-
公开(公告)号：US09160825B2
公开(公告)日：2015-10-13
申请号：US14481779
申请日：2014-09-09
Applicant: TAIYO YUDEN CO., LTD.
Inventor： Tetsuo Saji , Yohei Ichikawa , Hiroshi Nakamura
CPC classification number: H04M1/026 , H01L24/20 , H01L2224/04105 , H01L2224/12105 , H01L2224/16225 , H01L2224/73267 , H01L2924/0002 , H01L2924/19105 , H04B1/38 , H04B1/3888 , H04B15/02 , H04B15/04 , H05K1/0218 , H05K1/0243 , H05K3/284 , H05K9/0022 , H05K9/0045 , H05K2201/0715 , H05K2201/10371 , H01L2924/00
Abstract: A communication module includes a circuit substrate having a first high-frequency processing section related to mobile phone communication, a second high-frequency processing section that processes reception signals related to satellite positioning systems, a system section having a baseband processing section and application processing section, and a power circuit section, a sealing member covering the electronic components mounted on the circuit substrate, a conductive shield layer formed on a surface of the sealing member, and a shield wall formed in the sealing member so as to demarcate a mounting area of the first high-frequency processing section and a mounting area of the second high-frequency processing section.
Abstract translation: 通信模块包括具有与移动电话通信相关的第一高频处理部分的电路基板，处理与卫星定位系统相关的接收信号的第二高频处理部分，具有基带处理部分和应用处理部分的系统部分 以及电源电路部，覆盖安装在电路基板上的电子部件的密封部件，形成在密封部件的表面上的导电性屏蔽层和形成在密封部件中的屏蔽壁， 第一高频处理部和第二高频处理部的安装区域。
-
公开(公告)号：US08912802B2
公开(公告)日：2014-12-16
申请号：US14217002
申请日：2014-03-17
Applicant: Taiyo Yuden Co., Ltd.
Inventor： Shigeo Sakurai , Tetsuo Saji
CPC classification number: G01R31/048 , G01R27/26 , G01R31/028 , G01R31/2812 , G01R31/2813 , H05K1/0231 , H05K1/0268 , H05K1/185 , H05K3/4602 , H05K2201/10522 , H05K2201/10636 , Y02P70/611
Abstract: In a component-embedded circuit substrate having a plurality of capacitors embedded therein, the capacitors are connected in parallel, inspection electrodes are formed, and the inspection electrodes connect to respective terminal electrodes of the capacitor through via conductors. At the terminal electrodes of the capacitor, the connection position of the via conductors for connecting the inspection electrodes differs from the connection position of via conductors for connecting respective terminal electrodes of the capacitor.
Abstract translation: 在嵌入有多个电容器的分量嵌入式电路基板中，并联连接电容器，形成检查电极，检查电极通过通孔导体与电容器的各个端子电极连接。 在电容器的端子电极上，用于连接检查电极的通路导体的连接位置与用于连接电容器的各个端子电极的通路导体的连接位置不同。
-
公开(公告)号：US20140051368A1
公开(公告)日：2014-02-20
申请号：US14056721
申请日：2013-10-17
Applicant: TAIYO YUDEN CO., LTD.
Inventor： Tetsuo Saji , Hiroshi Nakamura
IPC: H04B15/00
Abstract: Provided is a high-frequency module that can prevent a transmission signal from reaching a reception circuit and that can achieve high mounting density. A first duplexer for a first frequency band is mounted on a circuit substrate, and a second transmission filter and a second reception filter that constitute a second duplexer for a second frequency band are embedded in the circuit substrate. The second transmission filter and the second reception filter are embedded in the circuit substrate in locations that overlap at least a part of a projection region that is formed by projecting the first duplexer in a thickness direction of the circuit substrate. The first frequency band and the second frequency band are separated from each other by at least a prescribed frequency range.
-
公开(公告)号：US09705557B2
公开(公告)日：2017-07-11
申请号：US14994847
申请日：2016-01-13
Applicant: TAIYO YUDEN CO., LTD.
