公开(公告)号：US06686764B2

公开(公告)日：2004-02-03

申请号：US10145579

申请日：2002-05-14

申请人： Simon Muff

发明人： Simon Muff

IPC分类号： H03K1923

CPC分类号： G06F13/4086

摘要： The present invention relates to an apparatus and a method for reducing reflexions in a bus for transmitting data. The device comprises an output, which is connected to an input of the bus, a device for sending a test signal into the input of the bus (102), the device for sending being connected to the output, a device for receiving reflexions from the bus, which is connected to the output, and a device for evaluating the reflexions from the bus, in order to supply an evaluation result, and for setting an impedance at the output as a function of the evaluation result, in order to reduce the reflexions from the bus.

摘要翻译： 本发明涉及一种用于减少用于发送数据的总线中的反射的装置和方法。 该设备包括连接到总线的输入的输出，用于将测试信号发送到总线（102）的输入端的设备，用于发送的设备连接到输出端，用于接收来自该总线的反射的设备 连接到输出的总线，以及用于评估来自总线的反射的装置，以便提供评估结果，并且用于根据评估结果设置输出端的阻抗，以便减少反射 从公共汽车。

公开(公告)号：US07474552B2

公开(公告)日：2009-01-06

申请号：US11370172

申请日：2006-03-08

申请人： Simon Muff

发明人： Simon Muff

IPC分类号： G11C11/00

CPC分类号： G11C7/1078 ,  G11C7/04 ,  G11C7/1084 ,  G11C7/109 ,  G11C11/4093

摘要： An integrated semiconductor memory device comprises: a receiver circuit for receiving a data signal, a receiver circuit for receiving a command signal, and a receiver circuit for receiving an address signal. A programmable storage unit comprises programmable elements. A current of the receiver circuits is controlled in dependence on a state of the programmable elements of the programmable storage unit. Depending on the application in which the integrated semiconductor memory device is used, the current of the receiver circuits is increased or decreased. By decreasing the current of the receiver circuits a dissipation loss of the integrated semiconductor memory device is reduced.

摘要翻译： 集成半导体存储器件包括：用于接收数据信号的接收器电路，用于接收命令信号的接收器电路和用于接收地址信号的接收器电路。 可编程存储单元包括可编程元件。 根据可编程存储单元的可编程元件的状态来控制接收器电路的电流。 根据使用集成半导体存储器件的应用，接收器电路的电流增加或减少。 通过减小接收器电路的电流，集成半导体存储器件的耗散损耗减小。

公开(公告)号：US20080101105A1

公开(公告)日：2008-05-01

申请号：US11925547

申请日：2007-10-26

申请人： Simon Muff

发明人： Simon Muff

IPC分类号： G11C5/06 ,  G11C7/10 ,  H05K1/14

CPC分类号： G11C5/04 ,  G11C5/063 ,  H05K1/181 ,  H05K2201/09227 ,  H05K2201/10159 ,  H05K2201/10545 ,  Y02P70/611

摘要： A memory module includes an electronic printed circuit board with at least one contact strip, a plurality of integrated memory components, at least one first and one second buffer component, and a number of conductor tracks, which proceed from the contact strip and which are arranged on or in the printed circuit board. The conductor tracks include data lines, control lines and address lines. The conductor tracks lead from the contact strip to the buffer components or to one of the buffer components. The printed circuit board has conductor tracks that are interposed between the first buffer component and the second buffer component and that lead from the first buffer component to the second buffer component.

摘要翻译： 存储器模块包括具有至少一个接触片的电子印刷电路板，多个集成存储器部件，至少一个第一和第二缓冲器部件以及多个导体轨迹，其从接触条行进并且被布置 在印刷电路板上或印刷电路板上。 导体轨迹包括数据线，控制线和地址线。 导体将导线从接触片跟踪到缓冲器部件或缓冲部件之一。 印刷电路板具有插入在第一缓冲部件和第二缓冲部件之间并且从第一缓冲部件引导到第二缓冲部件的导体轨迹。

