公开(公告)号：US20250105086A1

公开(公告)日：2025-03-27

申请号：US18471739

申请日：2023-09-21

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Chun-Yen Lan ,  Chih-Chien Pan ,  Pu Wang ,  Li-Hui Cheng ,  Ying-Ching Shih

IPC: H01L23/367 ,  H01L23/00 ,  H01L25/16 ,  H01L25/18 ,  H10B80/00

Abstract: Various embodiments include integrated circuit packages and methods of forming integrated circuit packages. In an embodiment, a device includes: a package substrate; an integrated circuit device attached to the package substrate; a stiffener ring around the integrated circuit device and attached to the package substrate; a lid attached to the stiffener ring; a channel connected to an area between the lid and the integrated circuit device, the channel extending along at least one side of the integrated circuit device in a top-down view; and a thermal interface material in the channel and in the area between the lid and the integrated circuit device.

公开(公告)号：US11973005B2

公开(公告)日：2024-04-30

申请号：US17392904

申请日：2021-08-03

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Yu-Hsun Wang ,  Ping-Yin Hsieh ,  Pu Wang ,  Li-Hui Cheng ,  Szu-Wei Lu

IPC: H01L25/00 ,  H01L23/367 ,  H01L23/433 ,  H01L25/065 ,  H01L23/498 ,  H01L25/18

CPC classification number: H01L23/433 ,  H01L23/3675 ,  H01L25/0652 ,  H01L25/0655 ,  H01L25/50 ,  H01L23/49833 ,  H01L25/18

Abstract: A method includes bonding a first package and a second package over a package component, adhering a first Thermal Interface Material (TIM) and a second TIM over the first package and the second package, respectively, dispensing an adhesive feature on the package component, and placing a heat sink over and contacting the adhesive feature. The heat sink includes a portion over the first TIM and the second TIM. The adhesive feature is then cured.

公开(公告)号：US11705381B2

公开(公告)日：2023-07-18

申请号：US17375304

申请日：2021-07-14

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Chih-Hao Chen ,  Hung-Yu Chen ,  Pu Wang ,  Li-Hui Cheng ,  Szu-Wei Lu

IPC: H01L23/373 ,  H01L23/31 ,  H01L23/04 ,  H01L23/40 ,  H01L21/48

CPC classification number: H01L23/3737 ,  H01L21/4882 ,  H01L23/04 ,  H01L23/3128 ,  H01L23/4006 ,  H01L2023/4087

Abstract: A method of forming a semiconductor structure includes: attaching a semiconductor device to a first surface of a substrate; placing a thermal interface material (TIM) film over a first side of the semiconductor device distal from the substrate, where the TIM film is pre-formed before the placing, where after the placing, a peripheral portion of the TIM film extends laterally beyond sidewalls of the semiconductor device; and attaching a lid to the first surface of the substrate to form an enclosed space between the lid and the substrate, where after attaching the lid, the semiconductor device and the TIM film are disposed in the enclosed space, where a first side of the TIM film distal from the substrate contacts the lid.

公开(公告)号：US20230014913A1

公开(公告)日：2023-01-19

申请号：US17686856

申请日：2022-03-04

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Chih-Hao Chen ,  Po-Yuan Cheng ,  Pu Wang ,  Li-Hui Cheng

IPC: H01L23/367 ,  H01L23/373 ,  H01L23/538 ,  H01L23/00 ,  H01L21/683 ,  H01L21/48

Abstract: In an embodiment, a device includes: a package component including an integrated circuit die and conductive connectors connected to the integrated circuit die, the conductive connectors disposed at a front-side of the package component, the integrated circuit die exposed at a back-side of the package component; a heat dissipation layer on the back-side of the package component and on sidewalls of the package component; an adhesive layer on a back-side of the heat dissipation layer, a portion of a sidewall of the heat dissipation layer being free from the adhesive layer; and a package substrate connected to the conductive connectors.

公开(公告)号：US20220392823A1

公开(公告)日：2022-12-08

申请号：US17375304

申请日：2021-07-14

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Chih-Hao Chen ,  Hung-Yu Chen ,  Pu Wang ,  Li-Hui Cheng ,  Szu-Wei Lu

IPC: H01L23/373 ,  H01L23/31 ,  H01L23/04 ,  H01L23/40 ,  H01L21/48

Abstract: A method of forming a semiconductor structure includes: attaching a semiconductor device to a first surface of a substrate; placing a thermal interface material (TIM) film over a first side of the semiconductor device distal from the substrate, where the TIM film is pre-formed before the placing, where after the placing, a peripheral portion of the TIM film extends laterally beyond sidewalls of the semiconductor device; and attaching a lid to the first surface of the substrate to form an enclosed space between the lid and the substrate, where after attaching the lid, the semiconductor device and the TIM film are disposed in the enclosed space, where a first side of the TIM film distal from the substrate contacts the lid.

