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    CAPACITOR MICROPHONE AND METHOD FOR MANUFACTURING CAPACITOR MICROPHONE
    11.
    发明申请
    CAPACITOR MICROPHONE AND METHOD FOR MANUFACTURING CAPACITOR MICROPHONE 审中-公开
    电容器麦克风和制造电容器麦克风的方法

    公开(公告)号：US20090074211A1

    公开(公告)日：2009-03-19

    申请号：US12065173

    申请日：2006-08-30

    申请人： Seiji Hirade ,  Shingo Sakakibara

    发明人： Seiji Hirade ,  Shingo Sakakibara

    IPC分类号： H04R19/04

    CPC分类号： H04R19/04 ,  H04R31/00

    摘要： A capacitor microphone includes a plate that has a fixed electrode, a diaphragm that has a variable electrode, the plate that vibrates by sound waves, and a spacer that insulates and supports the plate and the diaphragm forming airspace between the fixed electrode and the variable electrode, wherein at least either of the plate or the diaphragm is a semiconductor single-layered film or a metal single-layered film whose specific resistance in a nearby edge close to the spacer is higher than that in a central unit away from the spacer.

    摘要翻译： 电容麦克风包括具有固定电极的板，具有可变电极的振膜，通过声波振动的板，以及在固定电极和可变电极之间隔离并支撑板和隔膜形成空间的间隔件 其中板或隔膜中的至少一个是半导体单层膜或金属单层膜，其在靠近间隔物的附近边缘中的比电阻高于远离间隔物的中心单元中的电阻率。

    SEMICONDUCTOR DEVICE
    12.
    发明申请
    SEMICONDUCTOR DEVICE 审中-公开
    半导体器件

    公开(公告)号：US20070158826A1

    公开(公告)日：2007-07-12

    申请号：US11616125

    申请日：2006-12-26

    申请人： Shingo Sakakibara ,  Hiroshi Saitoh

    发明人： Shingo Sakakibara ,  Hiroshi Saitoh

    IPC分类号： H01L23/34

    CPC分类号： B81B7/0064 ,  H01L2224/48091 ,  H01L2924/3025 ,  H04R1/04 ,  H04R2201/003 ,  H01L2924/00014 ,  H01L2924/00

    摘要： A semiconductor device includes a substrate, a semiconductor chip having a diaphragm, which vibrates in response to sound pressure variations, and a circuit chip that is electrically connected to the semiconductor chip so as to control the semiconductor chip, wherein the semiconductor chip is fixed to the surface of the circuit chip whose backside is mounted on the surface of the substrate. Herein, a plurality of connection terminals formed on the backside of the semiconductor chip are electrically connected to a plurality of electrodes running through the circuit chip. A ring-shaped resin sheet is inserted between the semiconductor chip and the circuit chip. The semiconductor chip and the circuit chip vertically joined together are stored in a shield case having a mount member (e.g., a stage) and a cover member, wherein connection terminals of the circuit chip are exposed to the exterior via through holes of the stage.

    摘要翻译： 半导体器件包括：衬底，具有响应于声压变化而振动的隔膜的半导体芯片;以及与半导体芯片电连接以控制半导体芯片的电路芯片，其中将半导体芯片固定到 其背面安装在基板的表面上的电路芯片的表面。 这里，形成在半导体芯片的背面上的多个连接端子电连接到贯穿电路芯片的多个电极。 在半导体芯片和电路芯片之间插入环状树脂片。 垂直接合在一起的半导体芯片和电路芯片存储在具有安装构件（例如，台架）和盖构件的屏蔽壳体中，其中电路芯片的连接端子通过平台的通孔暴露于外部。

    Semiconductor device
    14.
    发明授权
    Semiconductor device 有权
    半导体器件

    公开(公告)号：US07560811B2

    公开(公告)日：2009-07-14

    申请号：US11634384

    申请日：2006-12-06

    申请人： Shingo Sakakibara ,  Hiroshi Saitoh ,  Toshihisa Suzuki

    发明人： Shingo Sakakibara ,  Hiroshi Saitoh ,  Toshihisa Suzuki

    IPC分类号： H01L29/82

    CPC分类号： B81B7/007 ,  B81B2201/0257 ,  B81B2201/0264 ,  B81C1/0023 ,  H01L2224/45139 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48247 ,  H01L2224/49171 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00011

    摘要： A semiconductor device is designed such that a semiconductor sensor chip having a diaphragm for detecting pressure variations based on the displacement thereof is fixed onto the upper surface of a substrate having a rectangular shape, which is covered with a cover member so as to form a hollow space embracing the semiconductor sensor chip between the substrate and the cover member. Herein, the substrate is sealed with a molded resin such that chip connection leads packaging leads are partially exposed externally of the molded resin; the chip connection leads are electrically connected to the semiconductor sensor chip and are disposed in line along one side of the semiconductor sensor chip; and the packaging leads are positioned opposite the chip connection leads by way of the semiconductor sensor chip. Thus, it is possible to downsize the semiconductor device without substantially changing the size of the semiconductor sensor chip.