公开(公告)号：US20080061423A1

公开(公告)日：2008-03-13

申请号：US11853995

申请日：2007-09-12

申请人： Martin Brox ,  Simon Muff

发明人： Martin Brox ,  Simon Muff

IPC分类号： H01L23/12 ,  H01L21/98

CPC分类号： H01L23/13 ,  H01L23/49838 ,  H01L24/48 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/48091 ,  H01L2224/4824 ,  H01L2224/73265 ,  H01L2225/0651 ,  H01L2225/06527 ,  H01L2225/06572 ,  H01L2225/06575 ,  H01L2924/00014 ,  H01L2924/01068 ,  H01L2924/01078 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2924/00

摘要： An integrated circuit module comprises a chip, the chip comprising a substrate with a first main area and a second main area, the first main area comprising two half-sets of pads, the chip further comprising an integrated circuit with components and two half-sets of connection lines, the connection lines connecting the components of the integrated circuit to the pads, the integrated circuit further comprising a changeover device, the changeover device having two switching states in order to interchange the electrical assignment between the half-sets of the connection lines and the half-sets of the pads, and a carrier, the carrier comprising contact pieces. The chip is arranged on the carrier with one of the two main areas of the chip facing the carrier and the contact pieces of the carrier are connected to the pads of the chip, wherein one of the two switching states of the changeover device is selected, depending on which of the two main areas of the chip is the area facing the carrier.

摘要翻译： 集成电路模块包括芯片，芯片包括具有第一主区域和第二主区域的基板，第一主区域包括两个半组焊盘，该芯片还包括具有部件和两个半组的集成电路 的连接线，将集成电路的部件连接到焊盘的连接线，该集成电路还包括切换装置，该切换装置具有两个切换状态，以便互换连接线半组之间的电气分配 和半组焊盘，以及载体，载体包括接触片。 芯片布置在载体上，芯片的两个主要区域中的一个面向载体，并且载体的接触片连接到芯片的焊盘，其中选择切换装置的两个切换状态之一， 取决于芯片的两个主要区域中哪一个是面向载体的区域。

公开(公告)号：US20070211552A1

公开(公告)日：2007-09-13

申请号：US11370172

申请日：2006-03-08

申请人： Simon Muff

发明人： Simon Muff

IPC分类号： G11C5/14

CPC分类号： G11C7/1078 ,  G11C7/04 ,  G11C7/1084 ,  G11C7/109 ,  G11C11/4093

摘要： An integrated semiconductor memory device comprises: a receiver circuit for receiving a data signal, a receiver circuit for receiving a command signal, and a receiver circuit for receiving an address signal. A programmable storage unit comprises programmable elements. A current of the receiver circuits is controlled in dependence on a state of the programmable elements of the programmable storage unit. Depending on the application in which the integrated semiconductor memory device is used, the current of the receiver circuits is increased or decreased. By decreasing the current of the receiver circuits a dissipation loss of the integrated semiconductor memory device is reduced.

摘要翻译： 集成半导体存储器件包括：用于接收数据信号的接收器电路，用于接收命令信号的接收器电路和用于接收地址信号的接收器电路。 可编程存储单元包括可编程元件。 根据可编程存储单元的可编程元件的状态来控制接收器电路的电流。 根据使用集成半导体存储器件的应用，接收器电路的电流增加或减少。 通过减小接收器电路的电流，集成半导体存储器件的耗散损耗减小。

公开(公告)号：US20070195505A1

公开(公告)日：2007-08-23

申请号：US11357413

申请日：2006-02-21

申请人： Dominique Savignac ,  Peter Gregorius ,  Hermann Ruckerbauer ,  Simon Muff

发明人： Dominique Savignac ,  Peter Gregorius ,  Hermann Ruckerbauer ,  Simon Muff

IPC分类号： H05K7/20

CPC分类号： H05K1/183 ,  G11C5/02 ,  G11C5/025 ,  G11C5/04 ,  H01L23/552 ,  H01L24/73 ,  H01L25/18 ,  H01L2224/16225 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2225/0651 ,  H01L2924/01019 ,  H01L2924/15153 ,  H01L2924/15192 ,  H01L2924/15311 ,  H01L2924/16195 ,  H01L2924/16251 ,  H01L2924/19107 ,  H01L2924/3025 ,  H05K1/181 ,  H05K2201/10159 ,  H05K2201/10515 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2924/00

摘要： A memory module device includes a printed circuit board, a plurality of memory modules and a buffer module. Lines are provided in or on the printed circuit board to connect the buffer module to the memory modules. The memory modules are combined at least partially to form memory module stacks.

