公开(公告)号：US20140339695A1

公开(公告)日：2014-11-20

申请号：US14231163

申请日：2014-03-31

Applicant: TAIYO YUDEN CO., LTD.

Inventor： Motoi YAMAUCHI ,  Osamu KAWACHI ,  Yasushi FUKUDA ,  Yoshinobu ISHIBASHI

IPC: H01L23/00

CPC classification number: H01L24/81 ,  H01L23/15 ,  H01L24/13 ,  H01L24/16 ,  H01L24/83 ,  H01L24/97 ,  H01L2224/13111 ,  H01L2224/16238 ,  H01L2224/7598 ,  H01L2224/81007 ,  H01L2224/81191 ,  H01L2224/81203 ,  H01L2224/81206 ,  H01L2224/81207 ,  H01L2224/81815 ,  H01L2224/83007 ,  H01L2224/83191 ,  H01L2224/83203 ,  H01L2224/83815 ,  H01L2224/97 ,  H01L2924/351 ,  H03H9/059 ,  H05K1/0271 ,  H05K1/0306 ,  H05K3/3431 ,  H05K2201/09781 ,  H05K2201/2009 ,  H01L2924/00014 ,  H01L2224/81 ,  H01L2224/83 ,  H01L2924/01047

Abstract: An electronic component includes: a substrate formed of ceramic and including one or more pads on an upper surface thereof; a component flip-chip mounted on the upper surface of the substrate with one or more bumps bonded to the one or more pads; and an additional film located on a lower surface of the substrate and overlapping with at least a part of a smaller one of the pad and the bump in each of one or more pad/bump pairs, the one or more pad/bump pairs being composed of the one or more pads and the one or more bumps bonded to each other.

Abstract translation: 电子部件包括：由陶瓷形成的基板，在其上表面上包括一个或多个焊盘; 安装在所述基板的上表面上的部件倒装芯片，其中一个或多个凸起焊接到所述一个或多个焊盘; 以及位于所述基板的下表面上并且与一个或多个垫/凸块对中的每一个中的所述焊盘和所述凸块中的较小一个的至少一部分重叠的附加膜，所述一个或多个焊盘/凸块对被组成 的一个或多个焊盘和一个或多个凸块彼此粘接。

公开(公告)号：US20190326878A1

公开(公告)日：2019-10-24

申请号：US16375512

申请日：2019-04-04

Applicant: TAIYO YUDEN CO., LTD.

Inventor： Naoki KAKITA ,  Osamu KAWACHI ,  Rei OIKAWA

IPC: H03H9/02 ,  H01L41/047 ,  H01L41/083 ,  H01L41/312 ,  H03H3/08

Abstract: An acoustic wave resonator includes: a support substrate; a piezoelectric substrate located on the support substrate; a first amorphous layer that is in contact with the support substrate and is mainly composed of one or more constituent elements of the support substrate; a second amorphous layer that is in contact with the piezoelectric substrate and the first amorphous layer, is mainly composed of one or more constituent elements of the piezoelectric substrate, and is thinner than the first amorphous layer; and a pair of comb-shaped electrodes that is located on an opposite surface of the piezoelectric substrate from the support substrate, each of the pair of comb-shaped electrodes including electrode fingers.

公开(公告)号：US20150036304A1

公开(公告)日：2015-02-05

申请号：US14326071

申请日：2014-07-08

Applicant: TAIYO YUDEN CO., LTD.

