公开(公告)号：US09607974B2

公开(公告)日：2017-03-28

申请号：US14940554

申请日：2015-11-13

Applicant: Siliconware Precision Industries Co., Ltd.

Inventor： Chun-Tang Lin ,  Shih-Ching Chen ,  Yi-Che Lai ,  Hong-Da Chang ,  Hung-Wen Liu ,  Yi-Wei Liu ,  Hsi-Chang Hsu

IPC: H01L25/00 ,  H01L25/065 ,  H01L21/683 ,  H01L23/31 ,  H01L21/56 ,  H01L23/00

CPC classification number: H01L25/50 ,  H01L21/568 ,  H01L21/6835 ,  H01L23/3128 ,  H01L24/16 ,  H01L24/19 ,  H01L24/20 ,  H01L24/48 ,  H01L24/96 ,  H01L25/0657 ,  H01L25/105 ,  H01L2221/68359 ,  H01L2221/68372 ,  H01L2224/04042 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/16227 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2225/06548 ,  H01L2225/1035 ,  H01L2225/1041 ,  H01L2225/1058 ,  H01L2924/00014 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/18162 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A method for fabricating a package structure is provided, which includes: providing a first carrier having a circuit layer thereon; forming a plurality of conductive posts on the circuit layer and disposing at least an electronic element on the first carrier; forming an encapsulant on the first carrier to encapsulate the conductive posts, the circuit layer and the electronic element; and removing the first carrier, thereby dispensing with the conventional hole opening process for forming the conductive posts and hence reducing the fabrication costs.

公开(公告)号：US20160190099A1

公开(公告)日：2016-06-30

申请号：US14956758

申请日：2015-12-02

Applicant: Siliconware Precision Industries Co., Ltd.

Inventor： Yi-Wei Liu ,  Yan-Heng Chen ,  Mao-Hua Yeh ,  Hung-Wen Liu ,  Yi-Che Lai

IPC: H01L25/065 ,  H01L21/48 ,  H01L21/56 ,  H01L23/538 ,  H01L25/00 ,  H01L21/78 ,  H01L21/3105 ,  H01L23/31 ,  H01L21/683 ,  H01L21/768

CPC classification number: H01L23/5389 ,  H01L21/31053 ,  H01L21/4853 ,  H01L21/4857 ,  H01L21/486 ,  H01L21/565 ,  H01L21/568 ,  H01L21/6835 ,  H01L21/78 ,  H01L23/3114 ,  H01L23/49811 ,  H01L23/49827 ,  H01L23/5383 ,  H01L23/5384 ,  H01L23/5386 ,  H01L24/16 ,  H01L24/19 ,  H01L24/20 ,  H01L25/105 ,  H01L25/50 ,  H01L2221/68318 ,  H01L2221/68345 ,  H01L2221/68359 ,  H01L2221/68372 ,  H01L2224/12105 ,  H01L2224/16235 ,  H01L2225/06517 ,  H01L2225/06548 ,  H01L2225/1035 ,  H01L2225/1041 ,  H01L2225/1058 ,  H01L2225/1088 ,  H01L2924/15311

Abstract: The present invention provides a package structure and fabrication method thereof. The method includes providing a first carrier having a metal layer; forming a dielectric layer on the metal layer; forming a plurality of conductive pillars embedded into the dielectric layer and protruding from a surface of the dielectric layer, and disposing an electronic component on the surface of the dielectric layer; forming an encapsulating layer on the dielectric layer to encompass the plurality of conductive pillars, the dielectric layer and the electronic component; removing a portion of the encapsulating layer and the first carrier such that two ends of each of the plurality of conductive pillars are exposed from the encapsulating layer and the dielectric layer. Therefore, the present invention effectively reduces manufacturing costs and the need for an opening process while manufacturing the conductive pillars can be eliminated.

Abstract translation: 本发明提供一种封装结构及其制造方法。 该方法包括提供具有金属层的第一载体; 在所述金属层上形成电介质层; 形成嵌入介电层并从电介质层的表面突出的多个导电柱，并在电介质层的表面上设置电子部件; 在所述电介质层上形成封装层以包围所述多个导电柱，所述电介质层和所述电子部件; 去除封装层和第一载体的一部分，使得多个导电柱中的每一个的两端从封装层和电介质层露出。 因此，本发明有效地降低了制造成本，并且可以消除在制造导电柱的过程中对打开过程的需要。

公开(公告)号：US08828796B1

公开(公告)日：2014-09-09

申请号：US14085168

申请日：2013-11-20

Applicant: Siliconware Precision Industries Co., Ltd.

Inventor： Chieh-Yuan Chi ,  Wei-Yu Chen ,  Hung-Wen Liu ,  Yan-Heng Chen ,  Hsi-Chang Hsu

IPC: H01L21/44 ,  H01L23/02 ,  H01L23/498

CPC classification number: H01L23/5383 ,  H01L21/561 ,  H01L21/568 ,  H01L23/49816 ,  H01L23/5384 ,  H01L23/5389 ,  H01L24/19 ,  H01L24/96 ,  H01L24/97 ,  H01L2224/0401 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2924/3511 ,  H01L2924/00

Abstract: A semiconductor package and a method of manufacturing the same are provided, the semiconductor package including a first package unit having a first encapsulant and a first semiconductor element, a second package unit having a second encapsulant and a second semiconductor element, a supporting member interposed between the first and second encapsulant, a plurality of conductors penetrating the first encapsulant, the supporting member and the second encapsulant, and redistribution structures disposed on the first and second encapsulants, wherein the first and second encapsulants are coupled with each other by the supporting member to provide sufficient support and protection to enhance the structure strength of the first and second package units.

Abstract translation: 提供一种半导体封装及其制造方法，所述半导体封装包括具有第一密封剂和第一半导体元件的第一封装单元，具有第二密封剂的第二封装单元和第二半导体元件， 所述第一和第二密封剂，穿过所述第一密封剂，所述支撑构件和所述第二密封剂的多个导体以及设置在所述第一和第二密封剂上的再分配结构，其中所述第一和第二密封剂通过所述支撑构件彼此联接， 提供足够的支撑和保护以增强第一和第二包装单元的结构强度。