公开(公告)号：US12087733B2

公开(公告)日：2024-09-10

申请号：US17383911

申请日：2021-07-23

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Kuan-Yu Huang ,  Li-Chung Kuo ,  Sung-Hui Huang ,  Shang-Yun Hou

IPC: H01L25/065 ,  H01L23/00 ,  H01L23/31 ,  H01L23/498 ,  H01L25/00 ,  H01L25/18

CPC classification number: H01L25/0655 ,  H01L23/3185 ,  H01L23/49833 ,  H01L24/32 ,  H01L24/33 ,  H01L24/73 ,  H01L24/92 ,  H01L25/50 ,  H01L25/18 ,  H01L2224/32057 ,  H01L2224/33051 ,  H01L2224/33152 ,  H01L2224/3316 ,  H01L2224/73204 ,  H01L2224/9211 ,  H01L2224/92125

Abstract: A method includes bonding a first package component over a second package component, dispensing a first underfill between the first package component and the second package component, and bonding a third package component over the second package component. A second underfill is between the third package component and the second package component. The first underfill and the second underfill are different types of underfills.

公开(公告)号：US11852868B2

公开(公告)日：2023-12-26

申请号：US17873779

申请日：2022-07-26

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Chen-Hua Yu ,  Hsing-Kuo Hsia ,  Kuo-Chiang Ting ,  Sung-Hui Huang ,  Shang-Yun Hou ,  Chi-Hsi Wu

IPC: G02B6/122 ,  G02B6/12

CPC classification number: G02B6/1225 ,  G02B6/12019 ,  G02B2006/1213

Abstract: A device includes a first package connected to an interconnect substrate, wherein the interconnect substrate includes conductive routing; and a second package connected to the interconnect substrate, wherein the second package includes a photonic layer on a substrate, the photonic layer including a silicon waveguide coupled to a grating coupler and to a photodetector; a via extending through the substrate; an interconnect structure over the photonic layer, wherein the interconnect structure is connected to the photodetector and to the via; and an electronic die bonded to the interconnect structure, wherein the electronic die is connected to the interconnect structure.

公开(公告)号：US20230378132A1

公开(公告)日：2023-11-23

申请号：US18150525

申请日：2023-01-05

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Wen-Wei Shen ,  Sung-Hui Huang ,  Shang-Yun Hou ,  Sen-Bor Jan ,  Szu-Po Huang ,  Kuan-Yu Huang

IPC: H01L25/065 ,  H01L21/56 ,  H01L23/498 ,  H01L23/538 ,  H01L23/00 ,  H01L21/768

CPC classification number: H01L25/0655 ,  H01L21/565 ,  H01L21/563 ,  H01L23/49838 ,  H01L23/5389 ,  H01L24/05 ,  H01L21/76895 ,  H01L23/49827 ,  H01L2224/05569 ,  H01L2224/16146 ,  H01L2924/3511 ,  H01L24/16

Abstract: A semiconductor device includes: a substrate; a plurality of dies attached to a first side of the substrate; a molding material on the first side of the substrate around the plurality of dies; a first redistribution structure on a second side of the substrate opposing the first side, where the first redistribution structure includes dielectric layers and conductive features in the dielectric layers, where the conductive features include conductive lines, vias, and dummy metal patterns isolated from the conductive lines and the vias; and conductive connectors attached to a first surface of the first redistribution structure facing away from the substrate.

公开(公告)号：US11493689B2

公开(公告)日：2022-11-08

申请号：US16930558

申请日：2020-07-16

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Chen-Hua Yu ,  Hsing-Kuo Hsia ,  Kuo-Chiang Ting ,  Sung-Hui Huang ,  Shang-Yun Hou ,  Chi-Hsi Wu

IPC: G02B6/122 ,  G02B6/12

Abstract: A device includes a first package connected to an interconnect substrate, wherein the interconnect substrate includes conductive routing; and a second package connected to the interconnect substrate, wherein the second package includes a photonic layer on a substrate, the photonic layer including a silicon waveguide coupled to a grating coupler and to a photodetector; a via extending through the substrate; an interconnect structure over the photonic layer, wherein the interconnect structure is connected to the photodetector and to the via; and an electronic die bonded to the interconnect structure, wherein the electronic die is connected to the interconnect structure.

公开(公告)号：US11454773B2

公开(公告)日：2022-09-27

申请号：US17121060

申请日：2020-12-14

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Chen-Hua Yu ,  Hsing-Kuo Hsia ,  Sung-Hui Huang ,  Kuan-Yu Huang ,  Kuo-Chiang Ting ,  Shang-Yun Hou ,  Chi-Hsi Wu

IPC: G02B6/42 ,  H01L23/00 ,  H01L23/48

Abstract: A structure including a photonic integrated circuit die, an electric integrated circuit die, a semiconductor dam, and an insulating encapsulant is provided. The photonic integrated circuit die includes an optical input/output portion and a groove located in proximity of the optical input/output portion, wherein the groove is adapted for lateral insertion of at least one optical fiber. The electric integrated circuit die is disposed over and electrically connected to the photonic integrated circuit die. The semiconductor dam is disposed over the photonic integrated circuit die. The insulating encapsulant is disposed over the photonic integrated circuit die and laterally encapsulates the electric integrated circuit die and the semiconductor dam.