Inventor： Tetsuo Saji , Yuki Endo , Nobuaki Matsuo
CPC classification number: H04B1/44 , H04B1/0057 , H04B1/0064 , H04B15/02
Abstract: A front end circuit includes: a first antenna terminal from/to which transmission/reception signals of a low band (LB) and a high band (HB); a second antenna terminal from/to which a transmission/reception signal of a middle band (MB) is output/input; an LB terminal to/from which the transmission/reception signal of the LB is input/output, an MB terminal to/from which the transmission/reception signal of the MB is input/output; an HB terminal to/from which the transmission/reception signal of the HB is input/output; and a separating circuit that passes the transmission and reception signals of the LB and suppresses the transmission and reception signals of the MB and the HB between the first antenna terminal and the LB terminal, and that passes the transmission and reception signals of the HB and suppresses the transmission and reception signals of the LB and the MB between the first antenna terminal and the HB terminal.
-
公开(公告)号：US09526165B2
公开(公告)日：2016-12-20
申请号：US14072648
申请日：2013-11-05
Applicant: TAIYO YUDEN CO., LTD.
Inventor： Tetsuo Saji , Hiroshi Nakamura
CPC classification number: H05K1/025 , H05K1/0298
Abstract: A multilayer circuit substrate includes: a first signal line and a first ground conductor formed in a first conductive layer; and a second signal line and a second ground conductor formed in a second conductive layer, the second conductive layer facing the first conductive layer via an insulating layer. The first signal line intersects with the second signal line in a plan view of the multilayer circuit substrate, and a space between the first ground conductor and first signal line is smaller in an intersection area of the first and second signal lines than a space in a non-intersection area, and a space between the second ground conductor and second signal line is smaller in the intersection area than a space in the non-intersection area.
Abstract translation: 多层电路基板包括：第一信号线和形成在第一导电层中的第一接地导体; 以及形成在第二导电层中的第二信号线和第二接地导体，所述第二导电层经由绝缘层面对所述第一导电层。 第一信号线在多层电路基板的俯视图中与第二信号线相交，第一和第二信号线的交叉区域中的第一接地导体与第一信号线的间隔比第 非交叉区域，并且第二接地导体和第二信号线之间的空间在交叉区域中比在非交叉区域中的空间小。
-
Patent Agency Ranking
公开(公告)号：US09065539B2
公开(公告)日：2015-06-23
申请号：US14275788
申请日：2014-05-12
Applicant: TAIYO YUDEN CO., LTD.
Inventor： Tetsuo Saji , Hiroshi Nakamura
CPC classification number: H04B1/40 , H04B1/3805 , H04B1/525 , H04W88/10
Abstract: A circuit module includes: an RFIC that has a transceiver circuit for processing high-frequency signals related to mobile phone communication and a reception circuit for processing reception signals related to GPS, which is a satellite positioning system; GPS front end components; and mobile phone front end components. The mobile phone front end components are mounted on one main surface of a circuit substrate, and at least one of the GPS front end components (a second band-pass filter) is embedded in the circuit substrate.
Abstract translation: 电路模块包括：具有用于处理与移动电话通信有关的高频信号的收发器电路的RFIC和用于处理与作为卫星定位系统的GPS相关的接收信号的接收电路; GPS前端部件; 和手机前端组件。 移动电话前端部件安装在电路基板的一个主表面上，并且至少一个GPS前端部件（第二带通滤波器）嵌入在电路基板中。
-
公开(公告)号：US08897019B1
公开(公告)日：2014-11-25
申请号：US14103620
申请日：2013-12-11
Applicant: Taiyo Yuden Co., Ltd.
