公开(公告)号：US20200185308A1

公开(公告)日：2020-06-11

申请号：US16788695

申请日：2020-02-12

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Chia-Yu Chang ,  Chih-Chien Ho ,  Steven Su

IPC: H01L23/495 ,  H01L23/00 ,  G06F30/394

Abstract: A leadframe includes a first die attach pad (“DAP”) having a first longitudinally extending edge surface and a second DAP having a first longitudinally extending edge surface. The second DAP is positioned with the first longitudinally extending edge surface thereof in adjacent, laterally and vertically spaced relationship with the first longitudinally extending edge surface of the first DAP.

公开(公告)号：US10529654B2

公开(公告)日：2020-01-07

申请号：US16143148

申请日：2018-09-26

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Yuh-Harng Chien ,  Chih-Chien Ho ,  Steven Su

IPC: H01L23/495 ,  H01L23/31 ,  H01L23/498 ,  H01L23/00 ,  H01L25/065 ,  H01L25/18 ,  H01L21/56

Abstract: A leadframe includes a plurality of interconnected support members. A pair of die pads is connected to the support members and configured to receive a pair of dies electrically connected by at least one wire. A support bracket extends between the die pads and includes a surface for maintaining the at least one wire at a predetermined distance from the die pads during overmolding of the leadframe.

公开(公告)号：US20180211905A1

公开(公告)日：2018-07-26

申请号：US15924767

申请日：2018-03-19

Applicant: Texas Instruments Incorporated

Inventor： Chia-Yu Chang ,  Chih-Chien Ho ,  Steven Su

IPC: H01L23/495 ,  H01L23/31 ,  H01L23/13 ,  H01L23/00

CPC classification number: H01L23/49551 ,  H01L23/13 ,  H01L23/3107 ,  H01L23/3121 ,  H01L23/3157 ,  H01L23/49503 ,  H01L23/49517 ,  H01L23/4952 ,  H01L23/49534 ,  H01L23/49575 ,  H01L24/48 ,  H01L2224/45015 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2924/10253 ,  H01L2924/10271 ,  H01L2924/10329 ,  H01L2924/1033 ,  H01L2924/14 ,  H01L2924/19105 ,  H01L2924/00014 ,  H01L2924/20752 ,  H01L2924/00

Abstract: A leadframe (100) comprises a frame (101) of sheet metal in a first planar level, where the frame has metallic leads (110) and a first metallic pad (120) extending inward from the frame, and the first pad is tied to the frame by first metallic straps (120a). The leadframe further has a second metallic pad (130) in a second planar level parallel to and spaced from the first level, where the second pad is tied by second metallic straps (132) to the frame. In addition, the leadframe has a third metallic pad (140) in a third planar level parallel to and spaced from the second level and additively from the first level, where the third pad is tied by third metallic straps (131) to the second pad.

公开(公告)号：US08546184B2

公开(公告)日：2013-10-01

申请号：US13734239

申请日：2013-01-04

Applicant: Texas Instruments Incorporated

Inventor： Chih-Chien Ho ,  Saihsi Jen ,  Eric Hsieh

IPC: H01L21/00

CPC classification number: H01L24/80 ,  H01L23/3107 ,  H01L23/49503 ,  H01L23/49513 ,  H01L23/498 ,  H01L23/4985 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L24/83 ,  H01L24/92 ,  H01L24/97 ,  H01L2224/16225 ,  H01L2224/16245 ,  H01L2224/26175 ,  H01L2224/27013 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/32257 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/48471 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2224/83192 ,  H01L2224/83385 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01029 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/81 ,  H01L2224/85 ,  H01L2224/83 ,  H01L2224/92247 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A method of forming an electronic assembly includes dispensing a die attach material on a substrate into a recessed portion that includes an inner recessed portion of including a die pad. The die attach material is not dispensed on an outer raised flat portion of the die pad. A semiconductor die is attached directly on the outer raised flat portion and affixed to the die pad with said die attach material in said interior recessed portion but not on said outer raised flat portion.

Abstract translation: 一种形成电子组件的方法包括将基片上的管芯附着材料分配到包括包括管芯焊盘的内凹部的凹部中。 管芯附接材料不分配在管芯焊盘的外部凸起的平坦部分上。 将半导体管芯直接安装在外部凸起的平坦部分上，并将所述管芯附接材料固定到管芯焊盘，所述管芯附接材料在所述内部凹部中，而不在所述外部凸起的平坦部分上。

公开(公告)号：US10811343B2

公开(公告)日：2020-10-20

申请号：US16253151

申请日：2019-01-21

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Yuh-Harng Chien ,  Chih-Chien Ho ,  Steven Su

IPC: H01L23/495 ,  H01L23/31 ,  H01L23/498 ,  H01L23/00 ,  H01L25/065 ,  H01L25/18 ,  H01L21/56

Abstract: A leadframe includes a plurality of interconnected support members. A pair of die pads is connected to the support members and configured to receive a pair of dies electrically connected by at least one wire. A support bracket extends between the die pads and includes a surface for maintaining the at least one wire at a predetermined distance from the die pads during overmolding of the leadframe.