公开(公告)号：US11450580B2

公开(公告)日：2022-09-20

申请号：US16920408

申请日：2020-07-02

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Kuan-Yu Huang ,  Sung-Hui Huang ,  Shang-Yun Hou ,  Chien-Yuan Huang

IPC: H01L23/538 ,  H01L25/065 ,  H01L23/04 ,  H01L21/52 ,  H01L23/31

Abstract: A semiconductor structure and a method for fabricating the same are disclosed. A semiconductor structure includes a first substrate, a package, a second substrate, and a lid. The package is attached to a first side of the first substrate. The second substrate is attached to a second side of the first substrate. The lid is connected to the first substrate and the second substrate. The lid includes a ring part over the first side of the first substrate. The ring part and the first substrate define a space and the package is accommodated in the space. The lid further includes a plurality of overhang parts which extend from corner sidewalls of the ring part toward the second substrate to cover corner sidewalls of the first substrate.

公开(公告)号：US11222867B1

公开(公告)日：2022-01-11

申请号：US16924203

申请日：2020-07-09

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Sung-Hui Huang ,  Shang-Yun Hou ,  Kuan-Yu Huang

IPC: H01L23/48 ,  H01L23/52 ,  H01L29/40 ,  H01L25/065 ,  H01L23/00 ,  H01L23/31 ,  H01L21/56

Abstract: A package includes a first die, a second die, a semiconductor frame, and a reinforcement structure. The first di has a first surface and a second surface opposite to the first surface. The first die includes grooves on the first surface. The second die and the semiconductor frame are disposed side by side over the first surface of the first die. The semiconductor frame has at least one notch exposing the grooves of the first die. The reinforcement structure is disposed on the second surface of the first die. The reinforcement structure includes a first portion aligned with the grooves.

公开(公告)号：US10948668B2

公开(公告)日：2021-03-16

申请号：US16874219

申请日：2020-05-14

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Sung-Hui Huang ,  Jui-Hsieh Lai ,  Shang-Yun Hou

IPC: G02B6/42 ,  H01L25/16

Abstract: A method for forming a package structure is provided, including: disposing an optical component and a waveguide over a first substrate; forming a passivation layer over the first substrate and covering the optical component and the waveguide; removing a portion of the passivation layer to form a first opening; and disposing a reflector over the passivation layer, wherein a metal layer of the reflector is formed in the first opening.

公开(公告)号：US20200278509A1

公开(公告)日：2020-09-03

申请号：US16874219

申请日：2020-05-14

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Sung-Hui Huang ,  Jui-Hsieh Lai ,  Shang-Yun Hou

IPC: G02B6/42 ,  H01L25/16

Abstract: A method for forming a package structure is provided, including: disposing an optical component and a waveguide over a first substrate; forming a passivation layer over the first substrate and covering the optical component and the waveguide; removing a portion of the passivation layer to form a first opening; and disposing a reflector over the passivation layer, wherein a metal layer of the reflector is formed in the first opening.

公开(公告)号：US11916023B2

公开(公告)日：2024-02-27

申请号：US17012255

申请日：2020-09-04

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Sung-Hui Huang ,  Da-Cyuan Yu ,  Kuan-Yu Huang ,  Pai Yuan Li ,  Hsiang-Fan Lee

IPC: H01L21/56 ,  H01L21/48 ,  H01L23/00 ,  H01L23/31 ,  H01L23/367 ,  H01L23/373 ,  H01L23/498 ,  H01L25/00 ,  H01L25/065 ,  H01L25/18

CPC classification number: H01L23/562 ,  H01L21/4853 ,  H01L21/4857 ,  H01L21/486 ,  H01L21/4882 ,  H01L21/563 ,  H01L21/565 ,  H01L23/3114 ,  H01L23/3128 ,  H01L23/3135 ,  H01L23/3675 ,  H01L23/3733 ,  H01L23/3736 ,  H01L23/3737 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/49838 ,  H01L24/32 ,  H01L24/83 ,  H01L25/0655 ,  H01L25/18 ,  H01L25/50 ,  H01L23/367 ,  H01L24/16 ,  H01L24/73 ,  H01L24/97 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/26175 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/83385 ,  H01L2224/83951 ,  H01L2224/92225 ,  H01L2924/00014 ,  H01L2924/10158 ,  H01L2924/15174 ,  H01L2924/15311 ,  H01L2924/16152 ,  H01L2924/165 ,  H01L2924/181 ,  H01L2924/18161 ,  H01L2924/35121 ,  H01L2224/73204 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2924/00012 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2924/15311 ,  H01L2224/73204 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2924/00012 ,  H01L2924/00014 ,  H01L2224/13099

Abstract: A package includes a package component, a device die over and bonded to the package component, a metal cap having a top portion over the device die, and a thermal interface material between and contacting the device die and the metal cap. The thermal interface material includes a first portion directly over an inner portion of the device die, and a second portion extending directly over a corner region of the device die. The first portion has a first thickness. The second portion has a second thickness greater than the first thickness.