/67751 ,  H01L21/67766 ,  H01L21/67781 ,  H01L21/68707 ,  H01L21/68721 ,  Y10S134/902 ,  Y10T279/11

摘要： The present invention relates to a substrate processing apparatus useful for plating a substrate or processing a substrate by dipping a substrate in a processing liquid. A substrate processing apparatus of the present invention includes: a loading/unloading area for carrying in and out a substrate; a cleaning area for cleaning the substrate; and a plating area for plating the substrate. The loading/unloading area is provided with a substrate transfer robot having a plurality of hands of dry-use design, a loading port mounted with a cassette for housing substrates, and a reversing machine of dry-use design for reversing the substrate from face up to face down.

摘要翻译： 本发明涉及通过将基板浸渍在处理液中而用于电镀基板或加工基板的基板处理装置。 本发明的基板处理装置包括：用于搬入和取出基板的装载/卸载区域; 用于清洁衬底的清洁区域; 以及用于电镀基板的电镀区域。 装载/卸载区域设置有具有多个干用设计的手的基板传送机器人，安装有用于容纳基板的盒的装载端口和用于将基板从面朝上翻转的干式设计的反转机 面对下来

公开(公告)号：US20050072358A1

公开(公告)日：2005-04-07

申请号：US10712348

申请日：2003-11-14

申请人： Seiji Katsuoka ,  Masahiko Sekimoto ,  Toshio Yokoyama ,  Teruyuki Watanabe ,  Takahiro Ogawa ,  Kenichi Kobayashi ,  Mitsuru Miyazaki ,  Yasuyuki Motoshima ,  Akira Owatari ,  Naoki Dai

发明人： Seiji Katsuoka ,  Masahiko Sekimoto ,  Toshio Yokoyama ,  Teruyuki Watanabe ,  Takahiro Ogawa ,  Kenichi Kobayashi ,  Mitsuru Miyazaki ,  Yasuyuki Motoshima ,  Akira Owatari ,  Naoki Dai

IPC分类号： C23C18/16 ,  C25D7/12 ,  C25D17/00 ,  H01L21/00 ,  H01L21/677 ,  H01L21/687 ,  C23C16/00

CPC分类号： H01L21/67161 ,  C23C18/1628 ,  C23C18/1893 ,  C25D7/123 ,  C25D17/001 ,  C25D17/08 ,  H01L21/67051 ,  H01L21/67126 ,  H01L21/67173 ,  H01L21/6719 ,  H01L21/67196 ,  H01L21/6723 ,  H01L21/67742 ,  H01L21/67751 ,  H01L21/67766 ,  H01L21/67781 ,  H01L21/68707 ,  H01L21/68721 ,  Y10S134/902 ,  Y10T279/11

摘要： The present invention relates to a substrate processing apparatus useful for plating a substrate or processing a substrate by dipping a substrate in a processing liquid. A substrate processing apparatus of the present invention includes: a loading/unloading area for carrying in and out a substrate; a cleaning area for cleaning the substrate; and a plating area for plating the substrate, wherein the loading/unloading area is provided with a substrate transfer robot having a plurality of hands of dry-use design, a loading port mounted with a cassette for housing substrates, and a reversing machine of dry-use design for reversing the substrate from face up to face down.

摘要翻译： 本发明涉及通过将基板浸渍在处理液中而用于电镀基板或加工基板的基板处理装置。 本发明的基板处理装置包括：用于搬入和取出基板的装载/卸载区域; 用于清洁衬底的清洁区域; 以及用于电镀基板的电镀区域，其中装载/卸载区域设置有具有多个干用设计的手的基板传送机器人，安装有用于容纳基板的盒的装载端口和干燥的反转机器 - 用于将基板从正面朝下翻转的设计。