公开(公告)号：US20220359345A1

公开(公告)日：2022-11-10

申请号：US17392904

申请日：2021-08-03

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd

Inventor： Yu-Hsun Wang ,  Ping-Yin Hsieh ,  Pu Wang ,  Li-Hui Cheng ,  Szu-Wei Lu

IPC: H01L23/433 ,  H01L25/065 ,  H01L23/367 ,  H01L25/00

Abstract: A method includes bonding a first package and a second package over a package component, adhering a first Thermal Interface Material (TIM) and a second TIM over the first package and the second package, respectively, dispensing an adhesive feature on the package component, and placing a heat sink over and contacting the adhesive feature. The heat sink includes a portion over the first TIM and the second TIM. The adhesive feature is then cured.

公开(公告)号：US12132004B2

公开(公告)日：2024-10-29

申请号：US17818797

申请日：2022-08-10

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Chih-Hao Chen ,  Pu Wang ,  Li-Hui Cheng ,  Szu-Wei Lu

IPC: H01L23/538 ,  H01L21/48 ,  H01L21/56 ,  H01L21/683 ,  H01L23/00 ,  H01L23/31 ,  H01L25/00 ,  H01L25/065 ,  H01L25/10

CPC classification number: H01L23/5389 ,  H01L21/4853 ,  H01L21/4857 ,  H01L21/565 ,  H01L21/568 ,  H01L21/6835 ,  H01L23/3128 ,  H01L23/5383 ,  H01L23/5386 ,  H01L24/19 ,  H01L24/20 ,  H01L25/0657 ,  H01L25/105 ,  H01L25/50 ,  H01L2221/68372 ,  H01L2224/214 ,  H01L2225/0651 ,  H01L2225/1035 ,  H01L2225/1058

Abstract: Semiconductor devices and methods of manufacture are provided, in which an adhesive is removed from a semiconductor die embedded within an encapsulant, and an interface material is utilized to remove heat from the semiconductor device. The removal of the adhesive leaves behind a recess adjacent to a sidewall of the semiconductor, and the recess is filled.

公开(公告)号：US12100640B2

公开(公告)日：2024-09-24

申请号：US18328387

申请日：2023-06-02

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Chih-Hao Chen ,  Hung-Yu Chen ,  Pu Wang ,  Li-Hui Cheng ,  Szu-Wei Lu

IPC: H01L23/373 ,  H01L21/48 ,  H01L23/04 ,  H01L23/31 ,  H01L23/40

CPC classification number: H01L23/3737 ,  H01L21/4882 ,  H01L23/04 ,  H01L23/3128 ,  H01L23/4006 ,  H01L2023/4087

Abstract: A method of forming a semiconductor structure includes: attaching a semiconductor device to a first surface of a substrate; placing a thermal interface material (TIM) film over a first side of the semiconductor device distal from the substrate, where the TIM film is pre-formed before the placing, where after the placing, a peripheral portion of the TIM film extends laterally beyond sidewalls of the semiconductor device; and attaching a lid to the first surface of the substrate to form an enclosed space between the lid and the substrate, where after attaching the lid, the semiconductor device and the TIM film are disposed in the enclosed space, where a first side of the TIM film distal from the substrate contacts the lid.

公开(公告)号：US20240014100A1

公开(公告)日：2024-01-11

申请号：US18366481

申请日：2023-08-07

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Yu-Hsun Wang ,  Ping-Yin Hsieh ,  Pu Wang ,  Li-Hui Cheng ,  Szu-Wei Lu

IPC: H01L23/433 ,  H01L25/065 ,  H01L25/00 ,  H01L23/367

CPC classification number: H01L23/433 ,  H01L25/0655 ,  H01L25/0652 ,  H01L25/50 ,  H01L23/3675 ,  H01L25/18

Abstract: A method includes bonding a first package and a second package over a package component, adhering a first Thermal Interface Material (TIM) and a second TIM over the first package and the second package, respectively, dispensing an adhesive feature on the package component, and placing a heat sink over and contacting the adhesive feature. The heat sink includes a portion over the first TIM and the second TIM. The adhesive feature is then cured.

公开(公告)号：US11515267B2

公开(公告)日：2022-11-29

申请号：US17113396

申请日：2020-12-07

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Chih-Wei Wu ,  Li-Chung Kuo ,  Pu Wang ,  Ying-Ching Shih ,  Szu-Wei Lu ,  Kung-Chen Yeh

IPC: H01L23/00 ,  H01L21/56 ,  H01L21/3105 ,  H01L21/48 ,  H01L25/00 ,  H01L23/31 ,  H01L25/18 ,  H01L23/498 ,  H01L21/78

Abstract: A method includes bonding a second package component to a first package component, bonding a third package component to the first package component, attaching a dummy die to the first package component, encapsulating the second package component, the third package component, and the dummy die in an encapsulant, and performing a planarization process to level a top surface of the second package component with a top surface of the encapsulant. After the planarization process, an upper portion of the encapsulant overlaps the dummy die. The dummy die is sawed-through to separate the dummy die into a first dummy die portion and a second dummy die portion. The upper portion of the encapsulant is also sawed through.