摘要翻译： 存储器模块装置包括印刷电路板，多个存储器模块和缓冲模块。 在印刷电路板中或印刷电路板上提供线路，以将缓冲模块连接到存储器模块。 存储器模块至少部分地组合以形成存储器模块堆栈。

公开(公告)号：US07414917B2

公开(公告)日：2008-08-19

申请号：US11192335

申请日：2005-07-29

申请人： Hermann Ruckerbauer ,  Simon Muff ,  Christian Weiss ,  Peter Gregorius

发明人： Hermann Ruckerbauer ,  Simon Muff ,  Christian Weiss ,  Peter Gregorius

IPC分类号： G11C8/00

CPC分类号： G11C5/04 ,  G11C5/06 ,  H05K1/142

摘要： Semiconductor memory modules and semiconductor memory systems using the same are described herein. The modules divide a conventional DIMM into a series of separate, smaller memory modules. Each memory module includes at least one semiconductor memory chip arranged on a substrate; CAwD signal input lines arranged on the substrate in a first predetermined line number and connecting one of the semiconductor memory chips to CAwD input signal pins on the substrate; and rD signal output lines arranged on the substrate in a second predetermined line number and connecting the one or a last semiconductor memory to a second number of rD output signal pins of the substrate. In a semiconductor memory system including the semiconductor memory modules, each memory module is separately connected to a memory controller by the CAwD signal input lines and the rD signal output lines in a respective point-to-point fashion.

摘要翻译： 本文描述了使用其的半导体存储器模块和半导体存储器系统。 这些模块将常规DIMM分成一系列独立的较小内存模块。 每个存储器模块包括布置在衬底上的至少一个半导体存储器芯片; CAwD信号输入线，以第一预定行号排列在基板上，并将半导体存储器芯片之一连接到基板上的CAwD输入信号引脚; 和rD信号输出线，以第二预定行号排列在基板上，并将一个或最后一个半导体存储器连接到基板的第二数量的rD输出信号引脚。 在包括半导体存储器模块的半导体存储器系统中，每个存储器模块通过CAwD信号输入线和rD信号输出线分别以点对点的方式连接到存储器控制器。

公开(公告)号：US07375971B2

公开(公告)日：2008-05-20

申请号：US11437846

申请日：2006-05-19

申请人： Siva RaghuRam ,  Josef Schuster ,  Simon Muff ,  Abdallah Bacha

发明人： Siva RaghuRam ,  Josef Schuster ,  Simon Muff ,  Abdallah Bacha

IPC分类号： H05K7/02

CPC分类号： H05K1/181 ,  G11C5/04 ,  G11C5/063 ,  H05K2201/09409 ,  H05K2201/09418 ,  Y02P70/611

摘要： In a first embodiment, the invention provides a memory module having an electronic printed circuit board and a plurality of semiconductor chips of the same type that are mounted on at least one outer face of the printed circuit board. The printed circuit board has a connector strip, which runs at a first edge of the at least one outer face in a first direction and has a multiplicity of electrical contacts that are lined up in the first direction. The printed circuit board extends in the first direction between two opposite second edges. At least nine of the semiconductor chips of the same type are respectively mounted next to one another on the outer face of the printed circuit board between the center of the printed circuit board and the respective second edge of the printed circuit board. The semiconductor chips of the same type respectively have a smaller dimension and, in the direction perpendicular to the smaller dimension, a larger dimension that is larger than the smaller dimension. A respective first group of four of the semiconductor chips of the same type, which are oriented so as to have their shorter dimension parallel to the connector strip, is arranged at the respective second edge of the printed circuit board. A second group of five semiconductor chips of the same type is respectively arranged between the first group of semiconductor chips and the center of the printed circuit board. The first group of semiconductor chips and the second group of semiconductor chips are actuated by two separate line buses whose conductor tracks branch toward all the semiconductor chips in the respective group of semiconductor chips.