公开(公告)号：US07976362B2

公开(公告)日：2011-07-12

申请号：US12534465

申请日：2009-08-03

申请人： Seiji Katsuoka ,  Masahiko Sekimoto ,  Junji Kunisawa ,  Mitsuru Miyazaki ,  Teruyuki Watanabe ,  Kenichi Kobayashi ,  Masayuki Kumekawa ,  Toshio Yokoyama

发明人： Seiji Katsuoka ,  Masahiko Sekimoto ,  Junji Kunisawa ,  Mitsuru Miyazaki ,  Teruyuki Watanabe ,  Kenichi Kobayashi ,  Masayuki Kumekawa ,  Toshio Yokoyama

IPC分类号： B24B29/00

CPC分类号： B24B37/04 ,  B24B55/02 ,  Y10S451/914

摘要： A substrate polishing apparatus includes a substrate holding mechanism having a head for holding a substrate to be polished, and a polishing mechanism including a polishing table with a polishing pad mounted thereon. The substrate held by the head is pressed against the polishing pad on the polishing table to polish the substrate by relative movement of the substrate and the polishing pad. The substrate polishing apparatus also includes a substrate transfer mechanism for delivering the substrate to be polished to the head and receiving the polished substrate. The substrate transfer mechanism includes a substrate to-be-polished receiver for receiving the substrate to be polished, and a polished substrate receiver for receiving the substrate which has been polished.

摘要翻译： 一种基板研磨装置，具备：具有保持被研磨基板的头部的基板保持机构，以及具备安装有研磨垫的研磨台的研磨机构。 由头部保持的基板被压靠在抛光台上的抛光垫上，以通过基板和抛光垫的相对运动来抛光基板。 基板抛光装置还包括用于将要抛光的基板输送到头部并且接收经抛光的基板的基板传送机构。 基板转印机构包括用于接收待抛光的基板的待抛光基板和用于接收被抛光的基板的抛光的基板接收器。

公开(公告)号：US07585205B2

公开(公告)日：2009-09-08

申请号：US11905687

申请日：2007-10-03

申请人： Seiji Katsuoka ,  Masahiko Sekimoto ,  Junji Kunisawa ,  Mitsuru Miyazaki ,  Teruyuki Watanabe ,  Kenichi Kobayashi ,  Masayuki Kumekawa ,  Toshio Yokoyama

发明人： Seiji Katsuoka ,  Masahiko Sekimoto ,  Junji Kunisawa ,  Mitsuru Miyazaki ,  Teruyuki Watanabe ,  Kenichi Kobayashi ,  Masayuki Kumekawa ,  Toshio Yokoyama

IPC分类号： B24B49/00

CPC分类号： B24B37/04 ,  B24B55/02 ,  Y10S451/914

摘要： A substrate polishing apparatus includes a substrate holding mechanism having a head for holding a substrate to be polished, and a polishing mechanism including a polishing table with a polishing pad mounted thereon. The substrate held by the head is pressed against the polishing pad on the polishing table to polish the substrate by relative movement of the substrate and the polishing pad. The substrate polishing apparatus also includes a substrate transfer mechanism for delivering the substrate to be polished to the head and receiving the polished substrate. The substrate transfer mechanism includes a substrate to-be-polished receiver for receiving the substrate to be polished, and a polished substrate receiver for receiving the substrate which has been polished.

摘要翻译： 一种基板研磨装置，具备：具有保持被研磨基板的头部的基板保持机构，以及具备安装有研磨垫的研磨台的研磨机构。 由头部保持的基板被压靠在抛光台上的抛光垫上，以通过基板和抛光垫的相对运动来抛光基板。 基板抛光装置还包括用于将要抛光的基板输送到头部并且接收经抛光的基板的基板传送机构。 基板转印机构包括用于接收待抛光的基板的待抛光基板和用于接收被抛光的基板的抛光的基板接收器。