Inventor： Masaya Shimamura , Kenzo Kitazaki , Eiji Mugiya , Tetsuo Saji , Atsushi Tsunoda , Hiroshi Nakamura
CPC classification number: H01L24/97 , H01L23/3121 , H01L23/552 , H01L24/13 , H01L24/16 , H01L2224/131 , H01L2224/16225 , H01L2224/97 , H01L2924/15159 , H01L2924/181 , H01L2924/1815 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/19105 , H05K9/003 , H01L2224/81 , H01L2924/014 , H01L2924/00
Abstract: There is provided a circuit module, including: a circuit substrate including a mount surface; a mounting component mounted on the mount surface; a sealing body that is formed on the mount surface, covers the mounting component, and includes a trench formed from a main surface of the sealing body toward the mount surface, the trench including a first trench portion extending in one of a parallel direction and an orthogonal direction with respect to a direction parallel to the main surface and a second trench portion that is connected to the first trench portion, is parallel to the main surface, and extends in a direction that is not parallel nor orthogonal to the first trench portion; and a shield that covers the sealing body and includes an inner shield portion formed inside the trench and an outer shield portion provided on the main surface and the inner shield portion.
Abstract translation: 提供了一种电路模块，包括：包括安装表面的电路基板; 安装在安装表面上的安装部件; 形成在安装面上的密封体覆盖安装部件，并且包括由密封体的主表面朝向安装面形成的沟槽，该沟槽包括沿平行方向延伸的第一沟槽部分和 相对于与主表面平行的方向的正交方向和与第一沟槽部分连接的第二沟槽部分平行于主表面，并且在不平行或不垂直于第一沟槽部分的方向上延伸; 以及覆盖所述密封体并且包括形成在所述沟槽内的内屏蔽部和设置在所述主表面和所述内屏蔽部上的外屏蔽部的屏蔽。
-
公开(公告)号：US08725086B2
公开(公告)日：2014-05-13
申请号：US14056758
申请日：2013-10-17
Applicant: Taiyo Yuden Co., LTD
Inventor： Tetsuo Saji , Hiroshi Nakamura
IPC: H04B1/44
Abstract: Provided is a high-frequency module that can prevent a transmission signal from reaching a reception circuit and that can achieve high mounting density. A first duplexer for a first frequency band is mounted on a circuit substrate, and a second transmission filter and a second reception filter that constitute a second duplexer for a second frequency band are embedded in the circuit substrate. The second transmission filter and the second reception filter are embedded in the circuit substrate in locations that overlap at least a part of a projection region that is formed by projecting the first duplexer in a thickness direction of the circuit substrate. The first frequency band and the second frequency band are separated from each other by at least a prescribed frequency range.
-
公开(公告)号：US20140051371A1
公开(公告)日：2014-02-20
申请号：US14058035
申请日：2013-10-18
Applicant: TAIYO YUDEN CO., LTD.
Inventor： Tetsuo Saji , Hiroshi Nakamura
IPC: H04B15/00
Abstract: Provided is a high-frequency module that can prevent a transmission signal from reaching a reception circuit and that can achieve high mounting density. A first duplexer for a first frequency band is mounted on a circuit substrate, and a second transmission filter and a second reception filter that constitute a second duplexer for a second frequency band are embedded in the circuit substrate. The second transmission filter and the second reception filter are embedded in the circuit substrate in locations that overlap at least a part of a projection region that is formed by projecting the first duplexer in a thickness direction of the circuit substrate. The first frequency band and the second frequency band are separated from each other by at least a prescribed frequency range.
-
公开(公告)号：US20140051370A1
公开(公告)日：2014-02-20
申请号：US14058014
申请日：2013-10-18
Applicant: TAIYO YUDEN CO., LTD.
Inventor： Tetsuo Saji , Hiroshi Nakamura
IPC: H04B15/00
Abstract: Provided is a high-frequency module that can prevent a transmission signal from reaching a reception circuit and that can achieve high mounting density. A first duplexer for a first frequency band is mounted on a circuit substrate, and a second transmission filter and a second reception filter that constitute a second duplexer for a second frequency band are embedded in the circuit substrate. The second transmission filter and the second reception filter are embedded in the circuit substrate in locations that overlap at least a part of a projection region that is formed by projecting the first duplexer in a thickness direction of the circuit substrate. The first frequency band and the second frequency band are separated from each other by at least a prescribed frequency range.
-
-
-
-
-
-
-
-
-
Search Results
34
records
(took 0.019 seconds)