摘要翻译： 在第一实施例中，本发明提供一种具有电子印刷电路板和安装在印刷电路板的至少一个外表面上的相同类型的多个半导体芯片的存储模块。 印刷电路板具有一个连接器条，其在第一方向的至少一个外表面的第一边缘处延伸，并且具有在第一方向上排列的多个电触点。 印刷电路板沿第一方向在两个相对的第二边缘之间延伸。 在印刷电路板的中心和印刷电路板的相应第二边缘之间，相同类型的至少九个半导体芯片分别彼此相邻地安装在印刷电路板的外表面上。 相同类型的半导体芯片分别具有较小的尺寸，并且在垂直于较小尺寸的方向上具有大于较小尺寸的较大尺寸。 在印刷电路板的相应第二边缘处布置相同类型的四个半导体芯片的相应的第一组，其被定向成具有与连接器条平行的较短尺寸。 第一组相同类型的五个半导体芯片分别布置在第一组半导体芯片和印刷电路板的中心之间。 第一组半导体芯片和第二组半导体芯片由两条单独的线路总线驱动，其导体轨迹分支到相应的半导体芯片组中的所有半导体芯片。

公开(公告)号：US20080112142A1

公开(公告)日：2008-05-15

申请号：US11558840

申请日：2006-11-10

申请人： Siva RaghuRam ,  Simon Muff

发明人： Siva RaghuRam ,  Simon Muff

IPC分类号： H05K1/16 ,  H05K7/00

CPC分类号： H05K1/181 ,  G11C5/04 ,  H05K1/023 ,  H05K2201/09236 ,  H05K2201/09263 ,  H05K2201/097 ,  H05K2201/10159 ,  Y02P70/611

摘要： A memory module comprises a printed circuit board with a main surface bounded by a first side and a second side, the first side being longer than the second side, a first and a second generally rectangular memory device each having a long side and a short side, the first and second memory devices positioned on the main surface of the printed circuit board in such a way that the first memory device long side is generally parallel to the printed circuit board first side and the second memory device long side is generally perpendicular to the printed circuit board first side, and a first set of passive components connected to the first memory device and a second set of passive components connected to the second memory device, the first and second sets of passive components positioned on the main surface of the printed circuit board between the first memory device and interconnection pads.

摘要翻译： 一种记忆模块包括印刷电路板，其主表面由第一侧和第二侧限定，第一侧比第二侧长;第一和第二大致矩形的存储器件，每个具有长边和短边 ，所述第一和第二存储器件位于印刷电路板的主表面上，使得第一存储器件长边大致平行于印刷电路板第一侧，而第二存储器件长边大致垂直于 印刷电路板第一侧以及连接到第一存储器件的第一组无源元件和连接到第二存储器件的第二组无源元件，位于印刷电路主表面上的第一和第二组无源元件 在第一存储器件和互连焊盘之间。

公开(公告)号：US07351072B2

公开(公告)日：2008-04-01

申请号：US11481676

申请日：2006-07-06

申请人： Simon Muff ,  Siva Raghuram

发明人： Simon Muff ,  Siva Raghuram

IPC分类号： H05K1/14

CPC分类号： G11C5/04 ,  H05K1/144 ,  H05K3/366 ,  H05K2201/045 ,  H05K2201/10189 ,  H05K2203/1572

摘要： A memory extension memory module, a memory module system, and a memory module is disclosed. The memory module including at least one memory device and a connector for connecting the memory module to a computer system, wherein the memory module additionally includes a surface-mounted connector for connecting a memory extension memory module to the memory module. Furthermore, a method for manufacturing a memory module is disclosed. The memory module including at least one memory device and at least one connector for connecting a memory extension memory module to the memory module, wherein the at least one memory device and the at least one connector are connected to the memory module in a single manufacturing process.

摘要翻译： 公开了一种存储器扩展存储器模块，存储器模块系统和存储器模块。 所述存储器模块包括至少一个存储器件和用于将所述存储器模块连接到计算机系统的连接器，其中所述存储器模块还包括用于将存储器扩展存储器模块连接到所述存储器模块的表面安装连接器。 此外，公开了一种用于制造存储器模块的方法。 所述存储器模块包括至少一个存储器设备和用于将存储器扩展存储器模块连接到所述存储器模块的至少一个连接器，其中所述至少一个存储器设备和所述至少一个连接器在单个制造过程中连接到所述存储器模块 。