公开(公告)号：US20080085658A1

公开(公告)日：2008-04-10

申请号：US11905687

申请日：2007-10-03

申请人： Seiji Katsuoka ,  Masahiko Sekimoto ,  Junji Kunisawa ,  Mitsuru Miyazaki ,  Teruyuki Watanabe ,  Kenichi Kobayashi ,  Masayuki Kumekawa ,  Toshio Yokoyama

发明人： Seiji Katsuoka ,  Masahiko Sekimoto ,  Junji Kunisawa ,  Mitsuru Miyazaki ,  Teruyuki Watanabe ,  Kenichi Kobayashi ,  Masayuki Kumekawa ,  Toshio Yokoyama

IPC分类号： B24B55/02

CPC分类号： B24B37/04 ,  B24B55/02 ,  Y10S451/914

摘要： A substrate polishing apparatus includes a substrate holding mechanism having a head for holding a substrate to be polished, and a polishing mechanism including a polishing table with a polishing pad mounted thereon. The substrate held by the head is pressed against the polishing pad on the polishing table to polish the substrate by relative movement of the substrate and the polishing pad. The substrate polishing apparatus also includes a substrate transfer mechanism for delivering the substrate to be polished to the head and receiving the polished substrate. The substrate transfer mechanism includes a substrate to-be-polished receiver for receiving the substrate to be polished, and a polished substrate receiver for receiving the substrate which has been polished.

摘要翻译： 一种基板研磨装置，具备：具有保持被研磨基板的头部的基板保持机构，以及具备安装有研磨垫的研磨台的研磨机构。 由头部保持的基板被压靠在抛光台上的抛光垫上，以通过基板和抛光垫的相对运动来抛光基板。 基板抛光装置还包括用于将要抛光的基板输送到头部并且接收经抛光的基板的基板传送机构。 基板转印机构包括用于接收待抛光的基板的待抛光基板和用于接收被抛光的基板的抛光的基板接收器。

公开(公告)号：US20110237163A1

公开(公告)日：2011-09-29

申请号：US13152374

申请日：2011-06-03

申请人： Seiji Katsuoka ,  Masahiko Sekimoto ,  Junji Kunisawa ,  Mitsuru Miyazaki ,  Teruyuki Watanabe ,  Kenichi Kobayashi ,  Masayuki Kumekawa ,  Toshio Yokoyama

发明人： Seiji Katsuoka ,  Masahiko Sekimoto ,  Junji Kunisawa ,  Mitsuru Miyazaki ,  Teruyuki Watanabe ,  Kenichi Kobayashi ,  Masayuki Kumekawa ,  Toshio Yokoyama

IPC分类号： B24B37/04 ,  B24B7/24 ,  B24B57/00 ,  B24B41/06 ,  B24B53/00 ,  B24B1/00

CPC分类号： B24B37/04 ,  B24B55/02 ,  Y10S451/914

摘要： A substrate polishing apparatus includes a substrate holding mechanism having a head for holding a substrate to be polished, and a polishing mechanism including a polishing table with a polishing pad mounted thereon. The substrate held by the head is pressed against the polishing pad on the polishing table to polish the substrate by relative movement of the substrate and the polishing pad. The substrate polishing apparatus also includes a substrate transfer mechanism for delivering the substrate to be polished to the head and receiving the polished substrate. The substrate transfer mechanism includes a substrate to-be-polished receiver for receiving the substrate to be polished, and a polished substrate receiver for receiving the substrate which has been polished.