Inventor： Motoi YAMAUCHI ,  Osamu KAWACHI

IPC: H05K1/11 ,  H05K1/02

CPC classification number: H01L21/561 ,  H01L23/04 ,  H01L24/95 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2924/12042 ,  H01L2924/15174 ,  H01L2924/15787 ,  H01L2924/181 ,  H03H9/02913 ,  H03H9/1007 ,  H03H9/1085 ,  H03H2009/0019 ,  H05K1/0209 ,  H05K1/0216 ,  H05K1/0243 ,  H05K1/141 ,  H05K3/284 ,  H05K3/303 ,  H05K3/3436 ,  H05K2201/0305 ,  H05K2201/049 ,  H05K2201/068 ,  H05K2201/10068 ,  H05K2201/10371 ,  H05K2201/10537 ,  H05K2201/1056 ,  H05K2201/10674 ,  H05K2203/1316 ,  H01L2924/00

Abstract: An electronic device includes: a wiring substrate; a plurality of device chips that are flip-chip mounted on an upper surface of the wiring substrate through bumps, have gaps which expose the bumps between the device chips and the upper surface of the wiring substrate, and include at least one device chip that has a substrate having a thermal expansion coefficient more than a thermal expansion coefficient of the wiring substrate; a junction substrate that is joined to the plurality of device chips, and has a thermal expansion coefficient equal to or less than the thermal expansion coefficient of the substrate included in the at least one device chip; and a sealer that covers the junction substrate, and seals the plurality of device chips.

Abstract translation: 电子设备包括：布线基板; 通过凸块倒装安装在布线基板的上表面上的多个器件芯片具有露出器件芯片与布线基板的上表面之间的凸块的间隙，并且包括至少一个器件芯片， 具有大于所述布线基板的热膨胀系数的热膨胀系数的基板; 连接到所述多个器件芯片的接合衬底，并且具有等于或小于所述至少一个器件芯片中包括的衬底的热膨胀系数的热膨胀系数; 以及覆盖接合基板的密封件，并且密封多个器件芯片。

公开(公告)号：US20140341090A1

公开(公告)日：2014-11-20

申请号：US14447265

申请日：2014-07-30

Applicant: TAIYO YUDEN CO., LTD.

Inventor： Osamu KAWACHI ,  Kensei UEHARA

IPC: H04L5/14 ,  H04B1/00

CPC classification number: H04L5/1461 ,  H03H9/0576 ,  H03H9/725 ,  H04B1/0057 ,  H04B1/0064 ,  H04B7/0617 ,  H04B7/0682 ,  H04B7/10

Abstract: A filter circuit includes: a first transmission filter connected between a first antenna terminal and a first transmission terminal; a second transmission filter connected between the first antenna terminal and a second transmission terminal; a first reception filter connected between a second antenna terminal and a first reception terminal, the second antenna terminal being connected to an antenna different from an antenna to which the first antenna terminal is connected; and a second reception filter connected between the second antenna terminal and a second reception terminal.

Abstract translation: 滤波电路包括：连接在第一天线端子和第一传输端之间的第一传输滤波器; 连接在第一天线端子和第二传输端子之间的第二传输滤波器; 连接在第二天线端子和第一接收端子之间的第一接收滤波器，所述第二天线端子连接到与所述第一天线端子所连接的天线不同的天线; 以及连接在第二天线端子和第二接收端子之间的第二接收滤波器。

公开(公告)号：US20130307636A1

公开(公告)日：2013-11-21

申请号：US13759402

申请日：2013-02-05

Applicant: TAIYO YUDEN CO., LTD.

Inventor： Kanehisa KIMBARA ,  Osamu KAWACHI

IPC: H03H9/70

CPC classification number: H03H9/46 ,  H03H9/0542 ,  H03H9/70 ,  H05K1/0271 ,  H05K1/113 ,  H05K1/181 ,  H05K2201/1006 ,  H05K2201/10068 ,  H05K2201/10204 ,  H05K2201/2045 ,  Y02P70/611

Abstract: A composite electronic component includes: a circuit board; a package that includes an acoustic wave filter and is located on a top surface of the circuit board; a dummy package that is located on the top surface of the circuit board; and a lid that is located above the package and the dummy package.

Abstract translation: 复合电子部件包括：电路板; 包括声波滤波器并且位于电路板的顶表面上的封装; 位于电路板的顶表面上的虚拟封装; 以及位于包装和虚拟包装上方的盖子。