公开(公告)号：US10395971B2

公开(公告)日：2019-08-27

申请号：US15852532

申请日：2017-12-22

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Chang-Yen Ko ,  Chung-Ming Cheng ,  Megan Chang ,  Chih-Chien Ho

IPC: H01L23/02 ,  H01L21/762 ,  H01L23/00 ,  H01L21/306 ,  H05K3/38

Abstract: An apparatus includes a lead frame, a dam and adhesive on portions of the lead frame, and an integrated circuit die having a portion on the dam and another portion on the adhesive. The lead frame can include two portions, or two lead frames. The dam can bridge a space between the two lead frames. The dam can be smaller than the integrated circuit die in at least a width dimension of the dam relative to a width dimension of the integrated circuit die, providing that the integrated circuit die overhangs the dam on each side of the width dimension of the dam. Adhesive is located between the integrated circuit die and each lead frame, adjacent to and on each side of the dam. The dam prevents adhesive from spreading into the space between the lead frames.

公开(公告)号：US10229868B2

公开(公告)日：2019-03-12

申请号：US15896971

申请日：2018-02-14

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Yuh-Harng Chien ,  Chih-Chien Ho ,  Steven Su

IPC: H01L23/495 ,  H01L23/31 ,  H01L23/498 ,  H01L23/00 ,  H01L25/065 ,  H01L25/18 ,  H01L21/56

Abstract: A leadframe includes a plurality of interconnected support members. A pair of die pads is connected to the support members and configured to receive a pair of dies electrically connected by at least one wire. A support bracket extends between the die pads and includes a surface for maintaining the at least one wire at a predetermined distance from the die pads during overmolding of the leadframe.

公开(公告)号：US10121733B2

公开(公告)日：2018-11-06

申请号：US15447406

申请日：2017-03-02

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Yuh-Harng Chien ,  Chih-Chien Ho ,  Steven Su

IPC: H01L23/495 ,  H01L23/31 ,  H01L23/498 ,  H01L23/00 ,  H01L25/065 ,  H01L25/18 ,  H01L21/56

Abstract: A leadframe includes a plurality of interconnected support members. A pair of die pads is connected to the support members and configured to receive a pair of dies electrically connected by at least one wire. A support bracket extends between the die pads and includes a surface for maintaining the at least one wire at a predetermined distance from the die pads during overmolding of the leadframe.

公开(公告)号：US09922908B2

公开(公告)日：2018-03-20

申请号：US14973927

申请日：2015-12-18

Applicant: Texas Instruments Incorporated

Inventor： Chia-Yu Chang ,  Chih-Chien Ho ,  Steven Su

IPC: H01L23/495 ,  H01L21/00 ,  H05K7/18 ,  H01L23/31 ,  H01L23/13 ,  H01L23/00

CPC classification number: H01L23/49551 ,  H01L23/13 ,  H01L23/3107 ,  H01L23/3121 ,  H01L23/3157 ,  H01L23/49503 ,  H01L23/49517 ,  H01L23/4952 ,  H01L23/49534 ,  H01L23/49575 ,  H01L24/48 ,  H01L2224/45015 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2924/10253 ,  H01L2924/10271 ,  H01L2924/10329 ,  H01L2924/1033 ,  H01L2924/14 ,  H01L2924/19105 ,  H01L2924/00014 ,  H01L2924/20752 ,  H01L2924/00

Abstract: A leadframe (100) comprises a frame (101) of sheet metal in a first planar level, where the frame has metallic leads (110) and a first metallic pad (120) extending inward from the frame, and the first pad is tied to the frame by first metallic straps (120a). The leadframe further has a second metallic pad (130) in a second planar level parallel to and spaced from the first level, where the second pad is tied by second metallic straps (132) to the frame. In addition, the leadframe has a third metallic pad (140) in a third planar level parallel to and spaced from the second level and additively from the first level, where the third pad is tied by third metallic straps (133) to the second pad.

公开(公告)号：US20170194236A1

公开(公告)日：2017-07-06

申请号：US15447406

申请日：2017-03-02

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Yuh-Harng Chien ,  Chih-Chien Ho ,  Steven Su

IPC: H01L23/495 ,  H01L25/18 ,  H01L23/498 ,  H01L23/31 ,  H01L23/00 ,  H01L25/065

CPC classification number: H01L23/49541 ,  H01L21/56 ,  H01L23/3121 ,  H01L23/49503 ,  H01L23/49551 ,  H01L23/49575 ,  H01L23/49861 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L25/0655 ,  H01L25/18 ,  H01L2224/05554 ,  H01L2224/2919 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48137 ,  H01L2224/48138 ,  H01L2224/49175 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/0665 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/17747 ,  H01L2224/05599 ,  H01L2224/85399

Abstract: A leadframe includes a plurality of interconnected support members. A pair of die pads is connected to the support members and configured to receive a pair of dies electrically connected by at least one wire. A support bracket extends between the die pads and includes a surface for maintaining the at least one wire at a predetermined distance from the die pads during overmolding of the leadframe.