摘要翻译： 一种基板研磨装置，具备：具有保持被研磨基板的头部的基板保持机构，以及具备安装有研磨垫的研磨台的研磨机构。 由头部保持的基板被压靠在抛光台上的抛光垫上，以通过基板和抛光垫的相对运动来抛光基板。 基板抛光装置还包括用于将要抛光的基板输送到头部并且接收经抛光的基板的基板传送机构。 基板转印机构包括用于接收待抛光的基板的待抛光基板和用于接收被抛光的基板的抛光的基板接收器。

公开(公告)号：US20080178800A1

公开(公告)日：2008-07-31

申请号：US12076834

申请日：2008-03-24

申请人： Seiji Katsuoka ,  Masahiko Sekimoto ,  Teruyuki Watanabe ,  Ryo Kato ,  Toshio Yokoyama ,  Kenichi Suzuki ,  Kenichi Kobayashi

发明人： Seiji Katsuoka ,  Masahiko Sekimoto ,  Teruyuki Watanabe ,  Ryo Kato ,  Toshio Yokoyama ,  Kenichi Suzuki ,  Kenichi Kobayashi

IPC分类号： B05C3/02

CPC分类号： H01L21/288 ,  C23C2/003 ,  C23C18/1619 ,  C23C18/163 ,  C23C18/1642 ,  H01L21/6708 ,  H01L21/67742 ,  H01L21/6838 ,  H01L21/76849

摘要： A substrate processing unit includes: a vertically-movable substrate holder for holding a substrate; a pan surrounding a periphery of the substrate holder; a cell, located below the substrate holder and within the pan, having in its interior a chemical processing section; and a cell cover, capable of closing a top opening of the cell, having a plurality of spray nozzles for separately spraying at least two types of processing liquids, wherein the pan and the cell each have an individual liquid discharge line.

公开(公告)号：US20050281947A1

公开(公告)日：2005-12-22

申请号：US11115214

申请日：2005-04-27

申请人： Seiji Katsuoka ,  Masahiko Sekimoto ,  Teruyuki Watanabe ,  Ryo Kato ,  Toshio Yokoyama ,  Kenichi Suzuki ,  Kenichi Kobayashi

发明人： Seiji Katsuoka ,  Masahiko Sekimoto ,  Teruyuki Watanabe ,  Ryo Kato ,  Toshio Yokoyama ,  Kenichi Suzuki ,  Kenichi Kobayashi

IPC分类号： B05B15/12 ,  B05C3/09 ,  B05C9/06 ,  B05C11/10 ,  B05C13/00 ,  B05C15/00 ,  B05D3/12 ,  B65H1/00 ,  C23C2/00 ,  C23C18/16 ,  C23C18/31 ,  C25D17/06 ,  H01L21/00 ,  H01L21/288 ,  H01L21/68 ,  H01L21/683 ,  H01L21/768

CPC分类号： H01L21/288 ,  C23C2/003 ,  C23C18/1619 ,  C23C18/163 ,  C23C18/1642 ,  H01L21/6708 ,  H01L21/67742 ,  H01L21/6838 ,  H01L21/76849

摘要： A substrate processing unit, by employing the processing unit to carry out different processings with different processing liquids, can make a reduction in the space for carrying out the entire process of substrate processing and a reduction in the energy necessary for substrate transportation. The substrate processing unit includes: a vertically-movable substrate holder for holding a substrate; an pan surrounding the periphery of the substrate holder; an cell, located below the substrate holder and within the pan, having in its interior a chemical processing section; and a cell cover, capable of closing the top opening of the cell, having a plurality of spray nozzles for separately spraying at least two types of processing liquids; wherein the pan and the cell each have an individual liquid discharge line.

摘要翻译： 基板处理单元通过使用处理单元对不同的处理液进行不同的处理，可以减少用于进行基板处理的整个处理的空间并降低基板输送所需的能量。 基板处理单元包括：用于保持基板的可垂直移动的基板保持器; 围绕衬底保持器的周边的锅; 位于基板保持器下方并在锅内的电池，在其内部具有化学处理部分; 以及能够封闭电池的顶部开口的电池盖，具有用于分开喷射至少两种类型的处理液体的多个喷嘴; 其中所述锅和所述池各自具有单独的液体排出管线。

公开(公告)号：US07368016B2

公开(公告)日：2008-05-06

申请号：US11115214

申请日：2005-04-27

申请人： Seiji Katsuoka ,  Masahiko Sekimoto ,  Teruyuki Watanabe ,  Ryo Kato ,  Toshio Yokoyama ,  Kenichi Suzuki ,  Kenichi Kobayashi