    摘要翻译： 半导体器件被设计成使得具有用于检测基于其位移的压力变化的隔膜的半导体传感器芯片被固定到矩形形状的基板的上表面上，该基板被覆盖件覆盖以形成中空 覆盖基板和盖构件之间的半导体传感器芯片的空间。 这里，基板被模制树脂密封，使得芯片连接将封装引线部分地暴露在模制树脂的外部; 芯片连接引线电连接到半导体传感器芯片并且沿着半导体传感器芯片的一侧设置成一行; 并且封装引线通过半导体传感器芯片与芯片连接引线相对定位。 因此，可以实质上改变半导体传感器芯片的尺寸来减小半导体器件的尺寸。

    Microphone package
    15.
    发明申请
    Microphone package 审中-公开
    麦克风包

    公开(公告)号：US20080130935A1

    公开(公告)日：2008-06-05

    申请号：US11903974

    申请日：2007-09-25

    申请人： Akiyoshi Sato ,  Shingo Sakakibara ,  Junya Suzuki

    发明人： Akiyoshi Sato ,  Shingo Sakakibara ,  Junya Suzuki

    IPC分类号： H04R11/04 ,  H01L21/00

    CPC分类号： H04R19/005 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/8592 ,  H01L2924/16151 ,  H01L2924/181 ,  H01L2924/3025 ,  H04R1/2884 ,  H04R19/02 ,  H04R31/00 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

    摘要： A microphone package includes a housing having a cavity and a sound hole allowing the cavity to communicate with the exterior. A microphone chip is mounted on the mounting surface inside of the cavity. The sound hole is opened on the interior surface of the housing positioned opposite to the mounting surface. A resin sealing portion is formed to seal the surrounding area of the microphone chip and the mounting surface. Alternatively, a semiconductor sensor chip and a control circuit chip are mounted on the mounting surface inside of the cavity of the housing and are electrically connected together via bonding wires. Herein, the resin sealing portion entirely seals the control circuit chip and the first joining portions joining the first ends of the bonding wires, while a resin potting portion seals the second joining portions between the electrode pads and the second ends of the bonding wires.

    摘要翻译： 麦克风包包括具有空腔和允许空腔与外部连通的声孔的壳体。 麦克风芯片安装在腔体内部的安装表面上。 在与安装表面相对的壳体的内表面上打开声孔。 形成树脂密封部分以密封麦克风芯片周围区域和安装表面。 或者，半导体传感器芯片和控制电路芯片安装在壳体的腔内的安装面上，并通过接合线电连接在一起。 这里，树脂密封部完全密封控制电路芯片和接合接合线的第一端部的第一接合部分，而树脂封装部分密封电极焊盘和接合线的第二端之间的第二接合部分。

    Microphone package
    16.
    发明申请
    Microphone package 审中-公开
    麦克风包

    公开(公告)号：US20080056524A1

    公开(公告)日：2008-03-06

    申请号：US11899321

    申请日：2007-09-05

    申请人： Shingo Sakakibara ,  Hiroshi Saitoh

    发明人： Shingo Sakakibara ,  Hiroshi Saitoh

    IPC分类号： H04R19/04

    CPC分类号： H04R19/04

    摘要： A microphone package includes a housing, which has a cavity and a sound hole for allowing the cavity to communicate with the exterior, and a microphone chip, which is mounted on the mounting surface so as to detect sound within the cavity. The sound hole is opened in connection with the mounting surface and is surrounded by a projection wall projecting upwardly from the mounting surface at a prescribed position in proximity to the microphone chip.

    摘要翻译： 麦克风封装包括壳体，其具有用于允许空腔与外部连通的空腔和声孔，以及安装在安装表面上以便检测腔内的声音的麦克风芯片。 声孔与安装表面相连开，并且由靠近麦克风芯片的规定位置处从安装表面向上突出的突出壁包围着。

    CAPACITOR MICROPHONE AND DIAPHRAGM THEREFOR
    20.
    发明申请
    CAPACITOR MICROPHONE AND DIAPHRAGM THEREFOR 审中-公开
    电容麦克风和其他胶片

    公开(公告)号：US20070121972A1

    公开(公告)日：2007-05-31

    申请号：US11534915

    申请日：2006-09-25

    申请人： Yukitoshi Suzuki ,  Seiji Hirade ,  Tamito Suzuki ,  Shingo Sakakibara ,  Takahiro Terada

    发明人： Yukitoshi Suzuki ,  Seiji Hirade ,  Tamito Suzuki ,  Shingo Sakakibara ,  Takahiro Terada

    IPC分类号： H04R25/00

    CPC分类号： H04R19/005 ,  B81B3/0072 ,  B81B2201/0257 ,  B81B2203/0127

    摘要： In a capacitor microphone, a diaphragm is positioned opposite to a fixed electrode for covering inner holes of a ring-shaped support, wherein when the diaphragm is deflected to approach the fixed electrode due to electrostatic attraction upon application of a bias voltage, internal stress that occurs on the diaphragm is canceled by compressive stress that is applied to the diaphragm in advance. The diaphragm is formed using a multilayered structure including a first thin film and a second thin film whose internal stress differs from the internal stress of the first thin film, thus adjusting the total internal stress thereof. The diaphragm can be formed in such a way that a center layer having a single-layered structure is sandwiched between first and second coating layers having controlled residual tensions and resistance against hydrofluoric acid.

    摘要翻译： 在电容式麦克风中，隔膜与用于覆盖环状支撑体的内孔的固定电极相对设置，其中当施加偏置电压时由于静电吸引而使膜片偏转到接近固定电极时，内部应力 在隔膜上发生的压力被预先施加到隔膜上的压缩应力消除。 隔膜使用包括第一薄膜和内应力与第一薄膜的内应力不同的第二薄膜的多层结构形成，从而调节其总内应力。 膜片可以以具有单层结构的中心层被夹在具有受控的残余张力和耐氢氟酸的第一和第二涂层之间的方式形成。