发明人： Seiji Katsuoka ,  Masahiko Sekimoto ,  Teruyuki Watanabe ,  Ryo Kato ,  Toshio Yokoyama ,  Kenichi Suzuki ,  Kenichi Kobayashi

IPC分类号： B05B15/04 ,  B05B7/06 ,  B05C3/00 ,  B05C13/02 ,  B08B3/00 ,  B08B3/02

CPC分类号： H01L21/288 ,  C23C2/003 ,  C23C18/1619 ,  C23C18/163 ,  C23C18/1642 ,  H01L21/6708 ,  H01L21/67742 ,  H01L21/6838 ,  H01L21/76849

摘要： A substrate processing unit includes: a vertically-movable substrate holder for holding a substrate; a pan surrounding a periphery of the substrate holder; a cell, located below the substrate holder and within the pan, having in its interior a chemical processing section; and a cell cover, capable of closing a top opening of the cell, having a plurality of spray nozzles for separately spraying at least two types of processing liquids, wherein the pan and the cell each have an individual liquid discharge line.

摘要翻译： 基板处理单元包括：用于保持基板的可垂直移动的基板保持器; 围绕衬底保持器的周边的平底锅; 位于基板保持器下方并在锅内的电池，在其内部具有化学处理部分; 以及能够封闭电池的顶部开口的电池盖，具有用于分别喷射至少两种类型的处理液体的多个喷嘴，其中锅和电池单元各自具有单独的液体排出管线。

公开(公告)号：US20070070575A1

公开(公告)日：2007-03-29

申请号：US10578100

申请日：2004-12-22

申请人： Masahiko Sekimoto ,  Seiji Katsuoka ,  Naoki Dai ,  Teruyuki Watanabe ,  Takahiro Ogawa ,  Kenichi Suzuki ,  Kenichi Kobayashi ,  Yasuyuki Motoshima ,  Ryo Kato

发明人： Masahiko Sekimoto ,  Seiji Katsuoka ,  Naoki Dai ,  Teruyuki Watanabe ,  Takahiro Ogawa ,  Kenichi Suzuki ,  Kenichi Kobayashi ,  Yasuyuki Motoshima ,  Ryo Kato

IPC分类号： H01T23/00

CPC分类号： H01L21/67086 ,  H01L21/67051 ,  H01L21/687

摘要： A substrate holding apparatus can meet the request for a smaller-sized compact apparatus while ensuring a sufficient immersion depth of a substrate in a processing liquid. The substrate holding apparatus includes: a substrate holder (84) for supporting a substrate (W) by bringing a peripheral portion of a surface of the substrate (W) into contact with a first sealing member (92); and a substrate pressing section (85) for lowering relative to the substrate holder (84) so as to press the substrate (W) held by the substrate holder (84) downward, thereby bringing the first sealing member (92) into pressure contact with the substrate (W); wherein the substrate pressing section (85) is provided with a second ring-shaped sealing member (170) which makes pressure contact with an upper surface of a ring-shaped holding section of the substrate holder (84), thereby sealing the peripheral region of the substrate pressing section (85).

摘要翻译： 基板保持装置可以满足对较小尺寸的小型装置的要求，同时确保基板在处理液体中的足够的浸入深度。 基板保持装置包括：通过使基板（W）的表面的周边部分与第一密封构件（92）接触来支撑基板（W）的基板保持件（84）; 以及用于相对于基板保持件（84）下降以便将由基板保持件（84）保持的基板（W）向下压的基板按压部（85），从而使第一密封部件（92）与 基板（W）; 其中，所述基板按压部（85）设置有与所述基板保持件（84）的环状保持部的上表面压力接触的第二环状密封部件（170），从而密封所述基板保持部 基板按压部（85）。